Surface Mount LanTu Micro SDRI127-4R7NT Shielded SMD Power Inductors for Portable Communication Equipment
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Product Description
Shielded SMD Power Inductors - SDRI127 Series
Product Overview
The SDRI127 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power applications. Featuring a closed magnetic circuit to minimize leakage, these inductors offer high saturation current and low DCR. Their highly accurate dimensions ensure suitability for automatic mounting. Available in various package sizes and a wide inductance range, they comply with RoHS, Halogen Free, and REACH standards, making them ideal for DC/DC converters, power supplies for VTRs, LCD televisions, notebook PCs, and portable communication equipment.
Product Attributes
- Brand: LANTU MICRO
- Origin: SHENZHEN, CHINA
- Product Series: SDRI127
- Certifications: RoHS, Halogen Free, REACH Compliance
- Design: Shielded SMD Power Inductors, Closed Magnetic Circuit
- Mounting Type: Surface Mount Device (SMD)
Technical Specifications
| Item | Specification | Details | ||||||
|---|---|---|---|---|---|---|---|---|
| Series | SDRI127 | Shielded SMD Power Inductors | ||||||
| Dimensions (LWH) | 12.5 12.5 8.0 mm | (Model: SDRI127) | ||||||
| Operating Temperature | -40 to +125 | (Including coils self-temperature rise) | ||||||
| Test Equipment | Inductance (L): HP4284A, HP4285A or equivalent Current (Isat & Irms): HP4284+42841A or equivalent Quality Factor (Q): HP4285A or equivalent DC Resistance (DCR): Chroma 16502 or equivalent | |||||||
| Product Identification Code | SDRI 127 470 M T | (See details below) | ||||||
| Product Identification Breakdown | Type: SDRI (Shielded SMD Power Inductors) Dimensions: 127 (12.512.58.0 mm) Inductance: e.g., 470 (47 H) Tolerance: M (20%) Packing: T (Tape & Reel) | |||||||
| Inductance Tolerance Codes | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |||||||
| Packing Options | B: Bulk Package, T: Tape & Reel | |||||||
| Electrical Characteristics (Typical @ 25) | Part No. | Inductance (H) @ 0A | Tolerance | Test Freq Min | Test Freq | DCR () Max | Isat (A) Max | Irms (A) Max |
| SDRI127-1R0N | 1.0 | 30% | 100KHz | 1MHz | 0.009 | 26.00 | 10.00 | |
| ... (See datasheet for full list) ... | ... | ... | ... | ... | ... | ... | ... | ... |
| Saturation Current Definition | DC current at which inductance drops 30% from its value without current. | |||||||
| Temperature Rise Current Definition | The actual value of DC current when the temperature rise is T 40 (Ta=25). | |||||||
| Rated DC Current | The lesser of Isat or Irms. | |||||||
| Land Pattern Dimensions (mm) | A | B | C | D | E | F | G | H |
| SDRI127 | 12.5 Max | 12.5 Max | 8.0 Max | 5.0 | 7.6 | 2.9 | 7.0 | 5.4 |
| Tape and Reel Specifications | Tape Width (W) | Pitch (P) | Tape Height (H) | Reel Diameter (A) | Reel Hub Diameter (B) | Reel Plate Diameter (C) | Reel Width (D) | Pieces per Reel |
| SDRI127 | 24 mm | 16 mm | 11.5 mm | 330 mm | 100 mm | 13 mm | 24.4 mm | 500 |
| Reliability Testing | Terminal Strength, Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat, Heat Endurance of Reflow Soldering, Resistance to Solvent, Overload Test, Voltage Resistance Test. (Refer to datasheet for detailed requirements and test methods) | |||||||
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided as a guideline. Users should adjust and confirm conditions based on their specific reflow soldering equipment, process, and environment.
Usage Reminders
- Storage: Within 12 months, under 5~40C and 35~65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali).
- Handling: Avoid direct contact with terminals to maintain solderability. Handle with care to prevent damage.
- Bending: Do not excessively bend terminals to prevent wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetism: Keep away from magnets or magnetic fields.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions to avoid performance degradation.
- Thermal Design: Account for self-heating when power is applied.
- Layout: For non-magnetic shield types, carefully consider coil placement on the PCB to prevent malfunction due to magnetic interference.
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