Shielded SMD Power Inductors - SDRI129 Series

Product Overview

The SDRI129 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DCR, these inductors offer high accuracy dimensions suitable for automatic mounting. They are available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards. Ideal for DC/DC converters, power supplies in VTRs, LCD televisions, notebook PCs, and portable communication equipment.

Product Attributes

• Brand: LANTU MICRO ELECTRIC TECHNOLOGY
• Series: SDRI129 Series
• Type: Shielded SMD Power Inductors
• Certifications: RoHS, Halogen Free, REACH Compliance
• Origin: Shenzhen, China
• Magnetic Circuit Design: Closed magnetic circuit

Technical Specifications

Environmental Data:

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

• Inductance (L): HP4284A, HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284A+42841A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification Example: SDRI 129 220 M T

• Type: SDRI (Shielded SMD Power Inductors)
• Series: 129
• Inductance: 220 (22 H)
• Tolerance: M (20%)
• Packing: T (Tape & Reel) / B (Bulk Package)

Shape and Dimensions:

(Dimensions are in mm)

Packaging:

• Tape and Reel Specifications:
• Tape Dimension (mm): W=24, P=16, H=11.5
• Reel Dimensions (mm): A=24.4
• Packing Quantity:
• REEL (PCS): 400
• Inside Box (PCS): 800
• Outside Carton (PCS): 3200

Cover tape peel off condition:

• Cover tape peel force: 10 to 120g
• Noodle strip peeling angle: 165 to 180

Reliability Testing:

• Terminal Strength (SMT & DIP)
• Resistance to Flexure
• Dropping Test
• Solderability
• Vibration Test
• Thermal Shock
• Low Temperature Storage
• High Temperature Storage
• Damp Heat (Steady States)
• Heat endurance of Reflow soldering
• Resistance to solvent test
• Overload test
• Voltage resistance test

Recommended Reflow Soldering Curve:

(Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific equipment and process conditions.)

Reminders for Using These Products:

• Storage Period: within 12 months. Conditions: temperature 5~40C, humidity 35~65% RH or less.
• Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
• Do not touch electrodes directly with bare hands.
• Handle products carefully to prevent damage.
• Do not bend terminals excessively.
• Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Keep away from magnets or magnetic fields.
• Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions to avoid overheating.
• Allow for sufficient thermal design margin due to self-heating when power is ON.
• For non-magnetic shield types, careful coil layout is required to prevent malfunctions due to magnetic interference.