High Saturation LanTu Micro SSD1306-221MT Unshielded SMD Power Inductors for Demanding Environments
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Product Description
Product Overview
The LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SSD1306 Series Unshielded SMD Power Inductors are designed for high power applications, featuring high saturation and low DC resistance. These unshielded inductors are suitable for surface mounting equipment and are available in various package sizes with a wide inductance range. They comply with RoHS, Halogen Free, and REACH standards, making them ideal for use in demanding electronic environments. Applications include power supplies for VTRs, LCD televisions, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SSD1306
- Type: Unshielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: SHENZHEN
Technical Specifications
General Specifications
| Item | Specification |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Inductance Tolerance | J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Packing | Bulk Package (B), Tape & Reel (T) |
| External Dimensions (LWH) | 18.5415.24x7.11 mm (for 1306 package) |
Electrical Characteristics (Electrical specifications at 25)
| Part No | Inductance (H) @0A | Tole | Test Freq | SRF Typ (MHz) | DCR Max () | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SSD1306-1R0M | 1.0 | 20% | 100KHz | 80 | 0.009 | 20.00 | 8.60 |
| SSD1306-2R2M | 2.2 | 20% | 100KHz | 80 | 0.014 | 16.00 | 7.10 |
| SSD1306-3R3M | 3.3 | 20% | 100KHz | 60 | 0.018 | 14.00 | 6.20 |
| SSD1306-5R6M | 5.6 | 20% | 100KHz | 40 | 0.020 | 12.00 | 5.30 |
| SSD1306-100M | 10 | 20% | 100KHz | 30 | 0.031 | 10.00 | 4.30 |
| SSD1306-150M | 15 | 20% | 100KHz | 22 | 0.036 | 8.00 | 4.00 |
| SSD1306-220M | 22 | 20% | 100KHz | 20 | 0.047 | 7.00 | 3.50 |
| SSD1306-330M | 33 | 20% | 100KHz | 15 | 0.066 | 5.50 | 3.00 |
| SSD1306-470M | 47 | 20% | 100KHz | 9 | 0.086 | 4.50 | 2.60 |
| SSD1306-680M | 68 | 20% | 100KHz | 8 | 0.130 | 4.00 | 2.30 |
| SSD1306-101M | 100 | 20% | 100KHz | 7 | 0.190 | 3.00 | 1.80 |
| SSD1306-151M | 150 | 20% | 100KHz | 6 | 0.250 | 2.60 | 1.50 |
| SSD1306-221M | 220 | 20% | 100KHz | 5 | 0.380 | 2.40 | 1.20 |
| SSD1306-331M | 330 | 20% | 100KHz | 4 | 0.560 | 1.90 | 1.00 |
| SSD1306-471M | 470 | 20% | 100KHz | 3 | 0.850 | 1.40 | 0.82 |
| SSD1306-681M | 680 | 20% | 100KHz | 2.5 | 1.100 | 1.20 | 0.72 |
| SSD1306-102M | 1000 | 20% | 100KHz | 2 | 1.800 | 1.00 | 0.56 |
Definitions:
- Saturation Current: DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
Package & Dimensions
| Part No | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SSD1306 | 32 | 20 | 14.2 | 32.4 | 100 | 13 | 330 | 250 | 500 | 2000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. Force applied gradually and maintained for 10 sec. Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Applied force varies with terminal diameter (5N to 40N). Duration: 10 sec. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Packaged products dropped from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Simple harmonic motion, frequency varied between 10 and 55 Hz. Applied for 2 hours in each of 3 mutually perpendicular directions (total of 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | GJB 360B-2009. Refer to reflow curve, performed twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip parts into IPA solvent for 50.5Min, then drying at room temp for 5Min, brushing making 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristic is normal after test. | JIS C5311-6.13. Apply twice the rated current for 5 minutes. Performed twice. |
| Voltage resistance test | During the test no breakdown. Characteristic is normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment and equipment.
Reminders for Using These Products
- Storage period is within 12 months under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less).
- Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; the temperature difference between solder and chip temperature should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions; overheating may cause issues.
- Allow for sufficient thermal design margin due to self-heating when power is ON.
- For non-magnetic shield types, careful coil layout is required to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina