Ultra High Current Molding SMD Power Inductors LanTu Micro SMS0630-330MT for Battery Powered Devices
Molding SMD Power Inductors - SMS0630 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0630 Series offers ultra-high current SMD power inductors with a thin design, low DC resistance, and magnetic shielding for strong anti-electromagnetic interference. These inductors are ideal for high-density installations and feature high reliability due to their integral construction, providing excellent vibration resistance and ultra-low buzz noise. Their composite construction and die-casting with low-loss alloy powder result in low impedance and small parasitic capacitance, contributing to high efficiency by reducing winding DC resistance and core eddy-current loss. Designed for frequencies up to 3MHz with an absolute maximum voltage of 30VDC, these inductors comply with RoHS, Halogen Free, and REACH standards. They are suitable for applications such as PDA, notebooks, desktop and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0630
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
Environmental Data
| Parameter | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
Electrical Characteristics (at 25)
| Part No. | Inductance (H) @0A | Tol. | DCR (m) Typical | Saturation Current Typical (A) | Heat Rating Current Typical (A) |
|---|---|---|---|---|---|
| SMS0630-R10M | 0.10 | 20% | 1.40 | 60.00 | 32.00 |
| SMS0630-R15M | 0.15 | 20% | 1.55 | 41.00 | 30.00 |
| SMS0630-R22M | 0.22 | 20% | 1.60 | 35.00 | 25.00 |
| SMS0630-R47M | 0.47 | 20% | 4.00 | 20.00 | 18.00 |
| SMS0630-R68M | 0.68 | 20% | 4.75 | 19.00 | 16.00 |
| SMS0630-1R0M | 1.0 | 20% | 7.60 | 16.00 | 13.00 |
| SMS0630-1R5M | 1.5 | 20% | 13.20 | 14.00 | 12.50 |
| SMS0630-2R2M | 2.2 | 20% | 16.50 | 11.50 | 8.50 |
| SMS0630-3R3M | 3.3 | 20% | 24.50 | 9.50 | 7.00 |
| SMS0630-4R7M | 4.7 | 20% | 35.00 | 6.55 | 6.00 |
| SMS0630-5R6M | 5.6 | 20% | 36.00 | 6.35 | 5.70 |
| SMS0630-6R8M | 6.8 | 20% | 44.30 | 6.00 | 5.10 |
| SMS0630-8R2M | 8.2 | 20% | 60.00 | 6.00 | 5.00 |
| SMS0630-100M | 10 | 20% | 64.50 | 5.50 | 4.50 |
| SMS0630-150M | 15 | 20% | 103.00 | 4.50 | 3.10 |
| SMS0630-220M | 22 | 20% | 180.00 | 3.50 | 2.60 |
| SMS0630-330M | 33 | 20% | 250.00 | 3.00 | 2.00 |
| SMS0630-470M | 47 | 20% | 310.00 | 2.00 | 1.50 |
Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Shape and Dimensions (mm)
| Part No. | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0630 | 7.100.30 | 6.600.20 | 3.00Max | 3.00 Typ | 1.60 Typ | 3.70 | 8.40 | 3.50 |
Packaging:
| Part No. | Packing | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|
| SMS0630 | Tape & Reel | 1000 | 300 | 12,000 |
Tape and Reel Specifications (mm)
| Part No. | Tape Dimension W | Tape Dimension P | Tape Dimension W1 | Reel Dimensions A | Reel Dimensions B | Reel Dimensions C | Reel Dimensions D |
|---|---|---|---|---|---|---|---|
| SMS0630 | 16.0 | 12.0 | 7.5 | 16.4 | 100 | 13 | 330 |
Cover tape peel off condition:
a) Cover tape peel force: 10 to 120g
b) Noodle strip peeling angle: 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test: Force varies based on terminal cross-sectional area (5N for 8mm, 10N for 8mm-20mm, 20N for >20mm), time: 10-30 sec. Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force varies based on terminal diameter (5N to 40N), Duration: 10 sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency: 10 to 55 Hz. Amplitude: 1.5mm. Duration: 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Peak temperature: 260+0/-5. Performed twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then dry at room temp for 5Min, brush 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristics are normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended reflow soldering curve:
Users should adjust and confirm reflow conditions according to their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, conditions (5~40C, 35~65% RH).
- Avoid use/storage in corrosive gas environments.
- Do not touch electrodes directly with bare hands.
- Handle products carefully to prevent damage.
- Do not bend terminals excessively.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid overheating.
- Allow sufficient thermal design margin for self-heating.
- For non-magnetic shield types, careful coil layout is needed to prevent malfunction due to magnetic interference.
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