LanTu Micro SMS0530 100MT molding SMD power inductors with low impedance small parasitic capacitance
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Product Description
Product Overview
The SMS0530 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are ultra-high current, thin, and magnetically shielded SMD power inductors. Designed for high-density installations, these inductors offer low DC resistance, strong anti-electromagnetic interference, and high reliability due to their integral construction. They feature ultra-low buzz noise and low loss alloy powder die-casting for low impedance and small parasitic capacitance, contributing to high efficiency. Operating up to 3MHz and with an absolute maximum voltage of 30VDC, they are ideal for applications such as PDA, notebooks, desktop and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems. These inductors comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductors
- Series: SMS0530
- Certifications: RoHS, Halogen Free, REACH Compliance
- Construction: Integral construction, Magnetic shielding type, Composite construction, Die-casting by low loss alloy powder
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Frequency | Test Voltage | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|---|---|
| SMS0530-R22M | 0.22 | 20% | 100KHz | 1.0V | 3.5 | 3.9 | 15.00 | 14.00 | 5.55.23.0 |
| SMS0530-R33M | 0.33 | 20% | 100KHz | 1.0V | 4.6 | 5.5 | 14.40 | 13.10 | 5.55.23.0 |
| SMS0530-R47M | 0.47 | 20% | 100KHz | 1.0V | 7.4 | 8.5 | 14.00 | 11.00 | 5.55.23.0 |
| SMS0530-R68M | 0.68 | 20% | 100KHz | 1.0V | 11.0 | 12.0 | 12.00 | 9.50 | 5.55.23.0 |
| SMS0530-1R0M | 1.0 | 20% | 100KHz | 1.0V | 12.0 | 15.0 | 10.00 | 9.00 | 5.55.23.0 |
| SMS0530-1R2M | 1.2 | 20% | 100KHz | 1.0V | 15.0 | 16.0 | 9.50 | 8.50 | 5.55.23.0 |
| SMS0530-1R5M | 1.5 | 20% | 100KHz | 1.0V | 20.0 | 25.0 | 9.00 | 7.50 | 5.55.23.0 |
| SMS0530-2R2M | 2.2 | 20% | 100KHz | 1.0V | 31.0 | 35.0 | 7.00 | 6.50 | 5.55.23.0 |
| SMS0530-3R3M | 3.3 | 20% | 100KHz | 1.0V | 35.0 | 46.0 | 6.00 | 5.00 | 5.55.23.0 |
| SMS0530-4R7M | 4.7 | 20% | 100KHz | 1.0V | 50.0 | 60.0 | 5.00 | 4.50 | 5.55.23.0 |
| SMS0530-6R8M | 6.8 | 20% | 100KHz | 1.0V | 102.0 | 110.0 | 4.00 | 3.50 | 5.55.23.0 |
| SMS0530-100M | 10 | 20% | 100KHz | 1.0V | 110.0 | 125.0 | 3.50 | 3.20 | 5.55.23.0 |
| SMS0530-150M | 15 | 20% | 100KHz | 1.0V | 175.0 | 215.0 | 2.50 | 2.20 | 5.55.23.0 |
| SMS0530-220M | 22 | 20% | 100KHz | 1.0V | 320.0 | 394.8 | 2.00 | 1.80 | 5.55.23.0 |
| Inductance Tolerance Options | Packing Options |
|---|---|
| J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | B: Bulk Package, T: Tape & Reel |
| Environmental Data | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Test Equipment | Instrument |
|---|---|
| Inductance (L) | WK3260B LCR meter or equivalent |
| Saturation Current (Isat) & Heat Rating Current (Irms) | WK3260B+WK3265B or equivalent |
| DC Resistance (DCR) | Chroma 16502 or equivalent |
| Characteristic | Requirement | Test Method & Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without loose terminal | Pulling test: A8mm2 force5N time:30sec; 8mm2 |
| Terminal Strength (DIP) | Meet requirements without loose terminal | Pull Force: Applied gradually to terminal and maintained for 10 seconds. Force varies by terminal diameter (5N to 40N). |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force (2mm flexure, 0.5mm/sec speed) for 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Subject to simple harmonic motion (1.5mm amplitude, 10-55 Hz) for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature cycling between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended reflow soldering curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under 5~40C and 35-65% RH. Terminal electrode solderability may deteriorate after the storage period.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that can inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils by yourself; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-heating: Allow sufficient thermal design margin as devices generate heat when powered on.
- Layout (Non-magnetic shield type): Carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina