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Shielded SMD Power Inductors LanTu Micro SDRH105R-331MT Designed for Demanding Electronic Applications

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Product Description

Product Overview

The SDRH105R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in demanding electronic applications. Featuring a closed magnetic circuit design that minimizes leakage flux, these inductors offer high saturation current and low DC resistance. Their highly accurate dimensions ensure suitability for automatic mounting processes. Available in various package sizes and a wide inductance range, they comply with RoHS, Halogen Free, and REACH standards. These inductors are ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SDRH105R
  • Type: Shielded SMD Power Inductors
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: Shenzhen, China (implied by company name and location)

Technical Specifications

General Specifications:

Parameter Value
Operating Temperature -40 to +125 (including coil self-temperature rise)
Test Frequency (Inductance) 100KHz
Test Equipment (Inductance) HP4284A, HP4285A or equivalent LCR meter
Test Equipment (Current) HP4284+42841A
Test Equipment (DCR) Chroma 16502 or equivalent
Saturation Current Definition DC current at which inductance drops 30% from its value without current.
Temperature Rise Current Definition The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current Definition The lesser value between Isat and Irms.

Product Identification:

Component Description
Type: SDRH (Shielded SMD Power Inductors)
Outer Dimensions (LWH) (mm): 105R (10.310.55.0)
Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Inductance Value: e.g., 100 (for 10 H)
Packing: T (Tape & Reel), B (Bulk Package)

Dimensions:

Part No. A (Max) B (Max) C (Max) D E F H I J
SDRH105R 10.3 10.5 5.0 7.7 3.0 1.2 3.6 1.7 7.3

Electrical Characteristics:

Part No. Inductance (H) Tol. DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max
SDRH105R-3R3N 3.3 30% 0.013 9.50 6.50
SDRH105R-4R7N 4.7 30% 0.016 9.20 6.30
SDRH105R-6R8N 6.8 30% 0.020 7.00 6.00
SDRH105R-8R2N 8.2 30% 0.023 5.50 5.00
SDRH105R-100N 10 30% 0.250 5.10 4.40
SDRH105R-120N 12 30% 0.032 4.90 4.00
SDRH105R-150N 15 30% 0.040 4.20 3.60
SDRH105R-180M 18 20% 0.046 3.70 3.40
SDRH105R-220M 22 20% 0.058 3.30 3.20
SDRH105R-270M 27 20% 0.650 3.20 3.00
SDRH105R-330M 33 20% 0.810 2.70 2.60
SDRH105R-390M 39 20% 0.103 2.48 2.50
SDRH105R-470M 47 20% 0.122 2.35 2.30
SDRH105R-560M 56 20% 0.144 2.30 2.10
SDRH105R-680M 68 20% 0.193 2.00 1.90
SDRH105R-820M 82 20% 0.219 1.80 1.60
SDRH105R-101M 100 20% 0.247 1.50 1.35
SDRH105R-121M 120 20% 0.298 1.40 1.18
SDRH105R-151M 150 20% 0.355 1.30 1.10
SDRH105R-181M 180 20% 0.393 1.20 1.00
SDRH105R-221M 220 20% 0.483 1.08 0.94
SDRH105R-271M 270 20% 0.632 0.88 0.80
SDRH105R-331M 330 20% 0.780 0.85 0.73
SDRH105R-391M 390 20% 0.957 0.78 0.70
SDRH105R-471M 470 20% 1.220 0.71 0.54
SDRH105R-561M 560 20% 1.352 0.65 0.52
SDRH105R-681M 680 20% 1.519 0.59 0.51
SDRH105R-821M 820 20% 1.694 0.51 0.48
SDRH105R-102M 1000 20% 1.946 0.49 0.42

Packaging Specifications:

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SDRH105R 24 16 11.5 24.4 60 13 330 800 1600 6400

Cover Tape Peel Off Condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing:

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test based on terminal area. Solder paste thickness: 0.12mm. Speed: 1.0mm/s. Keep time: 101s.
Terminal Strength (DIP) Meet requirements without any loose terminal. Applied force based on terminal diameter. Duration: 10sec.
Resistance to Flexure No visible mechanical damage. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping No case deformation or change in appearance. No short and no open. Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice in each direction.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Frequency varied between 10 and 55 Hz. Applied for 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec.
Low temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: -55~-402. Duration: 962 hours.
High temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: 85~1252. Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. Reflow soldering twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip into IPA solvent for 50.5Min, dry for 5Min, brush 10 times.
Overload test No smoke, no peculiar smell, no fire during test. Characteristics normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test No breakdown during test. Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min (for parts with two coils).

Recommended Reflow Soldering Curve:

The recommended reflow conditions are provided as a guideline and may require adjustment based on specific user equipment and process conditions.

Reminders for Using These Products:

  • Storage period: within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
  • Avoid use and storage in corrosive environments (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals by bare hands to prevent soldering inhibition.
  • Handle products carefully to prevent damage from dropping or improper removal.
  • Do not bend terminals with excessive stress to avoid wire fracture.
  • Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Allow for sufficient thermal design margin due to self-heating when power is on.
  • For non-magnetic shielded types, careful coil layout is required on the PCB to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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