Magnetic resin shielded smd power inductors LanTu Micro SNR4030-331MT with compact size saving pcb real estate
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Product Description
Product Overview
The SNR4030 Series Magnetic Resin Shielded SMD Power Inductors are automatic assembly compatible, designed to minimize buzz noise to ultra-low levels due to their magnetic-resin shielded construction. These inductors offer large current handling capability with low DC resistance, and feature metallization on the ferrite core for excellent shock resistance and durability. The closed magnetic circuit design effectively reduces leakage flux and electromagnetic interference (EMI), while their compact size saves PCB real estate and reduces power consumption. They are widely used in applications such as LED backlights, flat-screen TVs, notebooks, servers, graphic cards, automotive products, and DC-DC converters. These inductors comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR4030
- Type: Magnetic Resin Shielded SMD Power Inductors
- Construction: Automatic assembly, Magnetic-resin shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
- Magnetic Circuit: Closed magnetic circuit design
Technical Specifications
| Part Number | Inductance (H) | Inductance Tolerance | Test Frequency (kHz) | Test Voltage (V) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|---|---|---|
| SNR4030-1R0M | 1.0 | 20% | 100 | 1.0 | 0.014 | 0.018 | 5.26 | 4.15 | 4.04.03.0 |
| SNR4030-1R2M | 1.2 | 20% | 100 | 1.0 | 0.015 | 0.020 | 5.26 | 3.82 | 4.04.03.0 |
| SNR4030-1R5M | 1.5 | 20% | 100 | 1.0 | 0.020 | 0.026 | 4.84 | 3.34 | 4.04.03.0 |
| SNR4030-1R8M | 1.8 | 20% | 100 | 1.0 | 0.025 | 0.033 | 4.84 | 3.20 | 4.04.03.0 |
| SNR4030-2R2M | 2.2 | 20% | 100 | 1.0 | 0.030 | 0.039 | 4.40 | 2.95 | 4.04.03.0 |
| SNR4030-3R3M | 3.3 | 20% | 100 | 1.0 | 0.040 | 0.050 | 3.30 | 2.40 | 4.04.03.0 |
| SNR4030-4R7M | 4.7 | 20% | 100 | 1.0 | 0.060 | 0.076 | 2.90 | 2.00 | 4.04.03.0 |
| SNR4030-5R6M | 5.6 | 20% | 100 | 1.0 | 0.073 | 0.091 | 2.75 | 1.90 | 4.04.03.0 |
| SNR4030-6R8M | 6.8 | 20% | 100 | 1.0 | 0.090 | 0.115 | 2.60 | 1.60 | 4.04.03.0 |
| SNR4030-8R2M | 8.2 | 20% | 100 | 1.0 | 0.095 | 0.122 | 2.10 | 1.60 | 4.04.03.0 |
| SNR4030-100M | 10 | 20% | 100 | 1.0 | 0.100 | 0.130 | 1.95 | 1.50 | 4.04.03.0 |
| SNR4030-120M | 12 | 20% | 100 | 1.0 | 0.135 | 0.172 | 1.70 | 1.30 | 4.04.03.0 |
| SNR4030-150M | 15 | 20% | 100 | 1.0 | 0.190 | 0.230 | 1.65 | 1.11 | 4.04.03.0 |
| SNR4030-220M | 22 | 20% | 100 | 1.0 | 0.225 | 0.290 | 1.30 | 1.00 | 4.04.03.0 |
| SNR4030-330M | 33 | 20% | 100 | 1.0 | 0.330 | 0.420 | 1.10 | 0.84 | 4.04.03.0 |
| SNR4030-470M | 47 | 20% | 100 | 1.0 | 0.445 | 0.570 | 0.95 | 0.72 | 4.04.03.0 |
| SNR4030-680M | 68 | 20% | 100 | 1.0 | 0.868 | 1.100 | 0.72 | 0.52 | 4.04.03.0 |
| SNR4030-820M | 82 | 20% | 100 | 1.0 | 1.060 | 1.280 | 0.66 | 0.47 | 4.04.03.0 |
| SNR4030-101M | 100 | 20% | 100 | 1.0 | 1.150 | 1.480 | 0.60 | 0.45 | 4.04.03.0 |
| SNR4030-121M | 120 | 20% | 100 | 1.0 | 1.350 | 1.700 | 0.55 | 0.42 | 4.04.03.0 |
| SNR4030-151M | 150 | 20% | 100 | 1.0 | 1.750 | 2.300 | 0.53 | 0.35 | 4.04.03.0 |
| SNR4030-221M | 220 | 20% | 100 | 1.0 | 2.400 | 3.200 | 0.50 | 0.35 | 4.04.03.0 |
| SNR4030-331M | 330 | 20% | 100 | 1.0 | 3.950 | 5.000 | 0.40 | 0.26 | 4.04.03.0 |
| Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |||||||||
| Operating Temperature: -40 to +125 (Including coils self-temperature rise) | |||||||||
| Test Equipment: L: HP4284A, HP4285A LCR meter or equivalent; Isat & Irms: HP4284+42841A or equivalent; DCR: Chroma 16502 or equivalent | |||||||||
| Saturation Current: DC current at which inductance drops 30% from its value without current. | |||||||||
| Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25). | |||||||||
| Rated DC Current: The lesser value of Isat or Irms. | |||||||||
| Recommended Land Pattern Dimensions (mm): A: 4.00.3, B: 4.00.3, C: 3.0 Max, D: 2.10.2, E: 3.30.2, F: 1.1 Typ, G: 1.9 Typ, H: 3.7 Typ | |||||||||
Applications
- LED backlight
- Flat-screen TVs
- Blue-ray disc
- Set top box
- Notebooks
- Desktop computers
- Servers
- Graphic cards
- Portable gaming devices
- Personal Navigation systems
- Personal multimedia devices
- Automotive systems
- Telecomm base station
- DC-DC Converter
Packaging Information
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) | Total Quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|
| SNR4030 | 12 | 8 | 5.5 | 100 | 13 | 330 | 2000 | 8000 | 32,000 | N/A | N/A |
Cover tape peel off condition:
a) Cover tape peel force: 10 to 120g
b) Noodle strip peeling angle: 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified force and time requirements without loose terminal. | Pulling test based on GB/T 2423.60-2008. Force varies with terminal cross-sectional area (e.g., 5N for 8mm, 10N for 8-20mm, 20N for >20mm), with a duration of 101s at a speed of 1.0mm/s. Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet specified force and time requirements without loose terminal. | Pull force applied gradually and maintained for 10 seconds. Force varies with terminal diameter (e.g., 5N for 0.35-0.50mm, 10N for 0.50-0.80mm, 20N for 0.80-1.25mm, 40N for >1.25mm). |
| Resistance to Flexure | No visible mechanical damage. | Based on JIS C 5321:1997. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping Test | No case deformation or appearance change. No short and no open. | Based on GB/T 2423.7-2018. Packaged products dropped from 1m high in 1 angle, 3 ridges, and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. No visible mechanical damage. | Based on GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration Test | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Based on GB/T 2423.10-2019. Simple harmonic motion, 10-55 Hz, amplitude 1.5mm, 2 hours per direction (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Based on GB/T 2423.22-2012 Method Na. 100 cycles of temperature transition between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Based on GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Based on GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Based on GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Based on GJB 360B-2009. Reflow soldering twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Based on IEC 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During test: no smoke, smell, or fire. Characteristics normal after test. | Based on JIS C5311-6.13. Apply twice rated current for 5 minutes (twice). |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | Based on MIL-STD-202G Method 301. For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided as a guideline and should be adjusted based on user's specific equipment and process conditions.
Reminders for Using These Products
- Storage: Store within 12 months under conditions of 5~40C and 35-65% RH. Prolonged storage may degrade terminal solderability.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands to prevent solderability issues due to oils. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not clean coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or strong magnetic fields.
- Preheating: Preheat components before soldering. Ensure the temperature difference between solder and chip does not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should adhere to specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
- Layout (Non-shielded): For non-magnetic shielded types, careful coil layout on the PCB is required to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina