SMD Power Inductor LanTu Micro SNR3015-4R7MT with Magnetic Resin Shielding and Low DC Resistance
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Product Description
Product Overview
The SNR3015 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. is an automatic assembly constructed, magnetic resin shielded SMD power inductor. This series is designed to significantly reduce buzz noise to ultra-low levels due to its magnetic-resin shielded construction. Key benefits include large current handling capability with low DC resistance, excellent shock resistance and damage-free durability thanks to metallization on the ferrite core, and strong EMI resistance from its closed magnetic circuit design. These inductors are space-saving and power-efficient, making them suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, graphics cards, automotive systems, and DC-DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC
- Origin: SHENZHEN, CHINA
- Product Series: SNR3015
- Construction: Automatic assembly, Magnetic resin shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part Number | Inductance (H) | Inductance Tolerance | Frequency (100KHz) | Test Voltage (1.0V) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|---|
| SNR3015-R47M | 0.47 | 20% | 100KHz | 1.0V | 0.024 | 0.035 | 2.50 | 2.60 |
| SNR3015-1R0M | 1.0 | 20% | 100KHz | 1.0V | 0.030 | 0.039 | 2.32 | 2.35 |
| SNR3015-1R5M | 1.5 | 20% | 100KHz | 1.0V | 0.050 | 0.065 | 2.30 | 1.70 |
| SNR3015-1R8M | 1.8 | 20% | 100KHz | 1.0V | 0.050 | 0.065 | 1.75 | 1.70 |
| SNR3015-2R2M | 2.2 | 20% | 100KHz | 1.0V | 0.060 | 0.078 | 1.60 | 1.60 |
| SNR3015-3R3M | 3.3 | 20% | 100KHz | 1.0V | 0.080 | 0.104 | 1.32 | 1.36 |
| SNR3015-4R7M | 4.7 | 20% | 100KHz | 1.0V | 0.125 | 0.165 | 1.10 | 1.09 |
| SNR3015-6R8M | 6.8 | 20% | 100KHz | 1.0V | 0.200 | 0.260 | 0.85 | 0.85 |
| SNR3015-100M | 10 | 20% | 100KHz | 1.0V | 0.250 | 0.325 | 0.72 | 0.77 |
| SNR3015-150M | 15 | 20% | 100KHz | 1.0V | 0.350 | 0.455 | 0.66 | 0.65 |
| SNR3015-220M | 22 | 20% | 100KHz | 1.0V | 0.460 | 0.598 | 0.52 | 0.57 |
| SNR3015-330M | 33 | 20% | 100KHz | 1.0V | 0.820 | 1.066 | 0.44 | 0.43 |
| SNR3015-470M | 47 | 20% | 100KHz | 1.0V | 1.250 | 1.625 | 0.35 | 0.35 |
| Inductance Tolerance Codes | Packing Codes |
|---|---|
| J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | B: Bulk Package, T: Tape & Reel |
| External Dimensions (LWH) (mm) | Type | Item | A | B | C (Max) | D | E | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|---|---|
| 3.03.01.5 | SNR (Shielded SMD Power Inductors) | SNR3015 | 3.00.3 | 3.00.3 | 1.5 | 1.50.2 | 2.50.2 | 0.8 | 1.5 | 2.7 |
| Environmental Data | Operating Temperature |
|---|---|
| (Including coils self-temperature rise) | -40 to +125 |
| Test Equipment | Parameter |
|---|---|
| HP4284A, HP4285A LCR meter or equivalent | Inductance (L) |
| HP4284+42841A or equivalent | Saturation Current (Isat) & Temperature Rise Current (Irms) |
| Chroma 16502 or equivalent | DC Resistance (DCR) |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test based on terminal area (8mm, 8-20mm, >20mm), solder paste thickness 0.12mm, force applied gradually for 10s, speed 1.0mm/s. Reference GB/T 2423.60-2008. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pull force based on terminal diameter (0.35-0.50mm, 0.50-0.80mm, 0.80-1.25mm, >1.25mm), duration 10s. Reference GB/T 2423.60-2008. |
| Resistance to Flexure | No visible mechanical damage, no loose terminal | Flexure 2mm, speed 0.5mm/sec, keep time 30 sec. Reference JIS C 5321:1997. |
| Dropping | No case deformation or change in appearance, no short/open | Drop packaged products from 1m high in 1 angle, 3 ridges, 6 surfaces, twice each direction. Reference GB/T 2423.7-2018. |
| Solderability | Wetting >75% coverage, terminals 95% minimum solder coverage | Solder temperature 2402, duration 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin/75% ethanol. Reference GB/T 2423.28-2005. |
| Vibration | No visible mechanical damage, Inductance change: Within 10%, Q factor change: Within 20% | Total amplitude 1.5mm, frequency 10-55 Hz (1 min cycle), duration 2 hours in 3 perpendicular directions. Reference GB/T 2423.10-2019. |
| Thermal Shock | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: 30%), Q factor change: Within 20% | 100 cycles of (85~125 for T time) to (-55~40 for T time). Transforming interval Max. 20 sec. Reference GB/T 2423.22-2012 Method Na. |
| Low temperature Storage | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: 30%), Q factor change: Within 20% | Temperature: -55~-402, Duration: 962 hours. Reference GB/T 2423.1-2008 Method Ab. |
| High temperature Storage | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: 30%), Q factor change: Within 20% | Temperature: 125~852, Duration: 962 hours. Reference GB/T 2423.2-2008 Method Bb. |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: 30%), Q factor change: Within 20% | Temperature: 602, Humidity: 90%-95% RH, Duration: 962 hours. Reference GB/T 2423.3-2016. |
| Heat endurance of Reflow soldering | No significant defects in appearance, L/L10% (Mn-Zn: 30%), Q/Q30% (SMD only), DCR/DCR10% | Refer to reflow curve, performed twice. Peak temperature: 260+0/-5. Reference GJB 360B-2009. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. Reference IEC 68-2-45:1993. |
| Overload test | No smoke, no peculiar smell, no fire during test; characteristics normal after test | Apply twice rated current for 5 minutes. Reference JIS C5311-6.13. |
| Voltage resistance test | No breakdown during test; characteristics normal after test | DC1000V, Current: 1mA, Time: 1Min. Reference MIL-STD-202G Method 301. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage period: within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
- Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions; overheating may cause short circuits, performance degradation, or reduced lifespan.
- Ensure sufficient thermal design margin as components self-heat when powered on.
- For non-magnetic shielded types, careful PCB layout is needed to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina