Shielded SMD Power Inductors LanTu Micro SDRI125-101MT with Low DC Resistance and High Accuracy Dimensions
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Product Description
Product Overview
The SDRI125 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. These inductors feature a high saturation current, low DC resistance, and a closed magnetic circuit design to minimize leakage. Their high-accuracy dimensions ensure suitability for automatic mounting. Applications include power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. The series complies with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: LANTU
- Origin: SHENZHEN, China
- Series: SDRI125
- Type: Shielded SMD Power Inductors
- Magnetic Circuit Design: Closed magnetic circuit
- Certifications: RoHS, Halogen Free, REACH Compliance
- Mounting: Suitable for automatic mounting
Technical Specifications
General Specifications:
| Feature | Description |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent LCR meter |
| Test Equipment (Current) | HP4284+42841A or equivalent |
| Test Equipment (Q Factor) | HP4285A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification Structure:
| Part | Description |
|---|---|
| SDRI 125 | Type (SDRI) and Size (125) |
| 470 | Inductance Value (e.g., 470 = 47 H) |
| M | Inductance Tolerance (M: 20%) |
| T | Packing (T: Tape & Reel) |
External Dimensions (mm):
| Series | L (Max) | W (Max) | H (Max) | A (Typ) | B (Typ) | C (Typ) | D (Typ) | E (Typ) |
|---|---|---|---|---|---|---|---|---|
| SDRI125 | 12.5 | 12.5 | 6.0 | 5.0 | 7.6 | 2.9 | 7.0 | 5.4 |
Electrical Characteristics:
| Part No. | Inductance L (H) @ 0A | Tolerance | Test Freq (L) | Q Factor Min @ Test Freq | DCR () Max | Saturation Current Isat (A) Max | Temperature Rise Current Irms (A) Max |
|---|---|---|---|---|---|---|---|
| SDRI125-1R0N | 1.0 | 30% | 100KHz | 20 @ 1MHz | 0.010 | 15.80 | 8.00 |
| SDRI125-2R2N | 2.2 | 30% | 100KHz | 20 @ 1MHz | 0.014 | 13.50 | 7.80 |
| SDRI125-2R4N | 2.4 | 30% | 100KHz | 20 @ 1MHz | 0.014 | 12.00 | 7.50 |
| SDRI125-3R3N | 3.3 | 30% | 100KHz | 20 @ 1MHz | 0.017 | 10.50 | 6.80 |
| SDRI125-4R7N | 4.7 | 30% | 100KHz | 30 @ 1MHz | 0.020 | 9.50 | 5.60 |
| SDRI125-5R8N | 5.8 | 30% | 100KHz | 30 @ 1MHz | 0.021 | 8.60 | 5.20 |
| SDRI125-8R2N | 8.2 | 30% | 100KHz | 30 @ 1MHz | 0.023 | 7.00 | 4.40 |
| SDRI125-100N | 10 | 30% | 100KHz | 35 @ 1MHz | 0.025 | 6.50 | 4.00 |
| SDRI125-120M | 12 | 20% | 100KHz | 35 @ 1MHz | 0.027 | 6.00 | 3.50 |
| SDRI125-150M | 15 | 20% | 100KHz | 35 @ 1MHz | 0.030 | 5.40 | 3.30 |
| SDRI125-180M | 18 | 20% | 100KHz | 35 @ 1MHz | 0.034 | 4.90 | 3.00 |
| SDRI125-220M | 22 | 20% | 100KHz | 35 @ 1MHz | 0.036 | 4.70 | 2.80 |
| SDRI125-270M | 27 | 20% | 100KHz | 35 @ 1MHz | 0.051 | 4.00 | 2.30 |
| SDRI125-330M | 33 | 20% | 100KHz | 35 @ 1MHz | 0.057 | 3.58 | 2.10 |
| SDRI125-390M | 39 | 20% | 100KHz | 35 @ 1MHz | 0.068 | 3.30 | 2.00 |
| SDRI125-470M | 47 | 20% | 100KHz | 35 @ 1MHz | 0.075 | 3.20 | 1.80 |
| SDRI125-560M | 56 | 20% | 100KHz | 35 @ 1MHz | 0.110 | 2.80 | 1.70 |
| SDRI125-680M | 68 | 20% | 100KHz | 35 @ 1MHz | 0.120 | 2.50 | 1.50 |
| SDRI125-820M | 82 | 20% | 100KHz | 35 @ 1MHz | 0.140 | 2.30 | 1.40 |
| SDRI125-101M | 100 | 20% | 100KHz | 40 @ 0.796MHz | 0.160 | 1.90 | 1.30 |
| SDRI125-121M | 120 | 20% | 100KHz | 40 @ 0.796MHz | 0.170 | 1.80 | 1.10 |
| SDRI125-151M | 150 | 20% | 100KHz | 40 @ 0.796MHz | 0.230 | 1.70 | 1.00 |
| SDRI125-181M | 180 | 20% | 100KHz | 40 @ 0.796MHz | 0.290 | 1.60 | 0.90 |
| SDRI125-221M | 220 | 20% | 100KHz | 40 @ 0.796MHz | 0.400 | 1.45 | 0.80 |
| SDRI125-271M | 270 | 20% | 100KHz | 40 @ 0.796MHz | 0.460 | 1.20 | 0.75 |
| SDRI125-331M | 330 | 20% | 100KHz | 40 @ 0.796MHz | 0.510 | 1.15 | 0.68 |
| SDRI125-391M | 390 | 20% | 100KHz | 40 @ 0.796MHz | 0.690 | 1.10 | 0.65 |
| SDRI125-471M | 470 | 20% | 100KHz | 40 @ 0.796MHz | 0.770 | 0.94 | 0.58 |
| SDRI125-561M | 560 | 20% | 100KHz | 40 @ 0.796MHz | 0.860 | 0.90 | 0.54 |
| SDRI125-681M | 680 | 20% | 100KHz | 40 @ 0.796MHz | 1.200 | 0.70 | 0.48 |
| SDRI125-821M | 820 | 20% | 100KHz | 40 @ 0.796MHz | 1.340 | 0.55 | 0.40 |
| SDRI125-102M | 1000 | 20% | 100KHz | 40 @ 0.796MHz | 1.530 | 0.44 | 0.35 |
Definitions:
- Saturation Current (Isat): DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Packaging Specifications:
| Series | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension H (mm) | Reel Dimension A (mm) | Reel Dimension B (mm) | Reel Dimension C (mm) | Reel Dimension D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRI125 | 24 | 16 | 11.5 | 24.4 | 100 | 13 | 330 | 500 | 1000 | 4000 |
Cover tape peel off condition:
- a) Cover tape peel force shall be 10 to 120g.
- b) Noodle strip peeling angle 165 to 180.
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. Force applied gradually. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Applied force varies with terminal diameter (5N to 40N). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Packaged products dropped from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Simple harmonic motion, amplitude 1.5mm, frequency 10-55 Hz and back. Applied for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | GJB 360B-2009. Performed twice according to the recommended reflow curve. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | JIS C5311-6.13. Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended reflow soldering curve:
The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products:
- Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH or less.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetism: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Correction: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
- Self-heating: Allow sufficient margin for thermal design due to self-heating when power is on.
- Layout (Non-magnetic shield type): Carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
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16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina