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High Precision LanTu Micro SDRI125-681MT Shielded SMD Power Inductors for DC DC Converters and Power Supplies

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Product Description

Shielded SMD Power Inductors - SDRI125 Series

Product Overview

The SDRI125 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DCR, these inductors offer high-precision dimensions suitable for automatic mounting. They are available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards. Ideal for DC/DC converters and power supplies in VTRs, LCD televisions, notebook PCs, and portable communication equipment.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SDRI125
  • Type: Shielded SMD Power Inductors
  • Magnetic Circuit Design: Closed magnetic circuit
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Mounting Type: SMD (Surface Mount Device)
  • Packaging Options: Bulk Package (B), Tape & Reel (T)

Technical Specifications

General Specifications:

Item Specification
Operating Temperature -40 to +125 (Including coils self-temperature rise)
Test Equipment (Inductance) HP4284A, HP4285A or equivalent LCR meter
Test Equipment (Current) HP4284+42841A or equivalent
Test Equipment (Q Factor) HP4285A or equivalent
Test Equipment (DCR) Chroma 16502 or equivalent

Product Identification:

Component Description
Type SDRI (Shielded SMD Power Inductors)
Size 125 (12.312.36.0 mm)
Inductance e.g., 470 (47 H)
Inductance Tolerance J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing B: Bulk Package, T: Tape & Reel

Electrical Characteristics (SDRI125 Series):

Part No. Inductance (H) @ 0A Tolerance Test Freq. (Min) Q Factor (Min) @ Test Freq. DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max
SDRI125-1R0N 1.0 30% 100KHz 20 @ 1MHz 0.010 15.80 8.00
SDRI125-2R2N 2.2 30% 100KHz 20 @ 1MHz 0.014 13.50 7.80
SDRI125-2R4N 2.4 30% 100KHz 20 @ 1MHz 0.014 12.00 7.50
SDRI125-3R3N 3.3 30% 100KHz 20 @ 1MHz 0.017 10.50 6.80
SDRI125-4R7N 4.7 30% 100KHz 30 @ 1MHz 0.020 9.50 5.60
SDRI125-5R8N 5.8 30% 100KHz 30 @ 1MHz 0.021 8.60 5.20
SDRI125-8R2N 8.2 30% 100KHz 30 @ 1MHz 0.023 7.00 4.40
SDRI125-100N 10 30% 100KHz 35 @ 1MHz 0.025 6.50 4.00
SDRI125-120M 12 20% 100KHz 35 @ 1MHz 0.027 6.00 3.50
SDRI125-150M 15 20% 100KHz 35 @ 1MHz 0.030 5.40 3.30
SDRI125-180M 18 20% 100KHz 35 @ 1MHz 0.034 4.90 3.00
SDRI125-220M 22 20% 100KHz 35 @ 1MHz 0.036 4.70 2.80
SDRI125-270M 27 20% 100KHz 35 @ 1MHz 0.051 4.00 2.30
SDRI125-330M 33 20% 100KHz 35 @ 1MHz 0.057 3.58 2.10
SDRI125-390M 39 20% 100KHz 35 @ 1MHz 0.068 3.30 2.00
SDRI125-470M 47 20% 100KHz 35 @ 1MHz 0.075 3.20 1.80
SDRI125-560M 56 20% 100KHz 35 @ 1MHz 0.110 2.80 1.70
SDRI125-680M 68 20% 100KHz 35 @ 1MHz 0.120 2.50 1.50
SDRI125-820M 82 20% 100KHz 35 @ 1MHz 0.140 2.30 1.40
SDRI125-101M 100 20% 100KHz 40 @ 0.796MHz 0.160 1.90 1.30
SDRI125-121M 120 20% 100KHz 40 @ 0.796MHz 0.170 1.80 1.10
SDRI125-151M 150 20% 100KHz 40 @ 0.796MHz 0.230 1.70 1.00
SDRI125-181M 180 20% 100KHz 40 @ 0.796MHz 0.290 1.60 0.90
SDRI125-221M 220 20% 100KHz 40 @ 0.796MHz 0.400 1.45 0.80
SDRI125-271M 270 20% 100KHz 40 @ 0.796MHz 0.460 1.20 0.75
SDRI125-331M 330 20% 100KHz 40 @ 0.796MHz 0.510 1.15 0.68
SDRI125-391M 390 20% 100KHz 40 @ 0.796MHz 0.690 1.10 0.65
SDRI125-471M 470 20% 100KHz 40 @ 0.796MHz 0.770 0.94 0.58
SDRI125-561M 560 20% 100KHz 40 @ 0.796MHz 0.860 0.90 0.54
SDRI125-681M 680 20% 100KHz 40 @ 0.796MHz 1.200 0.70 0.48
SDRI125-821M 820 20% 100KHz 40 @ 0.796MHz 1.340 0.55 0.40
SDRI125-102M 1000 20% 100KHz 40 @ 0.796MHz 1.530 0.44 0.35

Definitions:

  • Saturation Current: DC current at which inductance drops 30% from its value without current.
  • Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value of Isat or Irms.
  • Note: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect part temperature. Part temperature should be verified in the end application.

Dimensions (mm):

Part No. A (Max) B (Max) C (Max) D E F G H
SDRI125 12.5 12.5 6.0 5.0 7.6 2.9 7.0 5.4

Recommended Land Pattern (mm):

[Image of Recommended Land Pattern would be placed here if available]

Packaging Specifications:

Item Dimension (mm) Quantity (PCS)
Tape Dimension W 24 REEL (500)
Tape Dimension P 16 Inside Box (1000)
Tape Dimension H 11.5 Outside Carton (4000)
Reel Dimension A 24.4
Reel Dimension B 100
Reel Dimension C 13
Reel Dimension D 330

Cover tape peel off condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Recommended Reflow Soldering Curve:

[Image of Recommended Reflow Soldering Curve would be placed here if available]

Note: The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their specific environment/equipment.

Reminders for Using These Products:

  • Storage: Within 12 months. Conditions: temperature 5~40C, humidity 35~65% RH or less. Soldering of terminal electrodes may deteriorate if storage period elapses.
  • Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands as oil secretions may inhibit soldering. Handle products carefully to prevent damage from dropping or inappropriate removal.
  • Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
  • Cleaning: Do not rinse coils by yourself. Contact SXN if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
  • Soldering Correction: Post-mounting soldering corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Self-Heating: Allow sufficient margin for thermal design due to self-heating when power is ON.
  • Non-Magnetic Shield Type: Carefully lay out the coil for PCB design to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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