High precision LanTu Micro SDRI125-3R3NT shielded SMD power inductors designed for power supply applications
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Product Description
Product Overview
The SDRI125 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DC resistance, featuring a closed magnetic circuit to minimize leakage. These inductors offer high-precision dimensions suitable for automatic mounting, a wide range of package sizes, and inductance values. They are RoHS, Halogen Free, and REACH compliant. Applications include power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SDRI125 Series
- Type: Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: SHENZHEN, China
Technical Specifications
General Specifications:
| Feature | Description |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent LCR meter |
| Test Equipment (Current) | HP4284+42841A or equivalent |
| Test Equipment (Q Factor) | HP4285A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification:
| Component | Description |
|---|---|
| SDRI 125 | Type (Shielded SMD Power Inductors) |
| 470 | Inductance (e.g., 47 uH) |
| M | Inductance Tolerance (e.g., 20%) |
| T | Packing (Tape & Reel) |
| 125 | External Dimensions (LWH) (mm) (12.312.36.0) |
Available Inductance Tolerances: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Available Packing: B (Bulk Package), T (Tape & Reel)
Electrical Characteristics:
| Part No. | Inductance (H) @0A | Tolerance | Test Freq (L) | Test Freq (Q) | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SDRI125-1R0N | 1.0 | 30% | 100KHz | 1MHz | 0.010 | 15.80 | 8.00 |
| SDRI125-2R2N | 2.2 | 30% | 100KHz | 1MHz | 0.014 | 13.50 | 7.80 |
| SDRI125-2R4N | 2.4 | 30% | 100KHz | 1MHz | 0.014 | 12.00 | 7.50 |
| SDRI125-3R3N | 3.3 | 30% | 100KHz | 1MHz | 0.017 | 10.50 | 6.80 |
| SDRI125-4R7N | 4.7 | 30% | 100KHz | 1MHz | 0.020 | 9.50 | 5.60 |
| SDRI125-5R8N | 5.8 | 30% | 100KHz | 1MHz | 0.021 | 8.60 | 5.20 |
| SDRI125-8R2N | 8.2 | 30% | 100KHz | 1MHz | 0.023 | 7.00 | 4.40 |
| SDRI125-100N | 10 | 30% | 100KHz | 1MHz | 0.025 | 6.50 | 4.00 |
| SDRI125-120M | 12 | 20% | 100KHz | 1MHz | 0.027 | 6.00 | 3.50 |
| SDRI125-150M | 15 | 20% | 100KHz | 1MHz | 0.030 | 5.40 | 3.30 |
| SDRI125-180M | 18 | 20% | 100KHz | 1MHz | 0.034 | 4.90 | 3.00 |
| SDRI125-220M | 22 | 20% | 100KHz | 1MHz | 0.036 | 4.70 | 2.80 |
| SDRI125-270M | 27 | 20% | 100KHz | 1MHz | 0.051 | 4.00 | 2.30 |
| SDRI125-330M | 33 | 20% | 100KHz | 1MHz | 0.057 | 3.58 | 2.10 |
| SDRI125-390M | 39 | 20% | 100KHz | 1MHz | 0.068 | 3.30 | 2.00 |
| SDRI125-470M | 47 | 20% | 100KHz | 1MHz | 0.075 | 3.20 | 1.80 |
| SDRI125-560M | 56 | 20% | 100KHz | 1MHz | 0.110 | 2.80 | 1.70 |
| SDRI125-680M | 68 | 20% | 100KHz | 1MHz | 0.120 | 2.50 | 1.50 |
| SDRI125-820M | 82 | 20% | 100KHz | 1MHz | 0.140 | 2.30 | 1.40 |
| SDRI125-101M | 100 | 20% | 100KHz | 0.796MHz | 0.160 | 1.90 | 1.30 |
| SDRI125-121M | 120 | 20% | 100KHz | 0.796MHz | 0.170 | 1.80 | 1.10 |
| SDRI125-151M | 150 | 20% | 100KHz | 0.796MHz | 0.230 | 1.70 | 1.00 |
| SDRI125-181M | 180 | 20% | 100KHz | 0.796MHz | 0.290 | 1.60 | 0.90 |
| SDRI125-221M | 220 | 20% | 100KHz | 0.796MHz | 0.400 | 1.45 | 0.80 |
| SDRI125-271M | 270 | 20% | 100KHz | 0.796MHz | 0.460 | 1.20 | 0.75 |
| SDRI125-331M | 330 | 20% | 100KHz | 0.796MHz | 0.510 | 1.15 | 0.68 |
| SDRI125-391M | 390 | 20% | 100KHz | 0.796MHz | 0.690 | 1.10 | 0.65 |
| SDRI125-471M | 470 | 20% | 100KHz | 0.796MHz | 0.770 | 0.94 | 0.58 |
| SDRI125-561M | 560 | 20% | 100KHz | 0.796MHz | 0.860 | 0.90 | 0.54 |
| SDRI125-681M | 680 | 20% | 100KHz | 0.796MHz | 1.200 | 0.70 | 0.48 |
| SDRI125-821M | 820 | 20% | 100KHz | 0.796MHz | 1.340 | 0.55 | 0.40 |
| SDRI125-102M | 1000 | 20% | 100KHz | 0.796MHz | 1.530 | 0.44 | 0.35 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Saturation Current (Isat) and Temperature Rise Current (Irms).
Dimensions (mm):
| Part No. | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SDRI125 | 12.5 Max | 12.5 Max | 6.0 Max | 5.0 | 7.6 | 2.9 | 7.0 | 5.4 |
Packaging Specifications:
| Part No. | Tape Dimension (W x P x H) | Reel Dimensions (A x B x C x D) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|
| SDRI125 | 24 x 16 x 11.5 | 24.4 x 100 x 13 x 330 | 500 | 1000 | 4000 |
Cover tape peel off condition:
- a) Cover tape peel force shall be 10 to 120g
- b) Noodle strip peeling angle 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal area; Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (0.35mm to >1.25mm). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency varied between 10 and 55 Hz. Applied for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature cycling between high (85~125) and low (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products:
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands as oil secretions may inhibit soldering. Handle products carefully to prevent damage from dropping or inappropriate removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils by yourself; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Account for self-heating (temperature increase) when power is ON in thermal design.
- Layout (Non-magnetic Shield Type): Carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina