High Current Molding SMD Power Inductor LanTu Micro SMS0630-1R0MT Low DC Resistance Magnetic Shielded
Molding SMD Power Inductors - SMS0630 Series
Product Overview
The SMS0630 Series Ultra-high current SMD power inductors are designed for high-density installation and demanding applications. Featuring a thin profile with low DC resistance and ultra-high current capability, these magnetically shielded inductors offer strong anti-electromagnetic interference. Their integral construction provides high reliability and excellent vibration resistance, while the composite structure ensures ultra-low buzz noise. Manufactured using low-loss alloy powder die-casting, they exhibit low impedance and small parasitic capacitance, leading to high efficiency and reduced core eddy-current loss. These inductors support frequencies up to 3MHz and have an absolute maximum voltage of 30VDC, complying with RoHS, Halogen Free, and REACH standards.
Applications
These inductors are suitable for PDA, notebook, desktop, and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0630
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No | Inductance (H) @0A | Tolerance | DCR (m) Typical | Saturation Current Typical (A) | Heat Rating Current Typical (A) | Dimensions (LWH mm) | Operating Temperature (C) |
|---|---|---|---|---|---|---|---|
| SMS0630-R10M | 0.10 | 20% | 1.40 | 60.00 | 32.00 | 7.16.63.0 | -55 to +125 |
| SMS0630-R15M | 0.15 | 20% | 1.55 | 41.00 | 30.00 | 7.16.63.0 | -55 to +125 |
| SMS0630-R22M | 0.22 | 20% | 1.60 | 35.00 | 25.00 | 7.16.63.0 | -55 to +125 |
| SMS0630-R47M | 0.47 | 20% | 4.00 | 20.00 | 18.00 | 7.16.63.0 | -55 to +125 |
| SMS0630-R68M | 0.68 | 20% | 4.75 | 19.00 | 16.00 | 7.16.63.0 | -55 to +125 |
| SMS0630-1R0M | 1.0 | 20% | 7.60 | 16.00 | 13.00 | 7.16.63.0 | -55 to +125 |
| SMS0630-1R5M | 1.5 | 20% | 13.20 | 14.00 | 12.50 | 7.16.63.0 | -55 to +125 |
| SMS0630-2R2M | 2.2 | 20% | 16.50 | 11.50 | 8.50 | 7.16.63.0 | -55 to +125 |
| SMS0630-3R3M | 3.3 | 20% | 24.50 | 9.50 | 7.00 | 7.16.63.0 | -55 to +125 |
| SMS0630-4R7M | 4.7 | 20% | 35.00 | 6.55 | 6.00 | 7.16.63.0 | -55 to +125 |
| SMS0630-5R6M | 5.6 | 20% | 36.00 | 6.35 | 5.70 | 7.16.63.0 | -55 to +125 |
| SMS0630-6R8M | 6.8 | 20% | 44.30 | 6.00 | 5.10 | 7.16.63.0 | -55 to +125 |
| SMS0630-8R2M | 8.2 | 20% | 60.00 | 6.00 | 5.00 | 7.16.63.0 | -55 to +125 |
| SMS0630-100M | 10 | 20% | 64.50 | 5.50 | 4.50 | 7.16.63.0 | -55 to +125 |
| SMS0630-150M | 15 | 20% | 103.00 | 4.50 | 3.10 | 7.16.63.0 | -55 to +125 |
| SMS0630-220M | 22 | 20% | 180.00 | 3.50 | 2.60 | 7.16.63.0 | -55 to +125 |
| SMS0630-330M | 33 | 20% | 250.00 | 3.00 | 2.00 | 7.16.63.0 | -55 to +125 |
| SMS0630-470M | 47 | 20% | 310.00 | 2.00 | 1.50 | 7.16.63.0 | -55 to +125 |
Dimensions
| Part No | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|
| SMS0630 | 7.100.30 | 6.600.20 | 3.00Max | 3.00 Typ | 1.60 Typ | 3.70 | 8.40 | 3.50 |
Packaging
Tape and Reel Specifications:
Reel dimensions (mm): A=100, B=13, C=330, D=1000
Tape Dimension (mm): W=16.0, P=12.0, W1=7.5
Quantity: REEL (PCS) = 100, Inside Box (PCS) = 3000, Outside Carton (PCS) = 12,000
Cover tape peel off condition:
a) Cover tape peel force: 10 to 120g
b) Noodle strip peeling angle: 165 to 180
Packing quantity: REEL 13 PE Bag. Inside Box, Outside Carton. Insufficient full boxes will be filled with inner boxes or cushioning material.
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without loose terminal. | Pulling test: Force based on terminal area (5N to 20N). Solder paste thickness: 0.12mm. Keep time: 101s. Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without loose terminal. | Applied force based on terminal diameter (5N to 40N). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency 10-55 Hz, amplitude 1.5mm. Applied for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock between (-55~40) and (85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended reflow soldering curve
The recommended reflow conditions are provided as a guideline. Users should adjust and confirm according to their specific environment, equipment, and process conditions.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that may inhibit soldering. Handle products carefully to prevent damage.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetism: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is ON; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
Get in Touch
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