Ultra high current SMD power inductor LanTu Micro SMS1770-1R0MT with low DC resistance and strong EMI shielding
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Negotiable
MOQ:
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Delivery Time:
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1770 Series are ultra-high current SMD power inductors designed for high-density installations. Featuring a thin profile with low DC resistance and ultra-high current capabilities, these magnetically shielded inductors offer strong anti-electromagnetic interference. Their integral construction ensures high reliability and excellent vibration resistance, while a composite structure minimizes buzz noise. These inductors are suitable for applications requiring high efficiency, low impedance, and small parasitic capacitance, operating at frequencies up to 3MHz with a maximum voltage of 30VDC. They are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS1770
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Test Frequency (KHz) | Test Voltage (V) | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH) mm |
|---|---|---|---|---|---|---|---|---|---|
| SMS1770-R22M | 0.22 | 20% | 100 | 1.0 | 0.63 | 0.75 | 75.00 | 57.00 | 17.5017.157.5 |
| SMS1770-R47M | 0.47 | 20% | 100 | 1.0 | 0.90 | 1.03 | 72.00 | 55.00 | 17.5017.157.5 |
| SMS1770-1R0M | 1.0 | 20% | 100 | 1.0 | 1.60 | 2.30 | 55.00 | 32.00 | 17.5017.157.5 |
| SMS1770-1R5M | 1.5 | 20% | 100 | 1.0 | 1.78 | 2.50 | 48.00 | 31.00 | 17.5017.157.5 |
| SMS1770-2R2M | 2.2 | 20% | 100 | 1.0 | 2.40 | 2.70 | 34.00 | 29.00 | 17.5017.157.5 |
| SMS1770-3R3M | 3.3 | 20% | 100 | 1.0 | 3.68 | 4.20 | 30.00 | 24.00 | 17.5017.157.5 |
| SMS1770-4R7M | 4.7 | 20% | 100 | 1.0 | 4.84 | 5.50 | 24.00 | 21.00 | 17.5017.157.5 |
| SMS1770-5R6M | 5.6 | 20% | 100 | 1.0 | 6.68 | 7.60 | 23.00 | 20.00 | 17.5017.157.5 |
| SMS1770-6R8M | 6.8 | 20% | 100 | 1.0 | 8.40 | 9.20 | 22.00 | 17.00 | 17.5017.157.5 |
| SMS1770-8R2M | 8.2 | 20% | 100 | 1.0 | 10.10 | 11.60 | 20.00 | 13.00 | 17.5017.157.5 |
| SMS1770-100M | 10 | 20% | 100 | 1.0 | 11.60 | 13.00 | 19.00 | 12.00 | 17.5017.157.5 |
| SMS1770-150M | 15 | 20% | 100 | 1.0 | 18.80 | 20.50 | 14.50 | 11.00 | 17.5017.157.5 |
| SMS1770-220M | 22 | 20% | 100 | 1.0 | 25.10 | 26.50 | 11.50 | 8.50 | 17.5017.157.5 |
| SMS1770-330M | 33 | 20% | 100 | 1.0 | 38.00 | 44.00 | 10.00 | 8.00 | 17.5017.157.5 |
| SMS1770-470M | 47 | 20% | 100 | 1.0 | 48.00 | 55.00 | 7.50 | 6.00 | 17.5017.157.5 |
| SMS1770-560M | 56 | 20% | 100 | 1.0 | 54.00 | 62.00 | 7.00 | 5.50 | 17.5017.157.5 |
| SMS1770-680M | 68 | 20% | 100 | 1.0 | 68.00 | 80.00 | 6.50 | 5.20 | 17.5017.157.5 |
| SMS1770-101M | 100 | 20% | 100 | 1.0 | 110.00 | 118.00 | 5.00 | 3.70 | 17.5017.157.5 |
| Inductance Tolerance Options | Packing Options |
|---|---|
| J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | B: Bulk Package, TF: Tape & Reel |
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
| Part No. | A | B | C | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS1770 | 17.50.50 | 17.150.30 | 7.50 Max | 12.0 | 2.50 | 12.4 | 19.5 | 12.5 |
| A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|
| 17.50.50 | 17.150.30 | 7.50 Max | 12.0 Typ | 2.50 Typ | 12.4 | 19.5 | 12.5 |
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat or Irms.
- Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
- Tape and Reel Specifications: (Dimensions are in mm)
- Reel Dimensions: (Dimensions are in mm)
- Tape Dimension: (Dimensions are in mm)
- Cover tape peel off condition:
- a) Cover tape peel force shall be 10 to 120g
- b) Noodle strip peeling angle 165 to 180
- Packing Quantity:
| Part No. | Tape Dimension W | P | W1 | Reel Dimensions A | B | C | D | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS1770 | 32.0 | 24.0 | 14.2 | 32.4 | 100 | 13 | 330 | 300 | 600 | 2400 |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet the above requirements without any loose terminal | 1. Pulling test: Define: A: sectional area of terminal A8mm2 force5N time:30sec; 8mm2 |
| Terminal Strength (DIP) | Meet the above requirements without any loose terminal. | 1. Terminal diameter(d) mm 0.35d 0.50 Applied force:5N Duration: 10sec. 2. Terminal diameter(d) mm 0.50d 0.80 Applied force:10N Duration: 10sec. 3. Terminal diameter(d) mm 0.80d 1.25 Applied force:20N Duration: 10sec. 4. Terminal diameter(d) mm D 1.25 Applied force:40N Duration: 10sec. Pull Force: the force shall be applied gradually to the terminal and then maintained for 10 seconds. |
| Resistance to Flexure | 1. No visible mechanical damage. 2. shown in figure. | 1. Solder the inductor to the test jig (glass epoxy board). 2. Using a lead-free solder. 3. Flexure: 2mm. 4. Pressurizing Speed: 0.5mm/sec. 5. Keep time: 30 sec. |
| Dropping | 1. No case deformation or change in appearance. 2. No short and no open. | 1. Drop the packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | 1. No visible mechanical damage. 2. Wetting shall exceed 75% coverage. 3. Terminals must have 95% minimum solder coverage. | 1. Solder temperature: 2402. 2. Duration: 3 sec. 3. Solder: Sn/3.0Ag/0.5Cu. 4. Flux: 25% Resin and 75% ethanol in weight. |
| Vibration | 1. No visible mechanical damage. 2. Inductance change: Within 10%. 3. Q factor change: Within 20%. | 1. Solder the inductor to the testing jig (glass epoxy board) using lead-free solder. 2. The inductor shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. 3. The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). |
| Thermal Shock | 1. No visible mechanical damage. 2. Inductance change: Within 10%. (Mn-Zn: Within 30%) 3. Q factor change: Within 20%. | 1. Start at (85~125) for T time, rush to (-55~40) for T time as one cycle, go through 100 cycles. 2. Transforming interval: Max. 20 sec. 3. Tested cycle: 100 cycles. 4. The chip shall be stabilized at normal condition for 1~2 hours. |
| Low temperature Storage | 1. No visible mechanical damage. 2. Inductance change: Within 10%. (Mn-Zn: Within 30%) 3. Q factor change: Within 20%. | 1. Temperature: M(-55~-402). 2. Duration: 962 hours. 3. The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| High temperature Storage | 1. No visible mechanical damage. 2. Inductance change: Within 10%. (Mn-Zn: Within 30%) 3. Q factor change: Within 20%. | 1. Temperature: N(125~852). 2. Duration: 962 hours. 3. The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | 1. No visible mechanical damage. 2. Inductance change: Within 10%. (Mn-Zn: Within 30%) 3. Q factor change: Within 20%. | 1. Temperature: 602. 2. Humidity: 90% to 95% RH. 3. Duration: 962 hours. 4. The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | 1. No significant defects in appearance. 2. L/L10% (Mn-Zn: L/L30%) 3. Q/Q30% (SMD series only) 4. DCR/DCR10% | 1. Refer to the above reflow curve and go through the reflow for twice. 2. The peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | To dip parts into IPA solvent for 50.5Min, then drying them at room temp for 5Min, at last, to brushing making 10 times. |
| Overload test | 1. During the test no smoke, no peculiar smell, no fire. 2. The characteristic is normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | 1. During the test no breakdown. 2. The characteristic is normal after test. | 1. For parts with two coils. 2. DC1000V, Current: 1mA, Time: 1Min. 3. Refer to catalogue of specific products. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to our soldering equipment. Due to various manufacturers' differences in reflow soldering equipment, products, process conditions, and setup methods, please adjust and confirm according to your environment/equipment when setting the reflow conditions.
Reminders for Using These Products
- Storage: Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less. Soldering of terminal electrodes may deteriorate if the storage period elapses.
- Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that may inhibit soldering. Handle products carefully to prevent damage from dropping or inappropriate removal.
- Terminals: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Ensure components are preheated before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Self-heating occurs when power is ON; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Carefully lay out the coil for circuit board design to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina