Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Ultra Low Buzz Noise Molding SMD Power Inductors LanTu Micro SMS1050-330MT with Strong EMI Shielding

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Product Description

Molding SMD Power Inductors - SMS1050 Series

Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1050 Series Ultra-high current SMD power inductors are designed for high-density installation with a thin profile, low DC resistance, and ultra-high current capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability due to their integral construction, providing excellent vibration resistance and ultra-low buzz noise. The composite structure and die-casting with low-loss alloy powder contribute to low impedance and small parasitic capacitance, resulting in high efficiency and reduced winding losses. These inductors are suitable for applications requiring frequencies up to 3MHz and an absolute maximum voltage of 30VDC, and comply with RoHS, Halogen Free, and REACH standards. They are ideal for PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SMS1050
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Product Identification

SMS 1050 100 M T

  • Type: SMS (Molding SMD Power Inductor)
  • Series: 1050
  • Inductance: 10 uH (Example value)
  • External Dimensions (LWH): 11.510.05.0 mm
  • Tolerance: M (20%)

Electrical Characteristics (at 25)

Part No Inductance (H) @ 100KHz, 1.0V Tol DCR (m) Typ DCR (m) Max Saturation Current (A) Typ Heat Rating Current (A) Typ
SMS1050-R82M 0.82 20% 2.5 3.2 39.00 22.00
SMS1050-1R0M 1.0 20% 2.8 3.5 30.00 20.30
SMS1050-1R2M 1.2 20% 2.8 3.5 28.00 18.00
SMS1050-1R5M 1.5 20% 3.9 4.8 25.00 16.00
SMS1050-2R2M 2.2 20% 6.5 8.2 20.00 13.00
SMS1050-3R3M 3.3 20% 9.2 12.0 18.00 10.00
SMS1050-4R7M 4.7 20% 12.4 18.0 14.00 9.50
SMS1050-5R6M 5.6 20% 18.9 25.0 13.00 8.50
SMS1050-6R8M 6.8 20% 20.6 28.0 12.00 8.00
SMS1050-8R2M 8.2 20% 27.4 35.0 10.00 7.00
SMS1050-100M 10 20% 30.2 40.0 8.50 5.50
SMS1050-150M 15 20% 48.0 55.0 7.00 4.50
SMS1050-220M 22 20% 60.0 72.0 5.50 4.00
SMS1050-330M 33 20% 89.0 105.0 5.50 3.50
SMS1050-470M 47 20% 110.0 130.0 4.50 3.00
SMS1050-680M 68 20% 190.0 210.0 3.00 2.00

Note: Saturation Current: DC current at which inductance drops 30% from its value without current. Heat Rating Current: the actual value of DC current when the temperature rise is T 40 (Ta=25). Rated DC Current: The less value which is Isat or Irms.

Shape and Dimensions (mm)

Part No A (Max) B (0.30) C (Max) D (Typ) E (Typ) F G H
SMS1050 11.50 10.00 5.00 3.00 2.00 5.40 13.60 4.10

Inductance Tolerance Codes

J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Packing Options

  • Bulk Package
  • Tape & Reel

Environmental Data

  • Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance (L): WK3260B LCR meter or equivalent
  • Current (Isat & Irms): WK3260B+WK3265B or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Recommended reflow soldering curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment/equipment.

Reminders for Using These Products

  • Storage period is within 12 months under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less).
  • Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals by bare hands due to oil secretions.
  • Handle products carefully to prevent damage.
  • Do not bend terminals with excessive stress.
  • Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering; the temperature difference between solder and chip temperature should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
  • Ensure sufficient thermal design margin for self-heating when power is ON.
  • For non-magnetic shield types, careful coil layout is required to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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