Molding SMD Power Inductor LanTu Micro SMS0420-1R5MT Ultra High Current Low DC Resistance Thin Design
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Product Description
Molding SMD Power Inductors - SMS0420 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0420 Series are ultra-high current SMD power inductors designed for high-density installations. Featuring a thin profile with low DC resistance and ultra-high current capabilities, these magnetically shielded inductors offer strong anti-electromagnetic interference. Their integral construction provides high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. These inductors are die-cast using low-loss alloy powder for low impedance and small parasitic capacitance, ensuring high efficiency. They are suitable for applications up to 3MHz and have an absolute maximum voltage of 30VDC. The series is RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS0420
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company location)
Technical Specifications
General Features
| Feature | Description |
|---|---|
| Design | Thin design with low DC resistance and ultra-high current |
| Shielding | Magnetic shielding type, strong anti-electromagnetic interference |
| Construction | Integral construction for high reliability and vibration resistance |
| Noise | Ultra-low buzz noise due to composite construction |
| Material | Low-loss alloy powder die-casting |
| Impedance & Capacitance | Low impedance, small parasitic capacitance |
| Efficiency | High efficiency, reduced eddy-current loss |
| Frequency Range | Up to 3MHz |
| Max Voltage | 30VDC |
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Environmental Data
| Parameter | Value |
|---|---|
| Operating Temperature | -55 to +125 (including coil self-temperature rise) |
Test Equipment
| Parameter | Equipment |
|---|---|
| Inductance (L) | WK3260B LCR meter or equivalent |
| Saturation Current (Isat) & Heat Rating Current (Irms) | WK3260B+WK3265B or equivalent |
| DC Resistance (DCR) | Chroma 16502 or equivalent |
Product Identification
Format: SMS 0420 [Inductance] M T
| Component | Description |
|---|---|
| SMS 0420 | Molding SMD Power Inductor Series |
| Inductance | e.g., 100 (10 uH) |
| M | Tolerance (20%) |
| T | Packaging Type (Tape & Reel) |
Dimensions
| Part No. | L (mm) | W (mm) | H (mm) | Typ (mm) | Typ (mm) | Typ (mm) | Typ (mm) |
|---|---|---|---|---|---|---|---|
| SMS0420 | 4.600.30 | 4.200.20 | 2.00Max | 1.50Typ | 0.80 Typ | 2.20 | 2.50 |
Electrical Characteristics
| Part No. | Inductance (H) @ 100KHz, 1.0V | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|---|
| SMS0420-R10M | 0.10 | 20% | 3.5 | 4.0 | 25.00 | 13.00 |
| SMS0420-R22M | 0.22 | 20% | 6.0 | 6.8 | 13.00 | 9.50 |
| SMS0420-R33M | 0.33 | 20% | 8.0 | 11.0 | 11.00 | 7.00 |
| SMS0420-R47M | 0.47 | 20% | 12.0 | 14.0 | 9.50 | 8.00 |
| SMS0420-R56M | 0.56 | 20% | 14.0 | 16.0 | 9.00 | 7.00 |
| SMS0420-R68M | 0.68 | 20% | 18.0 | 21.0 | 8.00 | 7.00 |
| SMS0420-1R0M | 1.0 | 20% | 24.0 | 27.0 | 7.00 | 6.00 |
| SMS0420-1R2M | 1.2 | 20% | 25.0 | 27.0 | 6.00 | 5.50 |
| SMS0420-1R5M | 1.5 | 20% | 40.0 | 46.0 | 5.50 | 5.00 |
| SMS0420-2R2M | 2.2 | 20% | 52.0 | 58.0 | 5.00 | 4.50 |
| SMS0420-3R3M | 3.3 | 20% | 70.0 | 87.0 | 4.00 | 3.50 |
| SMS0420-4R7M | 4.7 | 20% | 105.0 | 126.0 | 3.00 | 2.80 |
| SMS0420-6R8M | 6.8 | 20% | 120.0 | 135.0 | 2.50 | 2.40 |
| SMS0420-100M | 10 | 20% | 220.0 | 258.0 | 2.00 | 1.60 |
| SMS0420-150M | 15 | 20% | 280.0 | 320.0 | 1.90 | 1.40 |
| SMS0420-220M | 22 | 20% | 450.0 | 510.0 | 1.50 | 1.20 |
Inductance Tolerance
J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0420 | 12.0 | 8.0 | 5.5 | 12.4 | 100 | 13 | 330 | 3000 | 12,000 | 48,000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without loose terminal | Pulling test (force varies by terminal area), Solder paste thickness: 0.12mm. Speed: 1.0mm/s. Keep time: 101s. |
| Terminal Strength (DIP) | Meet requirements without loose terminal | Pull force applied gradually (force varies by terminal diameter). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency: 10 to 55 Hz (traversed in 1 min). Applied for 2 hours in 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended reflow soldering curve
Users should adjust and confirm reflow conditions according to their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate if storage period elapses.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for thermal design due to self-heating when power is on.
- Non-Magnetic Shield Type: Carefully lay out coils in circuit board design to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina