Magnetic Resin Shielded SMD Power Inductor LanTu Micro SNR5040-4R7MT with Excellent Shock Resistance
Product Overview
The SNR5040 Series are automatic assembly constructed, magnetic resin shielded SMD power inductors designed to minimize buzz noise to ultra-low levels. They feature a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, along with a metallized ferrite core for excellent shock resistance and durability. These space-saving and power-efficient inductors are ideal for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, graphics cards, automotive systems, and DC-DC converters. They comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR5040
- Construction: Magnetic Resin Shielded SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | L @ 100KHz, 1.0V Tol. | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|
| SNR5040-1R0M | 1.0 | 20% | 0.012 | 0.018 | 7.35 | 4.90 |
| SNR5040-1R2M | 1.2 | 20% | 0.016 | 0.021 | 6.50 | 4.30 |
| SNR5040-1R5M | 1.5 | 20% | 0.015 | 0.020 | 6.30 | 4.30 |
| SNR5040-2R2M | 2.2 | 20% | 0.019 | 0.025 | 4.90 | 3.80 |
| SNR5040-3R3M | 3.3 | 20% | 0.024 | 0.031 | 3.95 | 3.40 |
| SNR5040-4R7M | 4.7 | 20% | 0.030 | 0.039 | 3.50 | 3.00 |
| SNR5040-6R8M | 6.8 | 20% | 0.043 | 0.056 | 2.90 | 2.50 |
| SNR5040-8R2M | 8.2 | 20% | 0.050 | 0.070 | 2.70 | 2.30 |
| SNR5040-100M | 10 | 20% | 0.064 | 0.082 | 2.35 | 2.10 |
| SNR5040-120M | 12 | 20% | 0.077 | 0.102 | 2.20 | 2.00 |
| SNR5040-150M | 15 | 20% | 0.086 | 0.115 | 2.00 | 2.00 |
| SNR5040-220M | 22 | 20% | 0.129 | 0.167 | 1.60 | 1.50 |
| SNR5040-330M | 33 | 20% | 0.188 | 0.244 | 1.30 | 1.20 |
| SNR5040-470M | 47 | 20% | 0.272 | 0.353 | 1.10 | 1.00 |
| SNR5040-680M | 68 | 20% | 0.400 | 0.520 | 0.90 | 0.80 |
| SNR5040-820M | 82 | 20% | 0.560 | 0.660 | 0.80 | 0.75 |
| SNR5040-101M | 100 | 20% | 0.509 | 0.728 | 0.75 | 0.70 |
| SNR5040-121M | 120 | 20% | 0.665 | 0.864 | 0.70 | 0.65 |
| SNR5040-151M | 150 | 20% | 0.750 | 0.975 | 0.65 | 0.60 |
| SNR5040-221M | 220 | 20% | 1.400 | 1.820 | 0.48 | 0.40 |
| SNR5040-331M | 330 | 20% | 2.000 | 2.730 | 0.42 | 0.40 |
| SNR5040-471M | 470 | 20% | 3.000 | 3.900 | 0.37 | 0.35 |
| SNR5040-681M | 680 | 20% | 3.900 | 5.070 | 0.30 | 0.25 |
| SNR5040-102M | 1000 | 20% | 6.000 | 7.800 | 0.21 | 0.23 |
Dimensions
Series: SNR5040
External Dimensions (LWH): 5.04.04.0 mm
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|
| SNR5040 | 5.00.3 | 5.00.3 | 4.0 Max | 2.50.2 | 4.00.2 | 1.4 Typ | 2.3 Typ | 4.2 Typ |
Environmental Data
Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Product Identification
Format: SNR 5040 [Inductance Value] [Tolerance] [Packing]
Example: SNR5040-470M
- Type: SNR (Shielded SMD Power Inductors)
- Dimensions: 5040 (5.04.04.0 mm)
- Inductance: e.g., 470 (47 H)
- Tolerance: M (20%)
- Packing: T (Tape & Reel)
Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Codes: B: Bulk Package, T: Tape & Reel
Applications
- LED backlight
- Flat-screen TVs
- Blue-ray disc
- Set top box
- Notebooks
- Desktop computers
- Servers
- Graphic cards
- Portable gaming devices
- Personal Navigation systems
- Personal multimedia devices
- Automotive systems
- Telecommunication base stations
- DC-DC Converters
Test Equipment
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Packaging Specifications
Tape and Reel Dimensions:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Diameter (mm) | Reel Hub Diameter (mm) | Reel Outer Diameter (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) | Total Quantity per Carton |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR5040 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 1500 | 6000 | 24,000 |
Cover Tape Peel Off Condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
Terminal Strength (SMT): Pulling test with forces ranging from 5N to 20N depending on terminal cross-sectional area, maintained for 10 seconds. Solder paste thickness: 0.12mm. Must meet requirements without loose terminals.
Terminal Strength (DIP): Pulling test with forces ranging from 5N to 40N depending on terminal diameter, maintained for 10 seconds. Must meet requirements without loose terminals.
Resistance to Flexure: 2mm flexure, 0.5mm/sec speed, 30 sec hold time. No visible mechanical damage.
Dropping Test: Packaged products dropped from 1m height in 1 angle, 3 ridges, and 6 surfaces, twice in each direction. No case deformation, change in appearance, short, or open.
Solderability: Solder temperature 2402, duration 3 sec. Wetting shall exceed 75% coverage, terminals must have 95% minimum solder coverage.
Vibration Test: 10 to 55 Hz frequency, 1.5mm amplitude, 2 hours in each of 3 perpendicular directions. Inductance change within 10%, Q factor change within 20%. No visible mechanical damage.
Thermal Shock Test: 100 cycles of temperature transitions between -55~40 and 85~125. Transforming interval max. 20 sec. No visible mechanical damage, inductance change within 10%, Q factor change within 20%.
Low Temperature Storage: -55~-402 for 962 hours. No visible mechanical damage, inductance change within 10%, Q factor change within 20%.
High Temperature Storage: 85~1252 for 962 hours. No visible mechanical damage, inductance change within 10%, Q factor change within 20%.
Damp Heat (Steady States): 602 temperature, 90% to 95% RH humidity for 962 hours. No visible mechanical damage, inductance change within 10%, Q factor change within 20%.
Heat Endurance of Reflow Soldering: Peak temperature 260+0/-5, tested twice. L/L 10%, Q/Q 30%, DCR/DCR 10%.
Resistance to Solvent Test: Dip in IPA solvent for 50.5 min, dry for 5 min, brush 10 times. No case deformation, change in appearance, or obliteration of marking.
Overload Test: Apply twice rated current for 5 minutes. No smoke, peculiar smell, or fire. Characteristics normal after test.
Voltage Resistance Test: DC1000V, Current: 1mA, Time: 1Min. No breakdown. Characteristics normal after test.
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific equipment and process conditions.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35-65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage.
- Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not clean products; contact manufacturer if cleaning is necessary.
- Magnetic Fields: Keep away from magnets or magnetic objects.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions; overheating can cause issues.
- Self-Heating: Account for self-heating in thermal design.
- Non-Shielded Type Layout: Careful PCB layout is needed to avoid malfunction due to magnetic interference.
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