Molding SMD power inductors LanTu Micro SMS0630-680MT with low impedance and high current capability
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Product Description
Molding SMD Power Inductors - SMS0630 Series
Product Overview
The SMS0630 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors with a thin design, low DC resistance, and magnetic shielding for strong anti-electromagnetic interference. These inductors are ideal for high-density installations and feature high reliability due to their integral construction, providing excellent vibration resistance and ultra-low buzz noise. Their composite structure and die-casting with low-loss alloy powder contribute to low impedance and small parasitic capacitance, enabling high efficiency and reduced core eddy-current loss. Operating at frequencies up to 3MHz with an absolute maximum voltage of 30VDC, these inductors are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Origin: SHENZHEN, CHINA
- Product Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Environmental Data
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Technical Specifications
Product Identification Example: SMS 0630 R68 M T
- Type: SMS (Molding SMD Power Inductor)
- Inductance: e.g., 0.68 uH
- External Dimensions (LWH): 0630 (7.16.63.0 mm)
- Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B (Bulk Package), T (Tape & Reel)
Electrical Characteristics (Electrical specifications at 25)
| Part No | Inductance (H) @0A | Tol | DCR (m) Typical | DCR (m) Max | Saturation Current Typical (A) | Heat Rating Current Typical (A) |
|---|---|---|---|---|---|---|
| SMS0630-R10M | 0.10 | 20% | 1.40 | 2.20 | 60.00 | 32.00 |
| SMS0630-R15M | 0.15 | 20% | 1.55 | 2.30 | 41.00 | 30.00 |
| SMS0630-R22M | 0.22 | 20% | 1.60 | 3.00 | 35.00 | 25.00 |
| SMS0630-R33M | 0.33 | 20% | 2.50 | 3.20 | 25.00 | 21.00 |
| SMS0630-R47M | 0.47 | 20% | 4.00 | 4.50 | 20.00 | 18.00 |
| SMS0630-R68M | 0.68 | 20% | 4.75 | 5.30 | 19.00 | 16.00 |
| SMS0630-R82M | 0.82 | 20% | 5.60 | 7.50 | 18.00 | 14.00 |
| SMS0630-1R0M | 1.0 | 20% | 7.60 | 7.25 | 16.00 | 13.00 |
| SMS0630-1R5M | 1.5 | 20% | 13.20 | 16.00 | 14.00 | 12.50 |
| SMS0630-2R2M | 2.2 | 20% | 16.50 | 20.00 | 11.50 | 8.50 |
| SMS0630-3R3M | 3.3 | 20% | 24.50 | 35.00 | 9.50 | 7.00 |
| SMS0630-4R7M | 4.7 | 20% | 35.00 | 40.00 | 6.55 | 6.00 |
| SMS0630-5R6M | 5.6 | 20% | 36.00 | 42.00 | 6.35 | 5.70 |
| SMS0630-6R8M | 6.8 | 20% | 44.30 | 48.00 | 6.00 | 5.10 |
| SMS0630-8R2M | 8.2 | 20% | 60.00 | 64.90 | 6.00 | 5.00 |
| SMS0630-100M | 10 | 20% | 64.50 | 75.00 | 5.50 | 4.50 |
| SMS0630-150M | 15 | 20% | 103.00 | 115.00 | 4.50 | 3.10 |
| SMS0630-220M | 22 | 20% | 180.00 | 200.00 | 3.50 | 2.60 |
| SMS0630-330M | 33 | 20% | 250.00 | 270.00 | 3.00 | 2.00 |
| SMS0630-470M | 47 | 20% | 310.00 | 385.00 | 2.00 | 1.50 |
| SMS0630-680M | 68 | 20% | 506.00 | 580.00 | 1.50 | 1.00 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Shape and Dimensions (dimensions are in mm)
| Part No | A | B | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0630 | 7.100.30 | 6.600.20 | 3.00 | 3.00 | 1.60 | 3.70 | 8.40 | 3.50 |
Packaging Specifications
Tape and Reel Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0630 | 16.0 | 12.0 | 7.5 | 16.4 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Cover tape peel off condition:
- a) Cover tape peel force: 10 to 120g
- b) Noodle strip peeling angle: 165 to 180
Reliability Testing
| Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test: Define force based on terminal sectional area. Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (d): 0.35d0.50 (5N), 0.50d0.80 (10N), 0.80d1.25 (20N), D1.25 (40N). Duration: 10sec. Pull Force applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | Solder inductor to test jig. Apply force in specified direction. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder inductor to testing jig. Subject to simple harmonic motion, amplitude 1.5mm, frequency 10-55 Hz. Traversed in 1 minute. Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Start at (85~125) for T time, rush to (-55~40) for T time as one cycle, through 100 cycles. Transforming interval: Max. 20 sec. Stabilized at normal condition for 1~2 hours. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then dry at room temp for 5Min, brush 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristics are normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to typical soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not clean coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Account for self-heating (temperature increase) when power is ON in thermal design.
- Non-Magnetic Shield Type: Careful coil layout is needed for non-magnetic shield types to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina