Shielded SMD power inductors LanTu Micro SDRI127-2R2NT ideal for LCD televisions and VTR power supplies
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Product Description
Shielded SMD Power Inductors - SDRI127 Series
Product Overview
The SDRI127 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit design to minimize leakage, these inductors offer high saturation current and low DCR. Their high-precision dimensions ensure suitability for automatic mounting. The series is available in various package sizes and a wide inductance range, complying with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: LANTU MICRO
- Origin: SHENZHEN, China
- Certifications: RoHS, Halogen Free, REACH Compliance
- Type: Shielded SMD Power Inductors
- Design: Closed magnetic circuit
Applications
- Power supply for VTRs
- LCD televisions
- Notebook PCs
- Portable communication equipment
- DC/DC converters
Environmental Data
- Operating Temperature: -40 to +125 (Including coil self-temperature rise)
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Frequency (L) | Q Factor Min. | Test Frequency (Q) | DCR () Max. | Saturation Current (A) Max. | Temperature Rise Current (A) Max. |
|---|---|---|---|---|---|---|---|---|
| SDRI127-1R0N | 1.0 | 30% | 100KHz | 20 | 1MHz | 0.009 | 26.00 | 10.00 |
| SDRI127-2R2N | 2.2 | 30% | 100KHz | 20 | 1MHz | 0.012 | 21.00 | 8.00 |
| SDRI127-2R7N | 2.7 | 30% | 100KHz | 20 | 1MHz | 0.013 | 19.00 | 8.00 |
| SDRI127-3R3N | 3.3 | 30% | 100KHz | 20 | 1MHz | 0.013 | 16.00 | 8.00 |
| SDRI127-3R9N | 3.9 | 30% | 100KHz | 20 | 1MHz | 0.013 | 14.00 | 7.50 |
| SDRI1274R7N | 4.7 | 30% | 100KHz | 30 | 1MHz | 0.016 | 12.00 | 6.80 |
| SDRI127-6R1N | 6.1 | 30% | 100KHz | 30 | 1MHz | 0.018 | 11.50 | 6.60 |
| SDRI127-6R8N | 6.8 | 30% | 100KHz | 30 | 1MHz | 0.019 | 10.50 | 6.60 |
| SDRI127-7R6N | 7.6 | 30% | 100KHz | 30 | 1MHz | 0.020 | 10.00 | 5.90 |
| SDRI127-8R2N | 8.2 | 30% | 100KHz | 30 | 1MHz | 0.020 | 9.50 | 5.60 |
| SDRI127-100N | 10 | 30% | 100KHz | 35 | 1MHz | 0.021 | 9.00 | 5.40 |
| SDRI127-120M | 12 | 20% | 100KHz | 35 | 1MHz | 0.240 | 8.50 | 4.90 |
| SDRI127-150M | 15 | 20% | 100KHz | 35 | 1MHz | 0.027 | 8.00 | 4.50 |
| SDRI127-180M | 18 | 20% | 100KHz | 35 | 1MHz | 0.039 | 7.50 | 3.90 |
| SDRI127-220M | 22 | 20% | 100KHz | 35 | 1MHz | 0.043 | 7.00 | 3.60 |
| SDRI127-270M | 27 | 20% | 100KHz | 35 | 1MHz | 0.046 | 6.50 | 3.40 |
| SDRI127-330M | 33 | 20% | 100KHz | 35 | 1MHz | 0.065 | 5.50 | 3.00 |
| SDRI127-390M | 39 | 20% | 100KHz | 35 | 1MHz | 0.072 | 5.00 | 2.75 |
| SDRI127-470M | 47 | 20% | 100KHz | 35 | 1MHz | 0.100 | 4.60 | 2.50 |
| SDRI127-560M | 56 | 20% | 100KHz | 35 | 1MHz | 0.110 | 4.40 | 2.35 |
| SDRI127-680M | 68 | 20% | 100KHz | 35 | 1MHz | 0.140 | 4.00 | 2.10 |
| SDRI127-820M | 82 | 20% | 100KHz | 35 | 1MHz | 0.160 | 3.80 | 1.95 |
| SDRI127-101M | 100 | 20% | 100KHz | 40 | 0.796MHz | 0.220 | 3.50 | 1.70 |
| SDRI127-121M | 120 | 20% | 100KHz | 40 | 0.796MHz | 0.250 | 3.00 | 1.60 |
| SDRI127-151M | 150 | 20% | 100KHz | 40 | 0.796MHz | 0.280 | 2.70 | 1.42 |
| SDRI127-181M | 180 | 20% | 100KHz | 40 | 0.796MHz | 0.350 | 2.50 | 1.30 |
| SDRI127-221M | 220 | 20% | 100KHz | 40 | 0.796MHz | 0.390 | 2.00 | 1.16 |
| SDRI127-271M | 270 | 20% | 100KHz | 40 | 0.796MHz | 0.560 | 1.95 | 1.06 |
| SDRI127-331M | 330 | 20% | 100KHz | 40 | 0.796MHz | 0.640 | 1.90 | 0.95 |
| SDRI127-391M | 390 | 20% | 100KHz | 40 | 0.796MHz | 0.700 | 1.65 | 0.88 |
| SDRI127-471M | 470 | 20% | 100KHz | 40 | 0.796MHz | 0.980 | 1.50 | 0.79 |
| SDRI127-561M | 560 | 20% | 100KHz | 40 | 0.796MHz | 1.070 | 1.40 | 0.73 |
| SDRI127-681M | 680 | 20% | 100KHz | 40 | 0.796MHz | 1.460 | 1.30 | 0.67 |
| SDRI127-821M | 820 | 20% | 100KHz | 40 | 0.796MHz | 1.640 | 1.10 | 0.60 |
| SDRI127-102M | 1000 | 20% | 100KHz | 40 | 0.796MHz | 1.820 | 1.00 | 0.55 |
Product Identification
Format: SDRI 127 470 M T
- Type: SDRI (Shielded SMD Power Inductors)
- Outer Dimensions (LWH) (mm): 127 (12.512.58.0)
- Inductance: e.g., 470 (47 H)
- Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: T (Tape & Reel), B (Bulk Package)
Dimensions (mm)
| Part No. | A (Max) | B (Max) | C (Max) | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SDRI127 | 12.5 | 12.5 | 8.0 | 5.0 | 7.6 | 2.9 | 7.0 | 5.4 |
Packaging Information
Tape and Reel Specifications:
| Part No. | Tape Dimension W | Tape Dimension P | Tape Dimension H | Reel Dimensions A | Reel Dimensions B | Reel Dimensions C | Reel Dimensions D | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRI127 | 24 | 16 | 11.5 | 24.4 | 100 | 13 | 330 | 500 | 1000 | 4000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on sectional area of terminal. Solder paste thickness: 0.12mm. Force applied gradually and maintained for 101s at 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force and duration based on terminal diameter. Pull Force applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force in specified direction. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to testing jig. Subjected to simple harmonic motion (amplitude 1.5mm, frequency 10-55 Hz) for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | 100 cycles of temperature transitions between (85~125) and (-55~40). Transforming interval: Max. 20 sec. Stabilize at normal condition for 1-2 hours. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: -402. Duration: 962 hours. Stabilize at normal condition for 1-2 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 852. Duration: 962 hours. Stabilize at normal condition for 1-2 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1-2 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. Repeat twice. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less). Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that may inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for thermal design as self-heating occurs when power is ON.
- Non-Magnetic Shield Type: Carefully lay out the coil on the PCB for non-magnetic shield types to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina