Molding SMD Power Inductor LanTu Micro SMS0865-6R8MT Ideal for PDA Notebook Desktop Server Applications
Molding SMD Power Inductors - SMS0865 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0865 Series offers ultra-high current SMD power inductors with a thin design, low DC resistance, and magnetic shielding for strong anti-electromagnetic interference. These inductors are ideal for high-density installations and offer high reliability due to their integral construction, providing excellent vibration resistance and ultra-low buzz noise. Their composite structure and low-loss alloy powder die-casting contribute to low impedance and small parasitic capacitance, ensuring high efficiency by reducing winding DC resistance and core eddy-current loss. The series is compliant with RoHS, Halogen Free, and REACH standards.
Key Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0865
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
Environmental Data
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification
SMS 0865 - [Inductance Code] [Tolerance Code] [Packing Code]
- Series Code: SMS0865
- External Dimensions (LWH): 9.08.16.5 mm
- Inductance Tolerance: J (5%), K (10%), L (15%), M (20%), P (25%), N (30%)
- Packing: B (Bulk Package), T (Tape & Reel)
Shape and Dimensions
| Part No | A (Max) | B (0.3) | C (Max) | D (0.3) | E (0.3) | F (Ref) | G (Ref) | H (Ref) |
|---|---|---|---|---|---|---|---|---|
| SMS0865 | 9.0 | 8.10 | 6.50 | 3.00 | 1.90 | 4.50 | 9.00 | 3.50 |
Specifications
| Part No | Inductance (H) | Inductance Tol. | DCR (m) | Saturation Current (A) | Heat Rating Current (A) |
|---|---|---|---|---|---|
| @100KHz, 1.0V | Typical | Typical | Typical | ||
| SMS0865-4R7M | 4.70 | 20% | 12.50 | 16.00 | 11.0 |
| SMS0865-6R8M | 6.80 | 20% | 19.00 | 13.00 | 9.00 |
| SMS0865-100M | 10.00 | 20% | 24.00 | 10.00 | 8.50 |
| SMS0865-150M | 15.00 | 20% | 24.50 | 8.30 | 8.00 |
| SMS0865-220M | 22.00 | 20% | 42.00 | 7.00 | 6.00 |
| SMS0865-330M | 33.00 | 20% | 89.00 | 6.00 | 4.50 |
| SMS0865-470M | 47.00 | 20% | 135.00 | 5.50 | 3.50 |
| SMS0865-680M | 68.00 | 20% | 180.00 | 4.50 | 4.00 |
| SMS0865-101M | 100.00 | 20% | 214.00 | 3.20 | 3.00 |
Notes on Current Ratings:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: the actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Special remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Absolute Maximum Voltage
- 75VDC
Packaging
Tape and Reel Specifications:
- Tape Dimension (mm): W=24.0, P=12.0, W1=11.5, Tape Width=24.4
- Reel Dimensions (mm): A=13, B=100, C=330, D=500
- Packing Quantity: Reel (500 PCS), Inside Box (1000 PCS), Outside Carton (4000 PCS)
Reliability Testing
Testing includes Terminal Strength (SMT & DIP), Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test. Specific requirements and test methods are detailed in the original documentation.
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm based on their specific environment and equipment.
Reminders for Using These Products
- Storage period is within 12 months under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less).
- Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands to prevent soldering issues.
- Handle products carefully to prevent damage.
- Do not bend terminals with excessive stress.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; ensure the temperature difference between solder and chip does not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid overheating.
- Allow sufficient thermal design margin for self-heating when power is on.
- For non-magnetic shield types, careful layout is needed to avoid malfunctions due to magnetic interference.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.