SMD Power Inductor LanTu Micro SNR4030-4R7MT Magnetic Resin Shielded for EMI Shielding and Durability
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Product Description
Product Overview
The SNR4030 Series is an automatic assembly, magnetic resin shielded SMD power inductor designed to minimize buzz noise to ultra-low levels. It features a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, along with a metallization on the ferrite core for excellent shock resistance and durability. This series offers large current handling capabilities and low DCR, while also saving PCB real estate and power. It is widely used in applications such as LED backlights, flat-screen TVs, notebooks, servers, automotive products, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. (LANTU)
- Series: SNR4030
- Construction: Magnetic Resin Shielded SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Test Frequency (KHz) | Test Voltage (V) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|---|---|
| SNR4030-1R0M | 1.0 | 20% | 100 | 1.0 | 0.014 | 0.018 | 5.26 | 4.15 | 4.04.03.0 |
| SNR4030-1R2M | 1.2 | 20% | 100 | 1.0 | 0.015 | 0.020 | 5.26 | 3.82 | 4.04.03.0 |
| SNR4030-1R5M | 1.5 | 20% | 100 | 1.0 | 0.020 | 0.026 | 4.84 | 3.34 | 4.04.03.0 |
| SNR4030-1R8M | 1.8 | 20% | 100 | 1.0 | 0.025 | 0.033 | 4.84 | 3.20 | 4.04.03.0 |
| SNR4030-2R2M | 2.2 | 20% | 100 | 1.0 | 0.030 | 0.039 | 4.40 | 2.95 | 4.04.03.0 |
| SNR4030-3R3M | 3.3 | 20% | 100 | 1.0 | 0.040 | 0.050 | 3.30 | 2.40 | 4.04.03.0 |
| SNR4030-4R7M | 4.7 | 20% | 100 | 1.0 | 0.060 | 0.076 | 2.90 | 2.00 | 4.04.03.0 |
| SNR4030-5R6M | 5.6 | 20% | 100 | 1.0 | 0.073 | 0.091 | 2.75 | 1.90 | 4.04.03.0 |
| SNR4030-6R8M | 6.8 | 20% | 100 | 1.0 | 0.090 | 0.115 | 2.60 | 1.60 | 4.04.03.0 |
| SNR4030-8R2M | 8.2 | 20% | 100 | 1.0 | 0.095 | 0.122 | 2.10 | 1.60 | 4.04.03.0 |
| SNR4030-100M | 10 | 20% | 100 | 1.0 | 0.100 | 0.130 | 1.95 | 1.50 | 4.04.03.0 |
| SNR4030-120M | 12 | 20% | 100 | 1.0 | 0.135 | 0.172 | 1.70 | 1.30 | 4.04.03.0 |
| SNR4030-150M | 15 | 20% | 100 | 1.0 | 0.190 | 0.230 | 1.65 | 1.11 | 4.04.03.0 |
| SNR4030-220M | 22 | 20% | 100 | 1.0 | 0.225 | 0.290 | 1.30 | 1.00 | 4.04.03.0 |
| SNR4030-330M | 33 | 20% | 100 | 1.0 | 0.330 | 0.420 | 1.10 | 0.84 | 4.04.03.0 |
| SNR4030-470M | 47 | 20% | 100 | 1.0 | 0.445 | 0.570 | 0.95 | 0.72 | 4.04.03.0 |
| SNR4030-680M | 68 | 20% | 100 | 1.0 | 0.868 | 1.100 | 0.72 | 0.52 | 4.04.03.0 |
| SNR4030-820M | 82 | 20% | 100 | 1.0 | 1.060 | 1.280 | 0.66 | 0.47 | 4.04.03.0 |
| SNR4030-101M | 100 | 20% | 100 | 1.0 | 1.150 | 1.480 | 0.60 | 0.45 | 4.04.03.0 |
| SNR4030-121M | 120 | 20% | 100 | 1.0 | 1.350 | 1.700 | 0.55 | 0.42 | 4.04.03.0 |
| Inductance Tolerance Codes | Description |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
| Packing Codes | Description |
|---|---|
| B | Bulk Package |
| T | Tape & Reel |
| Environmental Data | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Shape and Dimensions (mm) | A | B | C | D | E | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| SNR4030 | 4.00.3 | 4.00.3 | 3.0 Max | 2.10.2 | 3.30.2 | 1.1 | 1.9 | 3.7 |
| Packaging | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR4030 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
| Reliability Testing Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet the above requirements without any loose terminal | 1. Pulling test: Define: A: sectional area of terminal A8mm2 force5N time:30sec; 8mm2 3. Solder the inductor to the testing jig using leadfree solder. Then apply a force in the terminal. Keep time: 101s Speed: 1.0mm/s. |
| Meet the above requirements without any loose terminal. | Reference documents: GB/T 2423.60-2008 Pull Force:the force shall be applied gradually to the terminal and then maintained for 10 seconds. | |
| Resistance to Flexure | 1. No visible mechanical damage. 2. | JIS C 5321:1997 1. Solder the inductor to the test jig (glass epoxy board shown in ) Using a leadfree solder. Then apply a force in the direction shown 3. Flexure: 2mm. 4. Pressurizing Speed: 0.5mm/sec. 5. Keep time: 30 sec. |
| Dropping | 1. No case deformation or change in appearance. 2. No short and no open. | Reference documents: GB/T 2423.7-2018 1. Drop the packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | 1. No visible mechanical damage. 2. Wetting shall exceed 75% coverage for 3. Terminals must have 95% minimum solder coverage | Reference documents: GB/T 2423.28-2005 1. Solder temperature:2402 2. Duration: 3 sec. 3. Solder: Sn/3.0Ag/0.5Cu. 4. Flux: 25% Resin and 75% ethanol in weight |
| Vibration | 1. No visible mechanical damage. 2. Inductance change: Within 10%. 3. Q factor change: Within 20%. | Reference documents: GB/T 2423.10-2019 1. Solder the inductor to the testing jig (glass epoxy board shown in ) using leadfree solder. 2. The inductor shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. 3. The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions(total of 6 hours). |
| Thermal Shock | 1. No visible mechanical damage. 2. Inductance change: Within 10%.(Mn-Zn: Within 30% ) 3. Q factor change: Within 20%. | Reference documents: GB/T 2423.22-2012 Method Na 1. Start at ( 85~125) for T time, rush to (-55~40) for T time as one cycle, go through 100 cycles. 2. Transforming interval: Max. 20 sec. 3. Tested cycle: 100 cycles. 4. The chip shall be stabilized at normal condition for 1~2 hours |
| Low temperature Storage | 1. No visible mechanical damage. 2. Inductance change: Within 10%.(Mn-Zn: Within 30% ) 3. Q factor change: Within 20%. | Reference documents: GB/T 2423.1-2008 Method Ab 1. Temperature:M(-55~-402) 2. Duration: 962 hours 3. The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| High temperature Storage | 1. No visible mechanical damage. 2. Inductance change: Within 10%.(Mn-Zn: Within 30% ) 3. Q factor change: Within 20%. | Reference documents: GB/T 2423.2-2008 Method Bb 1. Temperature:N(125~852). 2. Duration: 962 hours 3. The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | 1. No visible mechanical damage. 2. Inductance change: Within 10%.(Mn-Zn: Within 30% ) 3. Q factor change: Within 20%. | Reference documents: GB/T 2423.3-2016 1. Temperature: 602 2. Humidity: 90% to 95% RH. 3. Duration: 962 hours. 4. The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | 1. No significant defects in appearance. 2. L/L10% (Mn-Zn: L/L30% ) 3. Q/Q30% SMD series only 4. DCR/DCR10% | Reference documents: GJB 360B-2009 1. Refer to the above reflow curve and go through the reflow for twice. 2. The peak temperature : 260+0/-5 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Reference documents: IEC 68-2-45:1993 To dip parts into IPA solvent for 50.5Min, then drying them at room temp for 5Min, at last, to brushing making 10 times. |
| Overload test | 1. During the test no smoke, no peculiar, smell, no fire 2. The characteristic is normal after test | Reference documents: JIS C5311-6.13 Apply twice as rated current for 5 minutes. |
| Voltage resistance test | 1. During the test no breakdown 2. The characteristic is normal after test | Reference documents: MIL-STD-202G Method 301 1. For parts with two coils 2. DC1000V, Current: 1mA, Time: 1Min. 3. Refer to catalogue of specific products |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products
- Storage period is within 12 months. Storage conditions: temperature: 5~40C, humidity: 35 to 65% RH or less.
- Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Avoid touching electrodes directly with bare hands due to oil secretions.
- Handle products carefully to prevent damage from dropping or inappropriate removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specification limits. Overheating may cause short circuits, performance deterioration, or lifespan shortening.
- Allow for sufficient thermal design margin as self-heating occurs when power is ON.
- For non-magnetic shielded types, careful coil layout is needed to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina