High Current SMD Power Inductor LanTu Micro SMS252010-6R8MT with Low DC Resistance and Vibration Resistance
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The SMS252010 Series Ultra-high current SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installations requiring low DC resistance and ultra-high current capabilities. Featuring a thin design with magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability and excellent vibration resistance due to their T-core molding structure. They are ideal for applications demanding extremely low DCR and ultra-low AC losses at high switching frequencies, including DC/DC converters for notebook CPUs, mobile phones, tablets, servers, base stations, and various power modules. These products comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Common Mode Choke / Molding SMD Power Inductor
- Series: SMS252010
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|---|
| SMS252010-R22M | 0.22 | 20% | 12.0 | 17.0 | 8.60 | 6.80 | 2.52.01.0 |
| SMS252010-R24M | 0.24 | 20% | 12.0 | 17.5 | 8.50 | 6.70 | 2.52.01.0 |
| SMS252010-R33M | 0.33 | 20% | 13.0 | 19.0 | 7.60 | 6.50 | 2.52.01.0 |
| SMS252010-R47M | 0.47 | 20% | 15.0 | 22.0 | 6.90 | 6.10 | 2.52.01.0 |
| SMS252010-R68M | 0.68 | 20% | 23.0 | 27.0 | 5.90 | 5.60 | 2.52.01.0 |
| SMS252010-1R0M | 1.0 | 20% | 25.0 | 30.0 | 5.40 | 4.70 | 2.52.01.0 |
| SMS252010-1R5M | 1.5 | 20% | 45.0 | 55.0 | 4.30 | 3.40 | 2.52.01.0 |
| SMS252010-2R2M | 2.2 | 20% | 62.0 | 70.0 | 3.30 | 2.40 | 2.52.01.0 |
| SMS252010-3R3M | 3.3 | 20% | 86.0 | 100.0 | 2.80 | 2.50 | 2.52.01.0 |
| SMS252010-4R7M | 4.7 | 20% | 160.0 | 180.0 | 2.60 | 2.00 | 2.52.01.0 |
| SMS252010-6R8M | 6.8 | 20% | 270.0 | 320.0 | 2.40 | 1.60 | 2.52.01.0 |
| SMS252010-100M | 10 | 20% | 500.0 | 560.0 | 1.55 | 1.05 | 2.52.01.0 |
| SMS252010-220M | 22 | 20% | 1100.0 | 1300.0 | 1.10 | 0.85 | 2.52.01.0 |
| Environmental Data | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Product Identification | SMS | 252010 | R47 | M | T |
|---|---|---|---|---|---|
| Type | Molding SMD Power Inductor | ||||
| External Dimensions (LWH) (mm) | 2.52.01.0 | ||||
| Inductance | 0.47 uH | ||||
| Inductance Tolerance | M: 20% | ||||
| Packing | T: Tape & Reel |
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|
| SMS252010 | 8.0 | 4.0 | 3.5 | 3000 | 30,000 | 120,000 |
| Reliability Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test based on GB/T 2423.60-2008 |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pulling test based on GB/T 2423.60-2008 |
| Resistance to Flexure | No visible mechanical damage | JIS C 5321:1997 |
| Dropping | No case deformation or change in appearance; No short and no open | GB/T 2423.7-2018 |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage | GB/T 2423.28-2005 |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | GB/T 2423.10-2019 |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | GB/T 2423.22-2012 Method Na |
| Low temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | GB/T 2423.1-2008 Method Ab |
| High temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | GB/T 2423.2-2008 Method Bb |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | GB/T 2423.3-2016 |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10% | GJB 360B-2009 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | IEC 68-2-45:1993 |
| Overload test | During the test no smoke, no peculiar smell, no fire; The characteristic is normal after test | JIS C5311-6.13 |
| Voltage resistance test | During the test no breakdown; The characteristic is normal after test | MIL-STD-202G Method 301 |
Usage Precautions
- Store within 12 months under conditions: temperature 5~40C, humidity 35~65% RH or less.
- Avoid use and storage in corrosive environments (salt, acid, alkali, etc.).
- Do not touch terminals directly with bare hands to prevent solderability issues.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Keep away from magnets or magnetic objects.
- Preheat components before soldering; ensure temperature difference between solder and chip is within 150C.
- Soldering corrections after mounting should be within specified conditions to avoid overheating.
- Allow for sufficient thermal design margin due to self-heating when powered on.
- For non-magnetic shield types, careful layout is required to prevent malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina