Magnetic Resin Shielded LanTu Micro SNR3015-470MT Power Inductor with Automatic Assembly and Low Buzz Noise
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Product Description
Product Overview
The SNR3015 Series is an automatic assembly compatible, magnetic resin shielded SMD power inductor designed to minimize buzz noise to ultra-low levels. It features a closed magnetic circuit for reduced leakage flux and enhanced EMI resistance, along with a metallization on the ferrite core for excellent shock resistance and durability. This series offers large current handling capabilities with low DC resistance, contributing to space and power savings on PCBs. It is widely used in applications such as LED backlights, flat-screen TVs, notebooks, servers, graphics cards, automotive systems, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR3015
- Construction: Magnetic resin shielded, automatic assembly
- Certifications: RoHS, Halogen Free, REACH Compliance
- Core Material: Ferrite (implied by metallization on ferrite core)
- Magnetic Circuit: Closed
Technical Specifications
| Part Number | Inductance (H) | Tolerance | Frequency | Test Voltage | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|---|
| SNR3015-R47M | 0.47 | 20% | 100KHz | 1.0V | 0.024 | 0.035 | 2.50 | 2.60 |
| SNR3015-1R0M | 1.0 | 20% | 100KHz | 1.0V | 0.030 | 0.039 | 2.32 | 2.35 |
| SNR3015-1R5M | 1.5 | 20% | 100KHz | 1.0V | 0.050 | 0.065 | 2.30 | 1.70 |
| SNR3015-1R8M | 1.8 | 20% | 100KHz | 1.0V | 0.050 | 0.065 | 1.75 | 1.70 |
| SNR3015-2R2M | 2.2 | 20% | 100KHz | 1.0V | 0.060 | 0.078 | 1.60 | 1.60 |
| SNR3015-3R3M | 3.3 | 20% | 100KHz | 1.0V | 0.080 | 0.104 | 1.32 | 1.36 |
| SNR3015-4R7M | 4.7 | 20% | 100KHz | 1.0V | 0.125 | 0.165 | 1.10 | 1.09 |
| SNR3015-6R8M | 6.8 | 20% | 100KHz | 1.0V | 0.200 | 0.260 | 0.85 | 0.85 |
| SNR3015-100M | 10 | 20% | 100KHz | 1.0V | 0.250 | 0.325 | 0.72 | 0.77 |
| SNR3015-150M | 15 | 20% | 100KHz | 1.0V | 0.350 | 0.455 | 0.66 | 0.65 |
| SNR3015-220M | 22 | 20% | 100KHz | 1.0V | 0.460 | 0.598 | 0.52 | 0.57 |
| SNR3015-330M | 33 | 20% | 100KHz | 1.0V | 0.820 | 1.066 | 0.44 | 0.43 |
| SNR3015-470M | 47 | 20% | 100KHz | 1.0V | 1.250 | 1.625 | 0.35 | 0.35 |
| Inductance Tolerance Codes | Packing Codes |
|---|---|
| J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | B: Bulk Package, T: Tape & Reel |
| External Dimensions (LWH) (mm) | Type | Product Identification Example |
|---|---|---|
| 3.03.01.5 | SNR (Shielded SMD Power Inductors) | SNR3015-100M T (for 10 H, 20% tolerance, Tape & Reel) |
| Environmental Data | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Shape and Dimensions (mm) | A | B | C (Max) | D | E | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| SNR3015 | 3.00.3 | 3.00.3 | 1.5 | 1.50.2 | 2.50.2 | 0.8 | 1.5 | 2.7 |
| Packaging Quantity | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|
| SNR3015 | 2000 | 20,000 | 80,000 |
| Reliability Test Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test based on GB/T 2423.60-2008 |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pulling test based on GB/T 2423.60-2008 |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997, Flexure: 2mm |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018, Drop from 1m height |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005, Solder temperature: 2402, Duration: 3 sec. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019, Frequency 10-55 Hz, Amplitude 1.5mm |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na, 100 cycles |
| Low Temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab, Temperature: -402, Duration: 962 hours |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb, Temperature: 852, Duration: 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.3-2016, Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | GJB 360B-2009, Peak temperature: 260+0/-5, twice |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | IEC 68-2-45:1993, Dip into IPA solvent for 50.5Min |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristic is normal after test. | JIS C5311-6.13, Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristic is normal after test. | MIL-STD-202G Method 301, DC1000V, Current: 1mA, Time: 1Min. |
Usage Precautions
- Storage: Within 12 months, under 5~40C and 35~65% RH.
- Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Do not touch terminals directly with bare hands to prevent solderability issues.
- Handle products carefully to avoid damage from dropping or improper removal.
- Do not bend terminals excessively to prevent wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Keep away from magnets or magnetic objects.
- Preheating: Required before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
- Allow sufficient thermal design margin for self-heating when power is on.
- For non-magnetic shielded types, careful coil layout is needed to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina