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Durable power inductor LanTu Micro SNR8040-681MT with metallized ferrite core and low DC resistance

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Product Description

Product Overview

The SNR8040 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly constructed power inductors designed for high-performance applications. They feature a magnetic-resin shielded construction that significantly reduces buzz noise to ultra-low levels. These inductors offer large current handling capabilities with low DC resistance, a closed magnetic circuit design for reduced leakage flux and enhanced EMI resistance, and metallization on the ferrite core for excellent shock resistance and durability. Their compact size saves PCB real estate and reduces power consumption. Applications include LED backlights, flat-screen TVs, set-top boxes, notebooks, desktop computers, servers, graphics cards, portable gaming devices, personal navigation systems, multimedia devices, automotive systems, telecommunication base stations, and DC-DC converters.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Series: SNR8040 Series
  • Construction: Automatic assembly, Magnetic resin shielded
  • Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Part No. Inductance (H) @ 100KHz, 1.0V Tolerance DCR () Typical DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max
SNR8040-1R0M 1.0 20% 0.008 0.010 9.85 6.30
SNR8040-1R5M 1.5 20% 0.010 0.013 8.15 5.65
SNR8040-2R2M 2.2 20% 0.012 0.015 7.10 5.15
SNR8040-3R3M 3.3 20% 0.017 0.022 6.50 4.40
SNR8040-3R6M 3.6 20% 0.017 0.022 6.50 4.35
SNR8040-4R7M 4.7 20% 0.019 0.024 5.90 4.10
SNR8040-5R6M 5.6 20% 0.021 0.027 4.55 3.85
SNR8040-6R8M 6.8 20% 0.024 0.031 4.55 3.60
SNR8040-8R2M 8.2 20% 0.026 0.033 4.20 3.45
SNR8040-100M 10 20% 0.029 0.037 3.60 3.30
SNR8040-150M 15 20% 0.047 0.061 2.95 2.80
SNR8040-180M 18 20% 0.053 0.068 2.70 2.40
SNR8040-220M 22 20% 0.069 0.089 2.40 2.10
SNR8040-270M 27 20% 0.078 0.101 2.15 2.00
SNR8040-330M 33 20% 0.097 0.126 2.05 1.80
SNR8040-390M 39 20% 0.107 0.139 1.95 1.70
SNR8040-470M 47 20% 0.136 0.176 1.75 1.55
SNR8040-680M 68 20% 0.196 0.254 1.45 1.25
SNR8040-820M 82 20% 0.225 0.292 1.30 1.15
SNR8040-101M 100 20% 0.290 0.377 1.15 1.00
SNR8040-121M 120 20% 0.334 0.434 1.12 0.95
SNR8040-151M 150 20% 0.410 0.553 1.10 0.85
SNR8040-221M 220 20% 0.599 0.778 0.85 0.80
SNR8040-331M 330 20% 0.889 1.155 0.68 0.64
SNR8040-471M 470 20% 1.260 1.625 0.60 0.50
SNR8040-681M 680 20% 2.040 2.652 0.50 0.45
SNR8040-102M 1000 20% 2.800 3.640 0.40 0.35

Dimensions

External Dimensions (LWH): 8.08.04.0 mm

Recommended Land Pattern (mm):

Part No. A B C D E F G H
SNR8040 8.00.3 8.00.3 4.0 Max 4.00.3 6.30.3 2.2 Typ 3.8 Typ 7.5 Typ

Environmental Data

  • Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance (L): HP4284A, HP4285A LCR meter or equivalent
  • Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

Format: SNR 8040 [Inductance Value] [Tolerance Code] [Packing Code]

  • Type: SNR (Shielded SMD Power Inductors)
  • External Dimensions (LWH): 8040 (8.08.04.0 mm)
  • Inductance: e.g., 470 (47 H)
  • Tolerance Code: M (20%)
  • Packing Code: T (Tape & Reel), B (Bulk Package)

Inductance Tolerance Codes

  • J: 5%
  • K: 10%
  • L: 15%
  • M: 20%
  • P: 25%
  • N: 30%

Packaging

Tape and Reel Specifications:

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SNR8040 16 12 7.5 16.4 100 13 330 1000 3000 12,000

Cover tape peel off condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing

Terminal Strength: Based on GB/T 2423.60-2008 for SMT and DIP. Specific forces and durations vary by terminal cross-sectional area or diameter.

Resistance to Flexure: Based on JIS C 5321:1997. Requires soldering to a test jig and applying a flexure of 2mm at a speed of 0.5mm/sec for 30 sec.

Dropping Test: Based on GB/T 2423.7-2018. Packaged products dropped from 1m high in various angles and surfaces.

Solderability: Based on GB/T 2423.28-2005. Requires 95% minimum solder coverage at 2402 for 3 sec.

Vibration Test: Based on GB/T 2423.10-2019. Subjected to simple harmonic motion (1.5mm amplitude, 10-55 Hz) for 2 hours in 3 perpendicular directions.

Thermal Shock: Based on GB/T 2423.22-2012 Method Na. 100 cycles of temperature transitions between high (85~125) and low (-55~40).

Low Temperature Storage: Based on GB/T 2423.1-2008 Method Ab. Stored at -55~-402 for 962 hours.

High Temperature Storage: Based on GB/T 2423.2-2008 Method Bb. Stored at 125~852 for 962 hours.

Damp Heat (Steady States): Based on GB/T 2423.3-2016. Stored at 602 and 90% to 95% RH for 962 hours.

Heat endurance of Reflow soldering: Based on GJB 360B-2009. Subjected to reflow soldering twice with a peak temperature of 260+0/-5.

Resistance to solvent test: Based on IEC 68-2-45:1993. Dipped in IPA solvent for 50.5 min, dried, and brushed 10 times.

Overload test: Based on JIS C5311-6.13. Applied twice the rated current for 5 minutes.

Voltage resistance test: Based on MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min.

Recommended Reflow Soldering Curve

The recommended reflow conditions are provided as a guideline. Users should adjust and confirm based on their specific equipment and process conditions.

Reminders for Using These Products

  • Storage: Within 12 months, at 5~40C and 35~65% RH.
  • Environment: Avoid gas corrosive environments (salt, acid, alkali).
  • Handling: Avoid direct contact with terminals due to hand oils. Handle with care to prevent damage.
  • Bending: Do not excessively bend terminals to avoid wire fracture.
  • Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Keep away from magnets or magnetic objects.
  • Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Perform within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Account for self-heating when power is applied.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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