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High Reliability Molding SMD Power Inductors LanTu Micro SMS1040-2R2MT Suitable for DC DC Converters

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Product Description

Molding SMD Power Inductors - SMS1040 Series

Product Overview

The SMS1040 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. features ultra-high current SMD power inductors with a thin design, low DC resistance, and excellent anti-electromagnetic interference capabilities due to magnetic shielding. These inductors are ideal for high-density installations and offer high reliability with superior vibration resistance owing to their integral construction. The composite structure minimizes buzz noise, while the low-loss alloy powder die-casting ensures low impedance and small parasitic capacitance, leading to high efficiency. Suitable for frequencies up to 3MHz and an absolute maximum voltage of 30VDC, these inductors comply with RoHS, Halogen Free, and REACH standards.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SMS1040
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Construction: Integral construction, Magnetic shielding

Applications

  • PDA, notebook, desktop, server applications
  • High current POL converters
  • Battery powered devices
  • DC/DC converters in distributed power systems

Environmental Data

  • Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Technical Specifications

Product Identification: SMS 1040 470 M T

  • Type: SMS (Molding SMD Power Inductor)
  • Model Number: 1040
  • Inductance Value: e.g., 470 (47 uH)
  • Packaging Type: T (Tape & Reel)

Electrical Characteristics (SMS1040 Series)

Part No. Inductance (H) @ 100KHz, 1.0V Tolerance DCR (m) Typical DCR (m) Max Saturation Current (A) Typical (Isat) Heat Rating Current (A) Typical (Irms)
SMS1040-R22M 0.22 20% 1.2 1.5 60.00 35.00
SMS1040-R36M 0.36 20% 1.7 1.9 50.00 30.00
SMS1040-R47M 0.47 20% 1.9 2.2 40.00 30.00
SMS1040-R56M 0.56 20% 2.1 2.4 33.00 25.00
SMS1040-R68M 0.68 20% 2.3 3.0 30.00 23.00
SMS1040-1R0M 1.0 20% 3.0 4.0 28.00 18.00
SMS1040-1R5M 1.5 20% 4.8 5.4 23.00 16.00
SMS1040-2R2M 2.2 20% 7.2 9.0 18.00 12.00
SMS1040-3R3M 3.3 20% 10.8 11.8 16.00 10.00
SMS1040-4R7M 4.7 20% 17.0 20.0 15.00 8.50
SMS1040-5R6M 5.6 20% 20.5 23.0 13.00 8.00
SMS1040-6R8M 6.8 20% 22.5 25.0 12.00 7.00
SMS1040-100M 10 20% 34.0 37.0 8.50 5.50
SMS1040-150M 15 20% 50.0 55.0 7.00 5.00
SMS1040-220M 22 20% 60.0 66.0 6.00 4.00
SMS1040-330M 33 20% 85.0 92.0 5.00 3.50
SMS1040-470M 47 20% 141.0 155.0 4.50 3.00
SMS1040-680M 68 20% 200.0 220.0 3.80 2.30
SMS1040-101M 100 20% 237.0 290.0 3.00 2.00

Note:

  • Saturation Current: DC current at which inductance drops 30% from its value without current.
  • Heat Rating Current: the actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value of Isat or Irms.
  • Part temperature should be verified in the end application due to factors like circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions.

Shape and Dimensions

Part No. A (Max) B (0.30) C (Max) D (Typ) E (Typ) F G H
SMS1040 11.50 10.00 4.00 3.00 2.00 4.10 13.60 5.40

(Dimensions are in mm)

Inductance Tolerance Codes

  • J: 5%
  • K: 10%
  • L: 15%
  • M: 20%
  • P: 25%
  • N: 30%

Packaging

Tape & Reel Specifications:

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SMS1040 24.0 16.0 11.5 24.4 100 13 330 1000 2000 8000

Cover tape peel off condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Packing quantity: REEL 13 PE Bag. Inside Box, Outside Carton. Insufficient full cartons will be filled with inner boxes or cushioning material.

Reliability Testing

Refer to the provided document for detailed reliability testing items, requirements, and test methods including Terminal Strength, Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low temperature Storage, High temperature Storage, Damp Heat, Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test.

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment. Preheating is required before soldering, with a temperature difference between the solder and chip temperature not exceeding 150C.

Reminders for Using These Products

  • Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
  • Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals with bare hands. Handle products carefully to prevent damage.
  • Terminals: Do not bend terminals excessively.
  • Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose to magnets or magnetic fields.
  • Soldering: Preheat components before soldering. Soldering corrections after mounting should be within specified conditions. Overheating may cause issues.
  • Self-heating: Allow sufficient thermal design margin for self-heating when power is on.
  • Layout: For non-magnetic shielded types, careful coil placement on the PCB is advised to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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