Molding SMD Power Inductors LanTu Micro SMS0650-8R2MT High Current Capacity And Low DC Resistance
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Product Description
Molding SMD Power Inductors - SMS0650 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0650 Series offers ultra-high current SMD power inductors designed with a thin profile for low DC resistance and high current capacity. Featuring magnetic shielding for strong anti-electromagnetic interference and an integral construction for high reliability and vibration resistance, these inductors are ideal for high-density installations. Their composite structure minimizes buzz noise, while the low-loss alloy powder die-casting ensures low impedance and small parasitic capacitance, contributing to high efficiency. Suitable for applications up to 3MHz, these inductors are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Origin: SHENZHEN
- Series: SMS0650
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Technical Specifications
| Part No. | Inductance (H) @ 100KHz, 1.0V | Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH) (mm) | Absolute Maximum Voltage (VDC) | Operating Temperature (C) |
|---|---|---|---|---|---|---|---|---|
| SMS0650-R22M | 0.22 | 20% | 1.1 | 40.00 | 30.00 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-R47M | 0.47 | 20% | 3.2 | 24.00 | 20.00 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-R56M | 0.56 | 20% | 3.4 | 20.00 | 18.00 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-R68M | 0.68 | 20% | 3.9 | 18.00 | 17.50 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-R82M | 0.82 | 20% | 4.6 | 17.00 | 17.00 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-1R0M | 1.00 | 20% | 6.5 | 16.50 | 13.00 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-1R5M | 1.50 | 20% | 7.0 | 12.70 | 12.00 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-2R2M | 2.20 | 20% | 11.2 | 12.50 | 11.00 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-3R3M | 3.30 | 20% | 20.0 | 9.00 | 8.50 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-4R7M | 4.70 | 20% | 26.0 | 8.00 | 6.70 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-5R6M | 5.60 | 20% | 31.0 | 7.60 | 5.80 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-6R8M | 6.80 | 20% | 36.5 | 7.30 | 5.50 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-8R2M | 8.20 | 20% | 40.0 | 6.00 | 5.00 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-100M | 10.00 | 20% | 48.0 | 5.50 | 4.70 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-150M | 15.00 | 20% | 77.0 | 5.00 | 4.00 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-220M | 22.00 | 20% | 125.0 | 4.00 | 3.20 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-330M | 33.00 | 20% | 150.0 | 3.30 | 2.80 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-470M | 47.00 | 20% | 260.0 | 2.80 | 2.20 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-680M | 68.00 | 20% | 340.0 | 2.20 | 1.80 | 7.16.65.0 | 30 | -55 to +125 |
| SMS0650-101M | 100.00 | 20% | 595.0 | 2.00 | 1.50 | 7.16.65.0 | 30 | -55 to +125 |
| Shape and Dimensions (mm) | ||||||||
| ITEM | A | B | C | D | E | F | G | H |
| SMS0650 | 7.100.30 | 6.600.20 | 5.00Max | 3.00 Typ | 1.60 Typ | 3.70 | 8.40 | 3.50 |
Product Identification
Format: SMS 0650 [Inductance Value] [Tolerance] [Packaging Type]
- Inductance: e.g., 100 for 10 H
- Tolerance: M (20%)
- Packaging: T (Tape & Reel)
Test Equipment
- Inductance: WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B + WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength | Meet requirements without any loose terminal. | Pulling test (SMT/DIP), Solder paste thickness, Pull Force application. |
| Resistance to Flexure | No visible mechanical damage. | Solder to jig, apply force, Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Harmonic motion, 10-55 Hz, 2 hours in 3 perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature extremes (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402, Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 85~1252, Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Twice reflow soldering, Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjust and confirm according to user's environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali).
- Handling: Avoid touching terminals with bare hands. Handle carefully to prevent damage.
- Terminal Bending: Do not bend terminals excessively.
- Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
- Magnetism: Keep away from magnets or magnetic fields.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions to avoid overheating.
- Thermal Design: Account for self-heating when power is ON.
- Non-Magnetic Shield Type: Careful layout is needed to avoid malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina