molding SMD power inductor LanTu Micro SMS0650-4R7MT with RoHS Halogen Free and REACH compliance
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Product Description
Product Overview
The SMS0650 Series by Shenzhen Lantu Micro Electric Technology Co., Ltd. are ultra-high current, thin-profile SMD power inductors designed for high-density installations. These magnetically shielded inductors offer strong anti-electromagnetic interference capabilities, high reliability with an integral construction for excellent vibration resistance, and ultra-low buzz noise due to their composite structure. They feature low DC resistance, low impedance, and small parasitic capacitance, contributing to high efficiency and reduced core eddy-current loss. Suitable for applications up to 3MHz, these inductors are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0650
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China
Technical Specifications
General Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Maximum Voltage | 30VDC |
| Frequency Range | Up to 3MHz |
Electrical Characteristics
| Part No. | Inductance (H) @ 100KHz, 1.0V | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|---|
| SMS0650-R22M | 0.22 | 20% | 1.1 | 1.3 | 40.00 | 30.00 |
| SMS0650-R47M | 0.47 | 20% | 3.2 | 3.8 | 24.00 | 20.00 |
| SMS0650-R56M | 0.56 | 20% | 3.4 | 3.9 | 20.00 | 18.00 |
| SMS0650-R68M | 0.68 | 20% | 3.9 | 4.2 | 17.00 | 17.50 |
| SMS0650-R82M | 0.82 | 20% | 4.6 | 4.9 | 17.00 | 17.00 |
| SMS0650-1R0M | 1.00 | 20% | 6.5 | 8.5 | 16.50 | 13.00 |
| SMS0650-1R5M | 1.50 | 20% | 7.0 | 10.0 | 12.70 | 12.00 |
| SMS0650-2R2M | 2.20 | 20% | 11.2 | 13.6 | 12.50 | 11.00 |
| SMS0650-3R3M | 3.30 | 20% | 20.0 | 22.0 | 9.00 | 8.50 |
| SMS0650-4R7M | 4.70 | 20% | 26.0 | 30.0 | 8.00 | 6.70 |
| SMS0650-5R6M | 5.60 | 20% | 31.0 | 36.0 | 7.60 | 5.80 |
| SMS0650-6R8M | 6.80 | 20% | 36.5 | 41.0 | 7.30 | 5.50 |
| SMS0650-100M | 10.00 | 20% | 48.0 | 55.0 | 5.50 | 4.70 |
| SMS0650-150M | 15.00 | 20% | 77.0 | 85.0 | 5.00 | 4.00 |
| SMS0650-220M | 22.00 | 20% | 125.0 | 140.0 | 4.00 | 3.20 |
| SMS0650-330M | 33.00 | 20% | 150.0 | 200.0 | 3.30 | 2.80 |
| SMS0650-470M | 47.00 | 20% | 260.0 | 300.0 | 2.80 | 2.20 |
| SMS0650-680M | 68.00 | 20% | 340.0 | 442.0 | 2.20 | 1.80 |
| SMS0650-101M | 100.00 | 20% | 595.0 | 720.0 | 2.00 | 1.50 |
Inductance Tolerance Codes
| Code | Tolerance |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Dimensions (mm)
| Part No. | L | W | H (Max) | A (Typ) | B (Typ) | C | D |
|---|---|---|---|---|---|---|---|
| SMS0650 | 7.100.30 | 6.600.20 | 5.00 | 3.00 | 1.60 | 3.70 | 8.40 |
Product Identification Example
SMS 0650 100 M T
- SMS: Type
- 0650: External Dimensions (LWH) in mm
- 100: Inductance (e.g., 100 = 10 H)
- M: Tolerance (e.g., M = 20%)
- T: Packing (e.g., T = Tape & Reel)
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Test Equipment
- Inductance: WK3260B LCR meter or equivalent
- Saturation & Heat Rating Current: WK3260B+WK3265B or equivalent
- DC Resistance: Chroma 16502 or equivalent
Definitions
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser of Isat or Irms.
Packaging Information
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0650 | 16.0 | 12.0 | 7.5 | 16.4 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test based on terminal area; Solder paste thickness: 0.12mm; Keep time: 101s; Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Applied force based on terminal diameter (0.35mm to >1.25mm); Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Solder to jig, apply force of 2mm flexure, Speed: 0.5mm/sec, Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance; No short and no open. | Drop packaged products from 1m height (1 angle, 3 ridges, 6 surfaces, twice each direction). |
| Solderability | No visible mechanical damage; Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. | Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Solder to jig, subject to harmonic motion (10-55 Hz), 2 hours each of 3 perpendicular directions. |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: 30%); Q factor change: Within 20%. | 100 cycles of temperature transition between (85~125) and (-55~40); Transforming interval: Max. 20 sec. |
| Low Temperature Storage | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: 30%); Q factor change: Within 20%. | Temperature: -55~-402; Duration: 962 hours. |
| High Temperature Storage | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: 30%); Q factor change: Within 20%. | Temperature: 125~852; Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: 30%); Q factor change: Within 20%. | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours. |
| Heat Endurance of Reflow Soldering | No significant defects in appearance; L/L10% (Mn-Zn: 30%); Q/Q30% (SMD series only); DCR/DCR10%. | Twice reflow soldering; Peak temperature: 260+0/-5. |
| Resistance to Solvent Test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload Test | During test: no smoke, no peculiar smell, no fire; Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage Resistance Test | During test: no breakdown; Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min (for parts with two coils). |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for thermal design as self-heating occurs when power is on.
- Non-Magnetic Shield Type: Carefully lay out coils in the circuit board design to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina