SMD Power Inductor LanTu Micro SNR4020-6R8MT for Automotive Systems and DC DC Converter Applications
Product Overview
The LANTU SNR4020 Series are automatic assembly, magnetic resin shielded SMD power inductors designed to reduce buzz noise to ultra-low levels. They feature a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, large current capacity, and low DC resistance. These space-saving and power-efficient inductors are suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, automotive systems, and DC-DC converters. They comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: LANTU
- Series: SNR4020
- Construction: Magnetic Resin Shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Test Frequency | Test Voltage | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|---|---|---|
| SNR4020-R47M | 0.47 | 20% | 100KHz | 1.0V | 0.022 | 0.029 | 7.00 | 3.30 | 4.04.02.0 |
| SNR4020-1R0M | 1.0 | 20% | 100KHz | 1.0V | 0.029 | 0.038 | 4.78 | 2.15 | 4.04.02.0 |
| SNR4020-1R5M | 1.5 | 20% | 100KHz | 1.0V | 0.035 | 0.045 | 4.45 | 2.15 | 4.04.02.0 |
| SNR4020-2R2M | 2.2 | 20% | 100KHz | 1.0V | 0.035 | 0.046 | 3.40 | 1.85 | 4.04.02.0 |
| SNR4020-3R3M | 3.3 | 20% | 100KHz | 1.0V | 0.070 | 0.091 | 3.20 | 1.40 | 4.04.02.0 |
| SNR4020-4R7M | 4.7 | 20% | 100KHz | 1.0V | 0.075 | 0.098 | 2.35 | 1.34 | 4.04.02.0 |
| SNR4020-6R8M | 6.8 | 20% | 100KHz | 1.0V | 0.125 | 0.163 | 2.20 | 1.04 | 4.04.02.0 |
| SNR4020-8R2M | 8.2 | 20% | 100KHz | 1.0V | 0.148 | 0.185 | 1.75 | 1.00 | 4.04.02.0 |
| SNR4020-100M | 10 | 20% | 100KHz | 1.0V | 0.165 | 0.215 | 1.60 | 0.90 | 4.04.02.0 |
| SNR4020-150M | 15 | 20% | 100KHz | 1.0V | 0.230 | 0.300 | 1.35 | 0.77 | 4.04.02.0 |
| SNR4020-220M | 22 | 20% | 100KHz | 1.0V | 0.350 | 0.455 | 1.05 | 0.62 | 4.04.02.0 |
| SNR4020-330M | 33 | 20% | 100KHz | 1.0V | 0.550 | 0.710 | 0.85 | 0.49 | 4.04.02.0 |
| SNR4020-470M | 47 | 20% | 100KHz | 1.0V | 0.710 | 0.920 | 0.74 | 0.44 | 4.04.02.0 |
| SNR4020-680M | 68 | 20% | 100KHz | 1.0V | 1.060 | 1.380 | 0.60 | 0.36 | 4.04.02.0 |
| Inductance Tolerance Options: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |||||||||
| Packing Options: B: Bulk Package, T: Tape & Reel | |||||||||
| Operating Temperature: -40 to +125 (Including coils self-temperature rise) | |||||||||
| Shape and Dimensions (mm): A: 4.00.3, B: 4.00.3, C: 2.0 Max, D: 2.10.2, E: 3.30.2, F: 1.1 Typ, G: 1.9 Typ, H: 3.7 Typ | |||||||||
| Saturation Current Definition: DC current at which inductance drops 30% from its value without current. | |||||||||
| Temperature Rise Current Definition: The actual value of DC current when the temperature rise is T 40 (Ta=25). | |||||||||
| Rated DC Current: The lesser value between Saturation Current and Temperature Rise Current. | |||||||||
Applications
- LED backlight
- Flat-screen TVs
- Blue-ray disc players
- Set-top boxes
- Notebook computers
- Desktop computers
- Servers
- Graphic cards
- Portable gaming devices
- Personal navigation systems
- Personal multimedia devices
- Automotive systems
- Telecommunication base stations
- DC-DC Converters
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. Force applied gradually and maintained for 101s at 1.0mm/s speed. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Applied force varies with terminal diameter (5N to 40N) for 10sec. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5311:1997. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Packaged products dropped from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Simple harmonic motion, 10 to 55 Hz, 1.5mm amplitude, 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature shock between (-55~40) and (85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | GJB 360B-2009. Reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | JIS C5311-6.13. Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to LANTU's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to grease affecting solderability. Handle carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact LANTU if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for self-heating when power is ON.
- Layout: For non-magnetic shielded types, careful coil layout is required to prevent malfunction due to magnetic interference.
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