Power LanTu Micro SNR6045-101MT Magnetic Resin Shielded Inductor with Large Current Handling and Low EMI
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SNR6045 Series are automatic assembly constructed, magnetic resin shielded SMD power inductors designed to minimize buzz noise to ultra-low levels. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design for reduced leakage flux and EMI, and metallization on the ferrite core for excellent shock resistance and durability. These space-saving and power-efficient inductors are suitable for a wide range of applications including LED backlighting, flat-screen TVs, notebooks, servers, graphics cards, automotive systems, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR6045 Series
- Construction: Automatic assembly, Magnetic resin shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
- Core Material: Ferrite Core
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Test Frequency (100KHz, 1.0V) | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|---|
| SNR6045-1R0M | 1.0 | 20% | 0.014 | 0.014 | 9.85 | 5.14 | 6.06.04.5 |
| SNR6045-1R5M | 1.5 | 20% | 0.015 | 0.015 | 8.80 | 4.95 | 6.06.04.5 |
| SNR6045-2R2M | 2.2 | 20% | 0.018 | 0.018 | 6.75 | 4.60 | 6.06.04.5 |
| SNR6045-3R3M | 3.3 | 20% | 0.027 | 0.027 | 5.90 | 3.70 | 6.06.04.5 |
| SNR6045-4R7M | 4.7 | 20% | 0.033 | 0.033 | 4.97 | 3.30 | 6.06.04.5 |
| SNR6045-6R8M | 6.8 | 20% | 0.040 | 0.040 | 3.90 | 3.00 | 6.06.04.5 |
| SNR6045-8R2M | 8.2 | 20% | 0.055 | 0.055 | 3.90 | 2.60 | 6.06.04.5 |
| SNR6045-100M | 10 | 20% | 0.062 | 0.062 | 3.20 | 2.45 | 6.06.04.5 |
| SNR6045-150M | 15 | 20% | 0.088 | 0.088 | 2.50 | 2.05 | 6.06.04.5 |
| SNR6045-220M | 22 | 20% | 0.115 | 0.115 | 2.05 | 1.80 | 6.06.04.5 |
| SNR6045-330M | 33 | 20% | 0.178 | 0.178 | 1.65 | 1.50 | 6.06.04.5 |
| SNR6045-470M | 47 | 20% | 0.260 | 0.260 | 1.40 | 1.20 | 6.06.04.5 |
| SNR6045-680M | 68 | 20% | 0.375 | 0.375 | 1.20 | 1.00 | 6.06.04.5 |
| SNR6045-820M | 82 | 20% | 0.440 | 0.440 | 1.05 | 0.90 | 6.06.04.5 |
| SNR6045-101M | 100 | 20% | 0.562 | 0.562 | 0.95 | 0.80 | 6.06.04.5 |
| SNR6045-121M | 120 | 20% | 0.628 | 0.628 | 0.85 | 0.77 | 6.06.04.5 |
| SNR6045-151M | 150 | 20% | 0.750 | 0.750 | 0.80 | 0.70 | 6.06.04.5 |
| SNR6045-221M | 220 | 20% | 1.050 | 1.050 | 0.70 | 0.59 | 6.06.04.5 |
| SNR6045-331M | 330 | 20% | 1.650 | 1.650 | 0.57 | 0.57 | 6.06.04.5 |
| SNR6045-471M | 470 | 20% | 2.340 | 2.340 | 0.50 | 0.42 | 6.06.04.5 |
| SNR6045-681M | 680 | 20% | 3.250 | 3.250 | 0.42 | 0.33 | 6.06.04.5 |
| SNR6045-102M | 1000 | 20% | 5.850 | 5.850 | 0.30 | 0.30 | 6.06.04.5 |
| Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |||||||
| Packing Codes: B: Bulk Package, T: Tape & Reel | |||||||
| Operating Temperature: -40 to +125 (Including coils self-temperature rise) | |||||||
| Saturation Current Definition: DC current at which inductance drops 30% from its value without current. | |||||||
| Temperature Rise Current Definition: The actual value of DC current when the temperature rise is T 40 (Ta=25). | |||||||
| Rated DC Current: The lesser value of Isat or Irms. | |||||||
| Part Temperature: Affected by circuit design, component, PCB trace size and thickness, airflow and other cooling provisions. Must be verified in the end application. | |||||||
Packaging Specifications
| Part No. | Tape Width (W mm) | Pitch (P mm) | Tape Width (W1 mm) | Reel Diameter (A mm) | Reel Hub Diameter (B mm) | Reel Flange Diameter (C mm) | Reel Width (D mm) | Reel Quantity (PCS) | Inside Box Quantity (PCS) | Outside Carton Quantity (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR6045 | 16 | 12 | 7.5 | 16.4 | 100 | 13 | 330 | 1500 | 4500 | 18,000 |
| Cover Tape Peel Force: 10 to 120g | ||||||||||
| Noodle Strip Peeling Angle: 165 to 180 | ||||||||||
Reliability Testing
| Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal area; Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pull force applied gradually and maintained for 10 seconds, based on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm; Speed: 0.5mm/sec; Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance; No short and no open. | Drop packaged products from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. | Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Frequency: 10 to 55 Hz and back; Duration: 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | 100 cycles of temperature cycling (-55~40 to 85~125); Transforming interval: Max. 20 sec. |
| Low Temperature Storage | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: -55~-402; Duration: 962 hours. |
| High Temperature Storage | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: 125~852; Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10% (Mn-Zn: L/L30%); Q/Q30% (SMD series only); DCR/DCR10%. | Refer to reflow curve, performed twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristic normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristic normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided as a guideline. Users should adjust and confirm these conditions based on their specific soldering equipment, process, and environment.
Usage Reminders
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage.
- Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetism: Keep away from magnets or magnetic objects.
- Preheating: Ensure preheating before soldering, with a temperature difference not exceeding 150C between solder and chip temperature.
- Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
- Layout (Non-magnetic shield type): Careful coil layout is required to prevent malfunctions due to magnetic interference.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina