SMD Power Inductors LanTu Micro SNR5030-1R0MT Featuring Low DC Resistance and Magnetic Resin Shielded Construction
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Product Description
Product Overview
The SNR5030 Series are automatic assembly constructed, magnetic resin shielded SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. These inductors are designed to significantly reduce buzz noise to ultra-low levels due to their magnetic-resin shielded construction. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design that minimizes leakage flux and enhances EMI resistance, and a space-saving, power-efficient profile. Ideal for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, automotive products, and DC-DC converters, these inductors are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR5030
- Type: Magnetic Resin Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Construction: Magnetic-resin shielded, automatic assembly
- Magnetic Circuit: Closed magnetic circuit design
- Electrode: Metallization on Ferrite Core
Technical Specifications
Environmental Data:
| Parameter | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
Product Identification:
| Component | Description |
|---|---|
| SNR | Shielded SMD Power Inductors |
| 5030 | External Dimensions (LWH): 5.05.03.0 mm |
| Inductance Value (e.g., 470) | Inductance in H (e.g., 47 H) |
| M (Tolerance) | Inductance Tolerance (M: 20%) |
| T (Packing) | Packing Type (T: Tape & Reel) |
Shape and Dimensions:
| Part No | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| SNR5030 | 5.00.3 | 5.00.3 | 3.0 Max | 2.50.2 | 4.00.2 | 1.4 | 2.3 | 4.2 |
Electrical Characteristics:
| Part No | Inductance L(H) | Tol | DCR () Typical | DCR () Max | Saturation Current Isat (A) Max | Temperature Rise Current Irms (A) Max |
|---|---|---|---|---|---|---|
| SNR5030-1R0M | 1.0 | 20% | 0.016 | 0.020 | 7.00 | 4.00 |
| SNR5030-1R5N | 1.5 | 30% | 0.019 | 0.024 | 5.50 | 3.60 |
| SNR5030-2R2N | 2.2 | 30% | 0.025 | 0.031 | 4.50 | 3.20 |
| SNR5030-3R3N | 3.3 | 30% | 0.032 | 0.039 | 4.00 | 2.80 |
| SNR5030-4R7M | 4.7 | 20% | 0.052 | 0.065 | 3.00 | 2.20 |
| SNR5030-5R6N | 5.6 | 30% | 0.056 | 0.070 | 3.00 | 2.10 |
| SNR5030-6R8M | 6.8 | 20% | 0.060 | 0.075 | 2.80 | 2.00 |
| SNR5030-100M | 10 | 20% | 0.080 | 0.100 | 2.10 | 1.80 |
| SNR5030-150M | 15 | 20% | 0.125 | 0.156 | 1.70 | 1.40 |
| SNR5030-220M | 22 | 20% | 0.210 | 0.260 | 1.60 | 1.10 |
| SNR5030-330M | 33 | 20% | 0.330 | 0.410 | 1.20 | 0.85 |
| SNR5030-470M | 47 | 20% | 0.375 | 0.468 | 0.90 | 0.80 |
| SNR5030-101M | 100 | 20% | 0.800 | 0.988 | 0.75 | 0.56 |
| SNR5030-151M | 150 | 20% | 1.180 | 1.470 | 0.55 | 0.46 |
| SNR5030-221M | 220 | 20% | 1.700 | 2.080 | 0.45 | 0.39 |
| SNR5030-331M | 330 | 20% | 2.800 | 3.500 | 0.35 | 0.30 |
| SNR5030-471M | 470 | 20% | 3.800 | 4.700 | 0.30 | 0.26 |
| SNR5030-102M | 1000 | 20% | 8.700 | 10.800 | 0.20 | 0.17 |
Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Codes: B: Bulk Package, T: Tape & Reel
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Note: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Packaging: Tape and Reel Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR5030 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Cover tape peel off condition:
- a) Cover tape peel force shall be 10 to 120g
- b) Noodle strip peeling angle 165 to 180
Reliability Testing:
| Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified pull force requirements without loose terminal. | Reference documents: GB/T 2423.60-2008. Pulling test based on terminal sectional area. Solder with lead-free solder. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet specified pull force requirements without loose terminal. | Reference documents: GB/T 2423.60-2008. Pulling test based on terminal diameter. Solder with lead-free solder. Pull Force applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5312:1997. Solder to test jig, apply force in specified direction. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Reference documents: GB/T 2423.7-2018. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Reference documents: GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Reference documents: GB/T 2423.10-2019. Solder to jig, subjected to simple harmonic motion (10-55 Hz), 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Reference documents: GB/T 2423.22-2012 Method Na. 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Reference documents: GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Reference documents: GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Reference documents: GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | Reference documents: GJB 360B-2009. Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Reference documents: IEC 68-2-45:1993. Dip parts into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristic is normal after test. | Reference documents: JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristic is normal after test. | Reference documents: MIL-STD-202G Method 301. For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products:
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetism: Do not expose products to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for thermal design, as self-heating occurs when power is applied.
- Non-Magnetic Shield Type: For non-magnetic shield types, carefully consider coil layout to prevent malfunctions due to magnetic interference.
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Contact Person
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