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RoHS Halogen Free Molding SMD Power Inductor LanTu Micro SMS1350-220MT for Distributed Power Systems

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Product Description

Molding SMD Power Inductors - SMS1350 Series

Product Overview

The SMS1350 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are ultra-high current, thin design SMD power inductors. Featuring magnetic shielding for strong anti-electromagnetic interference and an integral construction for high reliability and vibration resistance, these inductors are suitable for high-density installations. They offer low DC resistance, ultra-low buzz noise due to composite construction, and low loss alloy powder die-casting for low impedance and small parasitic capacitance. With high efficiency and frequencies up to 3MHz, they are ideal for applications requiring reduced winding loss and core eddy-current loss. These inductors are RoHS, Halogen Free, and REACH compliant.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Type: Molding SMD Power Inductor
  • Series: SMS1350
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: China (Implied by company location)

Applications

  • PDA, notebook, desktop, server applications
  • High current POL converters
  • Battery powered devices
  • DC/DC converters in distributed power systems

Technical Specifications

Item Specification
Operating Temperature -55 to +125 (Including coils self-temperature rise)
Maximum Voltage 30VDC
Frequency Up to 3MHz
Test Equipment (Inductance) WK3260B LCR meter or equivalent
Test Equipment (Current) WK3260B+WK3265B or equivalent
Test Equipment (DCR) Chroma 16502 or equivalent
Product Identification Structure SMS 1350 [Inductance] M T (e.g., SMS1350-100M)
Inductance Tolerance J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing B: Bulk Package, T: Tape & Reel
External Dimensions (LWH) 13.812.66.0 mm (for SMS1350 Series)
Shape and Dimensions (mm)
ITEMABCDEFGH
SMS135013.800.5012.600.206.00Max3.70 Typ2.50 Typ8.0014.605.00

Electrical Characteristics (SMS1350 Series)

Part No. Inductance (H) @ 0A Tolerance DCR (m) Typical DCR (m) Max Saturation Current (A) Typical Heat Rating Current (A) Typical
SMS1350-R36M 0.36 20% 0.85 1.1 60.00 41.00
SMS1350-R47M 0.47 20% 1.1 1.3 52.00 39.00
SMS1350-R68M 0.68 20% 1.2 1.5 40.00 32.00
SMS1350-R82M 0.82 20% 1.5 1.7 42.00 30.00
SMS1350-1R0M 1.0 20% 1.9 2.2 35.00 26.00
SMS1350-1R5M 1.5 20% 2.7 3.2 30.00 23.00
SMS1350-2R2M 2.2 20% 4.0 5.0 26.00 20.00
SMS1350-3R3M 3.3 20% 7.0 9.0 22.00 15.00
SMS1350-4R7M 4.7 20% 9.0 11.0 17.00 12.00
SMS1350-6R8M 6.8 20% 15.0 18.0 14.00 11.00
SMS1350-100M 10 20% 20.0 23.0 12.00 8.00
SMS1350-150M 15 20% 28.0 32.0 10.00 6.00
SMS1350-220M 22 20% 45.0 52.0 7.00 4.50
SMS1350-330M 33 20% 66.0 75.0 6.00 4.00
SMS1350-470M 47 20% 100.0 120.0 5.00 3.00
SMS1350-680M 68 20% 115.0 135.0 4.50 2.50

Note on Currents:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Special Remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Product Packaging

Tape and Reel Specifications:

  • Tape Dimension (mm): W 24.0, P 16.0, W1 11.5
  • Reel Dimensions (mm): A 24.4
  • Quantity per Reel: 500 PCS
  • Quantity per Inside Box: 100 PCS
  • Quantity per Outside Carton: 4000 PCS

Cover tape peel off condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180

Reliability Testing

Various reliability tests are conducted according to international standards including GB/T, JIS, IEC, MIL-STD, and GJB. Key tests include Terminal Strength, Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test. Specific requirements and test methods are detailed in the original documentation.

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm these conditions based on their specific environment and equipment. The peak temperature for reflow soldering should be 260+0/-5, with the process performed twice.

Reminders for Using These Products

  • Storage: Within 12 months under conditions of 5~40C and 35~65% RH. Soldering of terminal electrodes may deteriorate if storage time elapses.
  • Environment: Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by hand due to oil secretions that can inhibit soldering. Handle products carefully to prevent damage.
  • Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
  • Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
  • Soldering Corrections: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Allow for sufficient thermal design margin due to self-heating when power is on.
  • Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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