Silver plated unshielded SMD power inductors LanTu Micro SCD1054-220MT designed for surface mounting

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Product Description

Unshielded SMD Power Inductors - SCD1054 Series

Product Overview
The SCD1054 Series offers unshielded SMD power inductors designed for surface mounting applications. These inductors feature a silver-plated, low-cost design with a small size capable of handling high rated currents and exhibiting low DC resistance. They are compliant with RoHS, Halogen Free, and REACH standards, making them suitable for a wide range of electronic devices including VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
Series: SCD1054
Type: Unshielded SMD Power Inductor
Design: Silver plated type, Low cost design
Certifications: RoHS, Halogen Free, REACH Compliance
Packaging Options: Bulk Package (T), Tape & Reel (B)

Technical Specifications

Environmental Data:

Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

Inductance (L): HP4284A, HP4285A LCR meter or equivalent
Current (Isat & Irms): HP4284+42841A or equivalent
Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification: SCD 1054 [Inductance] [Tolerance] [Packing]

External Dimensions (LWH): 10.00.3 x 9.00.3 x 5.40.5 mm

Recommended Land Pattern: (Dimensions are in mm)

Part No	A	B	C	D	H	I	J
SCD1054	10.00.3	9.00.3	5.40.5	2.1	9.5	3.75	2.5

Electrical Characteristics: (Electrical specifications at 25)

Part No	Inductance (LH) @0A	Tole	Test Freq	SRF (MHz) Min	DCR () Typ	Saturation Current (A) Max	Temperature Rise Current (A) Max
SCD1054-100M	10	M (20%)	100KHz	120	0.06	4.00	2.60
SCD1054-120M	12	M (20%)	100KHz	100	0.07	3.50	2.45
SCD1054-150M	15	M (20%)	100KHz	95	0.08	3.00	2.27
SCD1054-180M	18	M (20%)	100KHz	85	0.09	2.90	2.15
SCD1054-220M	22	M (20%)	100KHz	75	0.10	2.55	1.95
SCD1054-270M	27	M (20%)	100KHz	62	0.11	2.20	1.76
SCD1054-330M	33	M (20%)	100KHz	53	0.12	2.10	1.50
SCD1054-390M	39	M (20%)	100KHz	47	0.14	2.00	1.37
SCD1054-470M	47	M (20%)	100KHz	41	0.17	1.95	1.28
SCD1054-560M	56	M (20%)	100KHz	38	0.19	1.70	1.17
SCD1054-680M	68	M (20%)	100KHz	33	0.22	1.50	1.11
SCD1054-820M	82	M (20%)	100KHz	31	0.25	0.35	1.00
SCD1054-101M	100	M (20%)	100KHz	27	0.35	1.20	0.97
SCD1054-121M	120	M (20%)	100KHz	23	0.40	1.15	0.89
SCD1054-151M	150	M (20%)	100KHz	21	0.47	1.05	0.78
SCD1054-181M	180	M (20%)	100KHz	19	0.63	0.88	0.72
SCD1054-221M	220	M (20%)	100KHz	17	0.73	0.85	0.66
SCD1054-271M	270	M (20%)	100KHz	15	0.97	0.80	0.57
SCD1054-331M	330	M (20%)	100KHz	14	1.15	0.75	0.52
SCD1054-391M	390	M (20%)	100KHz	12	1.30	0.65	0.48
SCD1054-471M	470	M (20%)	100KHz	11	1.48	0.56	0.42
SCD1054-561M	560	M (20%)	100KHz	10	1.90	0.52	0.33
SCD1054-681M	680	M (20%)	100KHz	9.3	2.25	0.48	0.28
SCD1054-821M	820	M (20%)	100KHz	8.4	2.55	0.44	0.24
SCD1054-102M	1000	M (20%)	100KHz	7	3.10	0.40	0.20

Definitions:

Saturation Current: DC current at which inductance drops 10% from its value without current.
Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser value of Isat or Irms.

Packaging Specifications:

Tape and Reel Dimensions: (Dimensions are in mm)
Tape Dimension: W=24, P=12, W1=11.5
Reel Dimensions: A=24.4, B=100, C=13, D=330
Packing Quantity: Reel (PCS): 1000, Inside Box (PCS): 2000, Outside Carton (PCS): 8000

Recommended Reflow Soldering Curve: (Refer to image for curve details)

Reminders for Using These Products:

Storage: Within 12 months, under conditions of 5~40C and 35-65% RH.
Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
Handling: Avoid direct contact with terminals by bare hands to prevent solderability issues. Handle products carefully to prevent damage from dropping.
Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
Magnetic Fields: Do not expose products to magnets or magnetic fields.
Preheating: Preheating is required before soldering; temperature difference between solder and chip should not exceed 150C.
Soldering Corrections: Post-mounting soldering corrections should adhere to specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
Thermal Design: Ensure sufficient thermal design margin as self-heating occurs when power is on.
Layout: For non-magnetic shield types, careful coil placement on the circuit board is necessary to prevent malfunctions due to magnetic interference.