Power supply Shielded SMD Inductors LanTu Micro SDRI127-3R3NT with wide inductance values and low DC resistance
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Shielded SMD Power Inductors - SDRI127 Series
Product Overview
The SDRI127 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. These inductors feature a closed magnetic circuit design that minimizes leakage flux, high saturation current, and low DC resistance. Their highly accurate dimensions ensure suitability for automatic mounting processes. With a wide range of inductance values and package sizes, they are compliant with RoHS, Halogen Free, and REACH standards, making them ideal for use in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO
- Origin: SHENZHEN, CHINA
- Series: SDRI127
- Type: Shielded SMD Power Inductors (Closed magnetic circuit)
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
General Specifications:
| Feature | Description |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent LCR meter |
| Test Equipment (Current) | HP4284+42841A or equivalent |
| Test Equipment (Q Factor) | HP4285A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification:
| Component | Description |
|---|---|
| Type | SDRI |
| Outer Dimensions (LWH) | 127 (12.512.58.0 mm) |
| Inductance | e.g., 470 (47 H) |
| Inductance Tolerance | J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Packing | T: Tape & Reel, B: Bulk Package |
Electrical Characteristics (SDRI127 Series):
| Part No. | Inductance (H) @0A | Tolerance | Test Freq. (L) | Q Min. @ Test Freq. | DCR () Max. | Isat (A) Max. | Irms (A) Max. | |
|---|---|---|---|---|---|---|---|---|
| SDRI127-1R0N | 1.0 | 30% | 100KHz | 20 | 0.009 | 26.00 | 10.00 | |
| SDRI127-2R2N | 2.2 | 30% | 100KHz | 20 | 0.012 | 21.00 | 8.00 | |
| SDRI127-2R7N | 2.7 | 30% | 100KHz | 20 | 0.013 | 19.00 | 8.00 | |
| SDRI127-3R3N | 3.3 | 30% | 100KHz | 20 | 0.013 | 16.00 | 8.00 | |
| SDRI127-3R9N | 3.9 | 30% | 100KHz | 20 | 0.013 | 14.00 | 7.50 | |
| SDRI1274R7N | 4.7 | 30% | 100KHz | 30 | 0.016 | 12.00 | 6.80 | |
| SDRI127-6R1N | 6.1 | 30% | 100KHz | 30 | 0.018 | 11.50 | 6.60 | |
| SDRI127-6R8N | 6.8 | 30% | 1 | 30 | 0.019 | 10.50 | 6.60 | |
| SDRI127-7R6N | 7.6 | 30% | 100KHz | 30 | 0.020 | 10.00 | 5.90 | |
| SDRI127-8R2N | 8.2 | 30% | 100KHz | 30 | 0.020 | 9.50 | 5.60 | |
| SDRI127-100N | 10 | 30% | 100KHz | 35 | 0.021 | 9.00 | 5.40 | |
| SDRI127-120M | 12 | 20% | 100KHz | 35 | 0.240 | 8.50 | 4.90 | |
| SDRI127-150M | 15 | 20% | 100KHz | 35 | 0.027 | 8.00 | 4.50 | |
| SDRI127-180M | 18 | 20% | 100KHz | 35 | 0.039 | 7.50 | 3.90 | |
| SDRI127-220M | 22 | 20% | 100KHz | 35 | 0.043 | 7.00 | 3.60 | |
| SDRI127-270M | 27 | 20% | 100KHz | 35 | 0.046 | 6.50 | 3.40 | |
| SDRI127-330M | 33 | 20% | 100KHz | 35 | 0.065 | 5.50 | 3.00 | |
| SDRI127-390M | 39 | 20% | 100KHz | 35 | 0.072 | 5.00 | 2.75 | |
| SDRI127-470M | 47 | 20% | 100KHz | 35 | 0.100 | 4.60 | 2.50 | |
| SDRI127-560M | 56 | 20% | 100KHz | 35 | 0.110 | 4.40 | 2.35 | |
| SDRI127-680M | 68 | 20% | 100KHz | 35 | 0.140 | 4.00 | 2.10 | |
| SDRI127-820M | 82 | 20% | 100KHz | 35 | 0.160 | 3.80 | 1.95 | |
| SDRI127-101M | 100 | 20% | 100KHz | 40 | 0.220 | 3.50 | 1.70 | |
| SDRI127-121M | 120 | 20% | 100KHz | 40 | 0.250 | 3.00 | 1.60 | |
| SDRI127-151M | 150 | 20% | 100KHz | 40 | 0.280 | 2.70 | 1.42 | |
| SDRI127-181M | 180 | 20% | 100KHz | 40 | 0.350 | 2.50 | 1.30 | |
| SDRI127-221M | 220 | 20% | 100KHz | 40 | 0.390 | 2.00 | 1.16 | |
| SDRI127-271M | 270 | 20% | 100KHz | 40 | 0.560 | 1.95 | 1.06 | |
| SDRI127-331M | 330 | 20% | 100KHz | 40 | 0.640 | 1.90 | 0.95 | |
| SDRI127-391M | 390 | 20% | 100KHz | 40 | 0.700 | 1.65 | 0.88 | |
| SDRI127-471M | 470 | 20% | 100KHz | 40 | 0.980 | 1.50 | 0.79 | |
| SDRI127-561M | 560 | 20% | 100KHz | 40 | 1.070 | 1.40 | 0.73 | |
| SDRI127-681M | 680 | 20% | 100KHz | 40 | 1.460 | 1.30 | 0.67 | |
| SDRI127-821M | 820 | 20% | 100KHz | 40 | 1.640 | 1.10 | 0.60 | |
| SDRI127-102M | 1000 | 20% | 100KHz | 40 | 1.820 | 1.00 | 0.55 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Dimensions (mm):
| Part No. | A (Max) | B (Max) | C (Max) | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SDRI127 | 12.5 | 12.5 | 8.0 | 5.0 | 7.6 | 2.9 | 7.0 | 5.4 |
Packaging:
| Part No. | Tape Width (mm) | Pitch (mm) | Hole Dia. (mm) | Reel Dia. (mm) | Reel Quantity (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|
| SDRI127 | 24 | 16 | 11.5 | 24.4 | 500 | 1000 | 4000 |
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength | Meet requirements without loose terminal. | SMT: Pulling test (force varies by terminal area). DIP: Pulling test (force varies by terminal diameter). Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Resistance to Flexure | No visible mechanical damage. | Solder to jig, apply flexure (2mm) at 0.5mm/sec for 30 sec. |
| Dropping | No case deformation or change in appearance. No short/open. | Drop packaged products from 1m high (1 angle, 3 ridges, 6 surfaces), twice each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin, 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. | Solder to jig, subjected to simple harmonic motion (1.5mm amplitude, 10-55 Hz) for 2 hours in 3 perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. | 100 cycles of (85~125 for T time) to (-55~40 for T time). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. | Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | No smoke, no peculiar smell, no fire during test. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are provided as a guideline. Users should adjust and confirm according to their specific environment and equipment.
Reminders for Using These Products:
- Storage: Within 12 months, under conditions (5~40C, 35~65% RH). Solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals with bare hands to prevent solderability issues. Handle with care to prevent damage from dropping.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is on; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Careful coil layout is required on the PCB to prevent malfunctions due to magnetic interference.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina