Shielded SMD Power Inductors LanTu Micro SDRI127-220MT with Accurate Dimensions and Low DC Resistance
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Product Description
Shielded SMD Power Inductors - SDRI127 Series
Product Overview
The SDRI127 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power applications. These inductors feature a closed magnetic circuit design to minimize leakage flux, high saturation current capability, and low DC resistance. Their highly accurate dimensions ensure compatibility with automatic mounting processes. Available in various package sizes and a wide inductance range, they are suitable for a variety of electronic devices including VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU
- Manufacturer: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SDRI127
- Type: Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by manufacturer location)
Technical Specifications
General Specifications:
| Attribute | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coil self-temperature rise) |
| External Dimensions (LWH) | 12.5 12.5 8.0 mm |
| Inductance Tolerance | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent LCR meter |
| Test Equipment (Current) | HP4284+42841A or equivalent |
| Test Equipment (Q Factor) | HP4285A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
| Saturation Current Definition | DC current at which inductance drops 30% from its value without current. |
| Temperature Rise Current Definition | The actual value of DC current when the temperature rise is T 40 (Ta=25). |
| Rated DC Current | The lesser of Isat or Irms. |
| Recommended Land Pattern | (Refer to diagram in source document) |
| Recommended Reflow Soldering Curve | (Refer to diagram in source document) |
| Storage Conditions | Temperature: 5~40C, Humidity: 35~65% RH or less (within 12 months) |
Electrical Characteristics:
| Part No. | Inductance (H) | Tolerance | Test Freq (L @0A) | Q Factor Min | Test Freq (Q) | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|---|
| SDRI127-1R0N | 1.0 | 30% | 100KHz | 20 | 1MHz | 0.009 | 26.00 | 10.00 |
| SDRI127-2R2N | 2.2 | 30% | 100KHz | 20 | 1MHz | 0.012 | 21.00 | 8.00 |
| SDRI127-2R7N | 2.7 | 30% | 100KHz | 20 | 1MHz | 0.013 | 19.00 | 8.00 |
| SDRI127-3R3N | 3.3 | 30% | 100KHz | 20 | 1MHz | 0.013 | 16.00 | 8.00 |
| SDRI127-3R9N | 3.9 | 30% | 100KHz | 20 | 1MHz | 0.013 | 14.00 | 7.50 |
| SDRI1274R7N | 4.7 | 30% | 100KHz | 30 | 1MHz | 0.016 | 12.00 | 6.80 |
| SDRI127-6R1N | 6.1 | 30% | 100KHz | 30 | 1MHz | 0.018 | 11.50 | 6.60 |
| SDRI127-6R8N | 6.8 | 30% | 100KHz | 30 | 1MHz | 0.019 | 10.50 | 6.60 |
| SDRI127-7R6N | 7.6 | 30% | 100KHz | 30 | 1MHz | 0.020 | 10.00 | 5.90 |
| SDRI127-8R2N | 8.2 | 30% | 100KHz | 30 | 1MHz | 0.020 | 9.50 | 5.60 |
| SDRI127-100N | 10 | 30% | 100KHz | 35 | 1MHz | 0.021 | 9.00 | 5.40 |
| SDRI127-120M | 12 | 20% | 100KHz | 35 | 1MHz | 0.240 | 8.50 | 4.90 |
| SDRI127-150M | 15 | 20% | 100KHz | 35 | 1MHz | 0.027 | 8.00 | 4.50 |
| SDRI127-180M | 18 | 20% | 100KHz | 35 | 1MHz | 0.039 | 7.50 | 3.90 |
| SDRI127-220M | 22 | 20% | 100KHz | 35 | 1MHz | 0.043 | 7.00 | 3.60 |
| SDRI127-270M | 27 | 20% | 100KHz | 35 | 1MHz | 0.046 | 6.50 | 3.40 |
| SDRI127-330M | 33 | 20% | 100KHz | 35 | 1MHz | 0.065 | 5.50 | 3.00 |
| SDRI127-390M | 39 | 20% | 100KHz | 35 | 1MHz | 0.072 | 5.00 | 2.75 |
| SDRI127-470M | 47 | 20% | 100KHz | 35 | 1MHz | 0.100 | 4.60 | 2.50 |
| SDRI127-560M | 56 | 20% | 100KHz | 35 | 1MHz | 0.110 | 4.40 | 2.35 |
| SDRI127-680M | 68 | 20% | 100KHz | 35 | 1MHz | 0.140 | 4.00 | 2.10 |
| SDRI127-820M | 82 | 20% | 100KHz | 35 | 1MHz | 0.160 | 3.80 | 1.95 |
| SDRI127-101M | 100 | 20% | 100KHz | 40 | 0.796MHz | 0.220 | 3.50 | 1.70 |
| SDRI127-121M | 120 | 20% | 100KHz | 40 | 0.796MHz | 0.250 | 3.00 | 1.60 |
| SDRI127-151M | 150 | 20% | 100KHz | 40 | 0.796MHz | 0.280 | 2.70 | 1.42 |
| SDRI127-181M | 180 | 20% | 100KHz | 40 | 0.796MHz | 0.350 | 2.50 | 1.30 |
| SDRI127-221M | 220 | 20% | 100KHz | 40 | 0.796MHz | 0.390 | 2.00 | 1.16 |
| SDRI127-271M | 270 | 20% | 100KHz | 40 | 0.796MHz | 0.560 | 1.95 | 1.06 |
| SDRI127-331M | 330 | 20% | 100KHz | 40 | 0.796MHz | 0.640 | 1.90 | 0.95 |
| SDRI127-391M | 390 | 20% | 100KHz | 40 | 0.796MHz | 0.700 | 1.65 | 0.88 |
| SDRI127-471M | 470 | 20% | 100KHz | 40 | 0.796MHz | 0.980 | 1.50 | 0.79 |
| SDRI127-561M | 560 | 20% | 100KHz | 40 | 0.796MHz | 1.070 | 1.40 | 0.73 |
| SDRI127-681M | 680 | 20% | 100KHz | 40 | 0.796MHz | 1.460 | 1.30 | 0.67 |
| SDRI127-821M | 820 | 20% | 100KHz | 40 | 0.796MHz | 1.640 | 1.10 | 0.60 |
| SDRI127-102M | 1000 | 20% | 100KHz | 40 | 0.796MHz | 1.820 | 1.00 | 0.55 |
Product Identification Example: SDRI 127 470 M T
- SDRI: Series Type
- 127: Dimensions (12.512.58.0 mm)
- 470: Inductance (47 H)
- M: Inductance Tolerance (20%)
- T: Packing (Tape & Reel)
Packaging Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension H (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRI127 | 24 | 16 | 11.5 | 24.4 | 100 | 13 | 330 | 500 | 1000 | 4000 |
Cover Tape Peel Off Condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without loose terminal. | Pulling test based on terminal area; Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet requirements without loose terminal. | Applied force based on terminal diameter (5N to 40N for 10 sec). |
| Resistance to Flexure | No visible mechanical damage. | Flexure 2mm, Speed 0.5mm/sec, Keep time 30 sec. |
| Dropping | No case deformation, no short/open. | Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice each. |
| Solderability | Wetting >75% coverage, Terminals >95% solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin/75% ethanol. |
| Vibration | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | Simple harmonic motion, 10-55 Hz, 1.5mm amplitude, 2 hours in 3 directions. |
| Thermal Shock | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | 100 cycles of temperature shock (-55~40 to 85~125), Max 20 sec transforming interval. |
| Low Temperature Storage | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | Temperature: -55~-402, Duration: 962 hours. |
| High Temperature Storage | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | Temperature: 85~1252, Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | Temperature: 602, Humidity: 90%-95% RH, Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects; L/L 10%; Q/Q 30%; DCR/DCR 10%. | Twice reflow, Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation, change in appearance, or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | No smoke, smell, or fire during test; characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test; characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min (for parts with two coils). |
Usage Precautions
- Store within 12 months under conditions: 5~40C, 35~65% RH. Soldering of terminal electrodes may deteriorate beyond this period.
- Avoid use and storage in corrosive environments (salt, acid, alkali).
- Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability.
- Handle carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not clean coils; contact the manufacturer if cleaning is necessary.
- Keep away from magnets or magnetic objects.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to prevent short circuits, performance degradation, or lifespan reduction.
- Allow for sufficient thermal design margin due to self-heating when power is on.
- For non-magnetic shielded types, careful coil layout is required on the PCB to prevent malfunctions due to magnetic interference.
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Contact Person
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