molding SMD power inductor LanTu Micro SMS0530 6R8MT with low loss alloy powder die casting material
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Product Description
Molding SMD Power Inductors - SMS0530 Series
Product Overview
The SMS0530 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors with a thin design, low DC resistance, and magnetic shielding for strong anti-electromagnetic interference. These high-reliability inductors feature an integral construction for excellent vibration resistance and a composite structure for ultra-low buzz noise. Utilizing low-loss alloy powder die-casting, they provide low impedance and small parasitic capacitance, leading to high efficiency and reduced core eddy-current loss. Suitable for applications up to 3MHz with a maximum voltage of 30VDC, these inductors are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Origin: SHENZHEN, CHINA
- Product Type: Molding SMD Power Inductor
- Series: SMS0530
- Certifications: RoHS, Halogen Free, REACH Compliance
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Technical Specifications
General Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coil self-temperature rise) |
| Maximum Voltage | 30VDC |
| Frequency | Up to 3MHz |
| External Dimensions (LWH) | 5.55.23.0 mm |
| Inductance Tolerance | J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Packing Options | Bulk (B), Tape & Reel (T) |
Electrical Characteristics (at 25)
| Part No. | Inductance (H) @ 100KHz, 1.0V | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|---|
| SMS0530-R22M | 0.22 | 20% | 3.5 | 3.9 | 15.00 | 14.00 |
| SMS0530-R33M | 0.33 | 20% | 4.6 | 5.5 | 14.40 | 13.10 |
| SMS0530-R47M | 0.47 | 20% | 7.4 | 8.5 | 14.00 | 11.00 |
| SMS0530-R68M | 0.68 | 20% | 11.0 | 12.0 | 12.00 | 9.50 |
| SMS0530-1R0M | 1.0 | 20% | 12.0 | 15.0 | 10.00 | 9.00 |
| SMS0530-1R2M | 1.2 | 20% | 15.0 | 16.0 | 9.50 | 8.50 |
| SMS0530-1R5M | 1.5 | 20% | 20.0 | 25.0 | 9.00 | 7.50 |
| SMS0530-2R2M | 2.2 | 20% | 31.0 | 35.0 | 7.00 | 6.50 |
| SMS0530-3R3M | 3.3 | 20% | 35.0 | 46.0 | 6.00 | 5.00 |
| SMS0530-4R7M | 4.7 | 20% | 50.0 | 60.0 | 5.00 | 4.50 |
| SMS0530-6R8M | 6.8 | 20% | 102.0 | 110.0 | 4.00 | 3.50 |
| SMS0530-100M | 10 | 20% | 110.0 | 125.0 | 3.50 | 3.20 |
| SMS0530-150M | 15 | 20% | 175.0 | 215.0 | 2.50 | 2.20 |
| SMS0530-220M | 22 | 20% | 320.0 | 394.8 | 2.00 | 1.80 |
Note: Saturation Current is defined as the DC current at which inductance drops 30% from its value without current. Heat Rating Current is the actual DC current when the temperature rise is T 40 (Ta=25). Rated DC Current is the lesser of Isat or Irms. Part temperature should be verified in the end application.
Shape and Dimensions
| ITEM | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0530 | 5.500.30 | 5.200.20 | 3.00Max | 2.30 Typ | 1.20 Typ | 3.00 | 7.00 | 2.50 |
(Dimensions are in mm)
Recommended Land Pattern
| ITEM | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0530 | 5.500.30 | 5.200.20 | 3.00Max | 2.30 Typ | 1.20 Typ | 3.00 | 7.00 | 2.50 |
(Dimensions are in mm)
Test Equipment
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0530 | 12.0 | 8.0 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
(Dimensions are in mm)
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on sectional area of terminal. Solder with lead-free solder. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (0.35mm to >1.25mm). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force (2mm flexure), Speed: 0.5mm/sec, Keep time: 30 sec. (JIS C 5321:1997) |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. (GB/T 2423.7-2018) |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. (GB/T 2423.28-2005) |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to testing jig, subjected to harmonic motion (10-55 Hz, 1.5mm amplitude) for 2 hours in 3 perpendicular directions. (GB/T 2423.10-2019) |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec. (GB/T 2423.22-2012 Method Na) |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402, Duration: 962 hours. (GB/T 2423.1-2008 Method Ab) |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852, Duration: 962 hours. (GB/T 2423.2-2008 Method Bb) |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours. (GB/T 2423.3-2016) |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5. (GJB 360B-2009) |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. (IEC 68-2-45:1993) |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. (JIS C5311-6.13) |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (MIL-STD-202G Method 301) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm based on their specific environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH or less.
- Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid touching terminals with bare hands due to oil secretions. Handle carefully to prevent damage.
- Bending: Do not bend terminals with excessive stress.
- Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
- Magnets: Do not expose to magnets or magnetic fields.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for self-heating when power is on.
- Non-Magnetic Shield Type: Careful layout is required on the PCB to avoid malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina