Magnetic Resin Shielded SMD Power Inductors LanTu Micro SNR3012-22OMT for in DC DC Converters and Servers
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SNR3012 Series are automatic assembly magnetic resin shielded SMD power inductors. Designed with a closed magnetic circuit, these inductors minimize leakage flux and electromagnetic interference (EMI), offering strong anti-EMI capabilities. Their magnetic-resin shielded construction significantly reduces buzz noise to ultra-low levels. These components feature large current handling, low DC resistance, metallization on the ferrite core for excellent shock resistance and durability, and a space-saving design that also conserves power. They are widely used in applications such as LED backlights, flat-screen TVs, set-top boxes, notebooks, desktop computers, servers, graphic cards, portable gaming devices, personal navigation systems, multimedia devices, automotive products, and telecommunication base stations, as well as DC-DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SNR3012
- Type: Shielded SMD Power Inductors
- Construction: Magnetic Resin Shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: SHENZHEN, CHINA
Technical Specifications
| Model | Inductance (H) | Inductance Tolerance | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) | Operating Temperature (C) |
|---|---|---|---|---|---|---|---|---|
| SNR3012-R24M | 0.24 | 20% | 0.020 | 0.029 | 4.00 | 3.00 | 3.03.01.2 | -40 to +125 |
| SNR3012-1R0M | 1.0 | 20% | 0.040 | 0.052 | 1.87 | 2.20 | 3.03.01.2 | -40 to +125 |
| SNR3012-1R5M | 1.5 | 20% | 0.045 | 0.060 | 1.62 | 2.00 | 3.03.01.2 | -40 to +125 |
| SNR3012-2R2M | 2.2 | 20% | 0.070 | 0.080 | 1.20 | 1.55 | 3.03.01.2 | -40 to +125 |
| SNR3012-3R3M | 3.3 | 20% | 0.100 | 0.130 | 1.05 | 1.36 | 3.03.01.2 | -40 to +125 |
| SNR3012-4R7M | 4.7 | 20% | 0.120 | 0.156 | 0.90 | 1.24 | 3.03.01.2 | -40 to +125 |
| SNR3012-6R8M | 6.8 | 20% | 0.190 | 0.247 | 0.75 | 0.98 | 3.03.01.2 | -40 to +125 |
| SNR3012-100M | 10 | 20% | 0.265 | 0.345 | 0.60 | 0.83 | 3.03.01.2 | -40 to +125 |
| SNR3012-150M | 15 | 20% | 0.360 | 0.468 | 0.45 | 0.71 | 3.03.01.2 | -40 to +125 |
| SNR3012-220M | 22 | 20% | 0.645 | 0.839 | 0.42 | 0.47 | 3.03.01.2 | -40 to +125 |
| External Dimensions (LWH): 3.03.01.2 mm | ||||||||
| Inductance Tolerance Options: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | ||||||||
| Packing Options: Bulk Package (B), Tape & Reel (T) | ||||||||
Dimensions
| Part No | A (0.3) | B (0.3) | C (Max) | D (0.2) | E (0.2) | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| SNR3012 | 3.0 | 3.0 | 1.2 | 1.5 | 2.5 | 0.8 | 1.5 | 2.7 |
(Dimensions are in mm)
Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR3012 | 8 | 4 | 3.5 | 8.4 | 60 | 13 | 178 | 2000 | 20,000 | 80,000 |
(Cover tape peel force: 10 to 120g; Noodle strip peeling angle: 165 to 180)
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test: Force varies based on terminal sectional area (5N to 20N). Solder paste thickness: 0.12mm. Keep time: 101s. Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pull force: 5N to 40N depending on terminal diameter. Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency: 10 to 55 Hz and return. Duration: 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature change between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, performed twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions inhibiting soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
- Thermal Design: Ensure sufficient thermal design margin as self-heating occurs when power is ON.
- Non-Magnetic Shield Type: Careful layout is required for non-magnetic shield types to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina