Shielded SMD Power Inductors LanTu Micro SDRH105R-331MT Designed for Demanding Electronic Applications
Product Overview
The SDRH105R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in demanding electronic applications. Featuring a closed magnetic circuit design that minimizes leakage flux, these inductors offer high saturation current and low DC resistance. Their highly accurate dimensions ensure suitability for automatic mounting processes. Available in various package sizes and a wide inductance range, they comply with RoHS, Halogen Free, and REACH standards. These inductors are ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SDRH105R
- Type: Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
General Specifications:
| Parameter | Value |
|---|---|
| Operating Temperature | -40 to +125 (including coil self-temperature rise) |
| Test Frequency (Inductance) | 100KHz |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent LCR meter |
| Test Equipment (Current) | HP4284+42841A |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
| Saturation Current Definition | DC current at which inductance drops 30% from its value without current. |
| Temperature Rise Current Definition | The actual value of DC current when the temperature rise is T 40 (Ta=25). |
| Rated DC Current Definition | The lesser value between Isat and Irms. |
Product Identification:
| Component | Description |
|---|---|
| Type: SDRH (Shielded SMD Power Inductors) | |
| Outer Dimensions (LWH) (mm): 105R (10.310.55.0) | |
| Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |
| Inductance Value: e.g., 100 (for 10 H) | |
| Packing: T (Tape & Reel), B (Bulk Package) |
Dimensions:
| Part No. | A (Max) | B (Max) | C (Max) | D | E | F | H | I | J |
|---|---|---|---|---|---|---|---|---|---|
| SDRH105R | 10.3 | 10.5 | 5.0 | 7.7 | 3.0 | 1.2 | 3.6 | 1.7 | 7.3 |
Electrical Characteristics:
| Part No. | Inductance (H) | Tol. | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|
| SDRH105R-3R3N | 3.3 | 30% | 0.013 | 9.50 | 6.50 |
| SDRH105R-4R7N | 4.7 | 30% | 0.016 | 9.20 | 6.30 |
| SDRH105R-6R8N | 6.8 | 30% | 0.020 | 7.00 | 6.00 |
| SDRH105R-8R2N | 8.2 | 30% | 0.023 | 5.50 | 5.00 |
| SDRH105R-100N | 10 | 30% | 0.250 | 5.10 | 4.40 |
| SDRH105R-120N | 12 | 30% | 0.032 | 4.90 | 4.00 |
| SDRH105R-150N | 15 | 30% | 0.040 | 4.20 | 3.60 |
| SDRH105R-180M | 18 | 20% | 0.046 | 3.70 | 3.40 |
| SDRH105R-220M | 22 | 20% | 0.058 | 3.30 | 3.20 |
| SDRH105R-270M | 27 | 20% | 0.650 | 3.20 | 3.00 |
| SDRH105R-330M | 33 | 20% | 0.810 | 2.70 | 2.60 |
| SDRH105R-390M | 39 | 20% | 0.103 | 2.48 | 2.50 |
| SDRH105R-470M | 47 | 20% | 0.122 | 2.35 | 2.30 |
| SDRH105R-560M | 56 | 20% | 0.144 | 2.30 | 2.10 |
| SDRH105R-680M | 68 | 20% | 0.193 | 2.00 | 1.90 |
| SDRH105R-820M | 82 | 20% | 0.219 | 1.80 | 1.60 |
| SDRH105R-101M | 100 | 20% | 0.247 | 1.50 | 1.35 |
| SDRH105R-121M | 120 | 20% | 0.298 | 1.40 | 1.18 |
| SDRH105R-151M | 150 | 20% | 0.355 | 1.30 | 1.10 |
| SDRH105R-181M | 180 | 20% | 0.393 | 1.20 | 1.00 |
| SDRH105R-221M | 220 | 20% | 0.483 | 1.08 | 0.94 |
| SDRH105R-271M | 270 | 20% | 0.632 | 0.88 | 0.80 |
| SDRH105R-331M | 330 | 20% | 0.780 | 0.85 | 0.73 |
| SDRH105R-391M | 390 | 20% | 0.957 | 0.78 | 0.70 |
| SDRH105R-471M | 470 | 20% | 1.220 | 0.71 | 0.54 |
| SDRH105R-561M | 560 | 20% | 1.352 | 0.65 | 0.52 |
| SDRH105R-681M | 680 | 20% | 1.519 | 0.59 | 0.51 |
| SDRH105R-821M | 820 | 20% | 1.694 | 0.51 | 0.48 |
| SDRH105R-102M | 1000 | 20% | 1.946 | 0.49 | 0.42 |
Packaging Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRH105R | 24 | 16 | 11.5 | 24.4 | 60 | 13 | 330 | 800 | 1600 | 6400 |
Cover Tape Peel Off Condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal area. Solder paste thickness: 0.12mm. Speed: 1.0mm/s. Keep time: 101s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter. Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency varied between 10 and 55 Hz. Applied for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 85~1252. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Reflow soldering twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | No smoke, no peculiar smell, no fire during test. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min (for parts with two coils). |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are provided as a guideline and may require adjustment based on specific user equipment and process conditions.
Reminders for Using These Products:
- Storage period: within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
- Avoid use and storage in corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands to prevent soldering inhibition.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Allow for sufficient thermal design margin due to self-heating when power is on.
- For non-magnetic shielded types, careful coil layout is required on the PCB to prevent malfunctions due to magnetic interference.
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