High Accuracy Dimensions LanTu Micro SDRH105R-6R8NT Shielded SMD Power Inductors for Power Supply
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The SDRH105R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DCR, these inductors offer high accuracy dimensions suitable for automatic mounting. They are available in various package sizes and a wide inductance range, compliant with RoHS, Halogen Free, and REACH standards. Ideal for use in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO
- Series: SDRH105R
- Type: Shielded SMD Power Inductors
- Origin: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Certifications: RoHS, Halogen Free, REACH Compliance
- Magnetic Circuit Design: Closed magnetic circuit
Technical Specifications
| Part Number | Inductance (H) | Tolerance | Test Frequency | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|
| SDRH105R-3R3N | 3.3 | 30% | 100KHz | 0.013 | 6.50 | 9.50 | 10.310.55.0 |
| SDRH105R-4R7N | 4.7 | 30% | 100KHz | 0.016 | 6.30 | 9.20 | 10.310.55.0 |
| SDRH105R-6R8N | 6.8 | 30% | 100KHz | 0.020 | 6.00 | 7.00 | 10.310.55.0 |
| SDRH105R-8R2N | 8.2 | 30% | 100KHz | 0.023 | 5.00 | 5.50 | 10.310.55.0 |
| SDRH105R-100N | 10 | 30% | 100KHz | 0.250 | 4.40 | 5.10 | 10.310.55.0 |
| SDRH105R-120N | 12 | 30% | 100KHz | 0.032 | 4.00 | 4.90 | 10.310.55.0 |
| SDRH105R-150N | 15 | 30% | 100KHz | 0.040 | 3.60 | 4.20 | 10.310.55.0 |
| SDRH105R-180M | 18 | 20% | 100KHz | 0.046 | 3.40 | 3.70 | 10.310.55.0 |
| SDRH105R-220M | 22 | 20% | 100KHz | 0.058 | 3.20 | 3.30 | 10.310.55.0 |
| SDRH105R-270M | 27 | 20% | 100KHz | 0.650 | 3.00 | 3.20 | 10.310.55.0 |
| SDRH105R-330M | 33 | 20% | 100KHz | 0.810 | 2.60 | 2.70 | 10.310.55.0 |
| SDRH105R-390M | 39 | 20% | 100KHz | 0.103 | 2.50 | 2.48 | 10.310.55.0 |
| SDRH105R-470M | 47 | 20% | 100KHz | 0.122 | 2.30 | 2.35 | 10.310.55.0 |
| SDRH105R-560M | 56 | 20% | 100KHz | 0.144 | 2.10 | 2.30 | 10.310.55.0 |
| SDRH105R-680M | 68 | 20% | 100KHz | 0.193 | 1.90 | 2.00 | 10.310.55.0 |
| SDRH105R-820M | 82 | 20% | 100KHz | 0.219 | 1.60 | 1.80 | 10.310.55.0 |
| SDRH105R-101M | 100 | 20% | 100KHz | 0.247 | 1.35 | 1.50 | 10.310.55.0 |
| SDRH105R-121M | 120 | 20% | 100KHz | 0.298 | 1.18 | 1.40 | 10.310.55.0 |
| SDRH105R-151M | 150 | 20% | 100KHz | 0.355 | 1.10 | 1.30 | 10.310.55.0 |
| SDRH105R-181M | 180 | 20% | 100KHz | 0.393 | 1.00 | 1.20 | 10.310.55.0 |
| SDRH105R-221M | 220 | 20% | 100KHz | 0.483 | 0.94 | 1.08 | 10.310.55.0 |
| SDRH105R-271M | 270 | 20% | 100KHz | 0.632 | 0.80 | 0.88 | 10.310.55.0 |
| SDRH105R-331M | 330 | 20% | 100KHz | 0.780 | 0.73 | 0.85 | 10.310.55.0 |
| SDRH105R-391M | 390 | 20% | 100KHz | 0.957 | 0.70 | 0.78 | 10.310.55.0 |
| SDRH105R-471M | 470 | 20% | 100KHz | 1.220 | 0.54 | 0.71 | 10.310.55.0 |
| SDRH105R-561M | 560 | 20% | 100KHz | 1.352 | 0.52 | 0.65 | 10.310.55.0 |
| SDRH105R-681M | 680 | 20% | 100KHz | 1.519 | 0.51 | 0.59 | 10.310.55.0 |
| SDRH105R-821M | 820 | 20% | 100KHz | 1.694 | 0.48 | 0.51 | 10.310.55.0 |
| SDRH105R-102M | 1000 | 20% | 100KHz | 1.946 | 0.42 | 0.49 | 10.310.55.0 |
| Environmental Data | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Dimensions (mm) | A | B | C | D | E | F | H | I | J |
|---|---|---|---|---|---|---|---|---|---|
| SDRH105R | 10.3 Max | 10.5 Max | 5.0 Max | 7.7 | 3.0 | 1.2 | 3.6 | 1.7 | 7.3 |
| Inductance Tolerance | Code |
|---|---|
| 5% | J |
| 10% | K |
| 15% | L |
| 20% | M |
| 25% | P |
| 30% | N |
| Packing | Code |
|---|---|
| Bulk Package | B |
| Tape & Reel | T |
| Tape and Reel Specifications | W (mm) | P (mm) | W1 (mm) | Reel Dimensions (A) | Reel Dimensions (B) | Reel Dimensions (C) | Reel Dimensions (D) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRH105R | 24 | 16 | 11.5 | 24.4 | 60 | 13 | 330 | 800 | 1600 | 6400 |
| Reliability Testing Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test based on terminal sectional area (A): A8mm2 force5N time:30sec; 8mm2 |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pull Force: Applied gradually to the terminal and maintained for 10 seconds. Force varies with terminal diameter (d): 0.35d0.50 Applied force:5N; 0.50d0.80 Applied force:10N; 0.80d1.25 Applied force:20N; D1.25 Applied force:40N. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig (glass epoxy board), apply force in specified direction. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Subject to simple harmonic motion, amplitude 1.5mm, frequency 10-55 Hz and return. Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature cycling between (85~125) and (-55~40). Transforming interval: Max. 20 sec. Stabilize at normal condition for 1~2 hours before measuring. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristic is normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). Refer to catalogue of specific products. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to our soldering equipment. Due to variations in manufacturers' equipment, products, and process conditions, please adjust and confirm according to your specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Exceeding storage time may degrade terminal solderability.
- Environment: Do not use or store in corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals with bare hands to prevent inhibiting soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact LANTU MICRO if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Carefully consider coil placement in PCB design to prevent malfunctions due to magnetic interference.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina