Silver Plated Unshielded SMD Power Inductors LanTu Micro SCD5845-150MT Suitable for VTR LCD TV and Notebook PC
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Product Description
Unshielded SMD Power Inductors - SCD5845 Series
Product Overview
The SCD5845 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers unshielded SMD power inductors designed for surface mounting applications. These low-cost, silver-plated inductors feature a small size with high rated current and low DC resistance. They are suitable for various electronic devices including VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. The series complies with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Series: SCD5845
- Type: Unshielded SMD Power Inductors
- Design: Silver plated type, Low cost design
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
General Specifications:
| Item | Specification | Details |
|---|---|---|
| Operating Temperature | -40 to +125 | (Including coils self-temperature rise) |
| Inductance Tolerance | J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |
| Packing | Bulk Package (B), Tape & Reel (T) |
Dimensions:
| Part No | External Dimensions (LWH) (mm) | A (mm) | B (mm) | C (mm) | D (mm) | H (mm) | I (mm) | J (mm) |
|---|---|---|---|---|---|---|---|---|
| SCD5845 | 5.84.5 | 5.80.3 | 5.20.3 | 4.50.35 | 2.0 | 5.5 | 2.15 | 1.7 |
Electrical Characteristics:
| Part No | Inductance L(H) '@0A | Tole | Test Freq | SRF Min (MHz) | DCR Typ () Max | Saturation Current Isat (A) Max | Temperature Rise Current Irms (A) Max |
|---|---|---|---|---|---|---|---|
| SCD5845-1R0M | 1.0 | M | 100KHz | 20 | 0.013 | 6.00 | 5.40 |
| SCD5845-1R5M | 1.5 | M | 100KHz | 20 | 0.017 | 5.00 | 4.70 |
| SCD5845-3R3M | 3.3 | M | 100KHz | 20 | 0.031 | 4.00 | 3.70 |
| SCD5845-4R7M | 4.7 | M | 100KHz | 20 | 0.052 | 3.50 | 3.10 |
| SCD5845-6R8M | 6.8 | M | 100KHz | 20 | 0.059 | 3.00 | 2.40 |
| SCD5845-8R2M | 8.2 | M | 100KHz | 20 | 0.062 | 2.50 | 2.00 |
| SCD5845-100M | 10 | M | 100KHz | 35 | 0.075 | 1.60 | 1.44 |
| SCD5845-120M | 12 | M | 100KHz | 35 | 0.088 | 1.45 | 1.40 |
| SCD5845-150M | 15 | M | 100KHz | 35 | 0.105 | 1.35 | 1.30 |
| SCD5845-180M | 18 | M | 100KHz | 35 | 0.117 | 1.26 | 1.23 |
| SCD5845-220M | 22 | M | 100KHz | 35 | 0.153 | 1.12 | 1.11 |
| SCD5845-270M | 27 | M | 100KHz | 35 | 0.169 | 1.04 | 0.97 |
| SCD5845-330M | 33 | M | 100KHz | 35 | 0.208 | 0.96 | 0.88 |
| SCD5845-390M | 39 | M | 100KHz | 35 | 0.215 | 0.85 | 0.80 |
| SCD5845-470M | 47 | M | 100KHz | 35 | 0.355 | 0.80 | 0.72 |
| SCD5845-560M | 56 | M | 100KHz | 35 | 0.377 | 0.72 | 0.68 |
| SCD5845-680M | 68 | M | 100KHz | 35 | 0.390 | 0.68 | 0.61 |
| SCD5845-820M | 82 | M | 100KHz | 35 | 0.416 | 0.64 | 0.58 |
| SCD5845-101M | 100 | M | 100KHz | 40 | 0.611 | 0.56 | 0.52 |
| SCD5845-121M | 120 | M | 100KHz | 40 | 0.754 | 0.52 | 0.48 |
| SCD5845-151M | 150 | M | 100KHz | 40 | 0.845 | 0.44 | 0.40 |
| SCD5845-181M | 180 | M | 100KHz | 40 | 1.040 | 0.40 | 0.38 |
| SCD5845-221M | 220 | M | 100KHz | 40 | 1.450 | 0.36 | 0.35 |
| SCD5845-331M | 330 | M | 100KHz | 40 | 1.760 | 0.34 | 0.28 |
| SCD5845-471M | 470 | M | 100KHz | 40 | 2.990 | 0.32 | 0.24 |
| SCD5845-681M | 680 | M | 100KHz | 40 | 3.900 | 0.29 | 0.20 |
| SCD5845-102M | 1000 | M | 100KHz | 40 | 5.800 | 0.26 | 0.19 |
Definitions:
- Saturation Current (Isat): DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Test Equipment:
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Packaging Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SCD5845 | 12 | 8 | 7.5 | 16.4 | 100 | 13 | 330 | 1500 | 4500 | 18,000 |
Reliability Testing:
| Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without loose terminal | Pulling test based on terminal area; Solder paste thickness: 0.12mm; Keep time: 101s; Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without loose terminal | Pull force applied gradually, maintained for 10 seconds, based on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm; Speed: 0.5mm/sec; Keep time: 30 sec. |
| Dropping Test | No case deformation or change in appearance; No short and no open. | Drop packaged products from 1m height, 1 angle, 3 ridges, 6 surfaces, twice each direction. |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage | Solder temperature: 2402; Duration: 3 sec. |
| Vibration Test | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Amplitude 1.5mm, frequency 10-55 Hz, 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | 100 cycles of temperature transition between (-55~40) and (85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Temperature: -55~-402; Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Temperature: 125~852; Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10% | Go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip parts into IPA solvent for 50.5Min, then dry for 5Min, brushing 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire; Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown; Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve:
Refer to the provided graph for recommended reflow conditions. Adjust and confirm according to user's environment/equipment.
Reminders for Using These Products:
- Storage period within 12 months under conditions (5~40C, 35~65% RH).
- Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by hands due to grease affecting solderability.
- Handle carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact manufacturer if cleaning is necessary.
- Do not expose to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specifications; overheating may cause issues.
- Ensure sufficient thermal design margin for self-heating when powered on.
- For non-magnetic shield types, careful coil placement on the PCB is needed to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
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16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina