Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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SMD Power Inductor LanTu Micro SMS1360-470MT Featuring Magnetic Shielding and High Frequency Support

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Product Description

Molding SMD Power Inductors - SMS1360 Series

Product Overview
The SMS1360 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors designed for demanding applications. These inductors feature a thin profile with low DC resistance and ultra-high current capabilities. Their magnetic shielding provides strong anti-electromagnetic interference, making them ideal for high-density installations. Constructed with an integral molding structure, they offer high reliability and excellent vibration resistance, coupled with ultra-low buzz noise due to their composite construction. Utilizing low-loss alloy powder die-casting, they achieve low impedance and small parasitic capacitance, contributing to high efficiency by reducing winding DC resistance and core eddy-current loss. These inductors support frequencies up to 3MHz and have an absolute maximum voltage of 30VDC, while being RoHS, Halogen Free, and REACH compliant.

Applications
Suitable for PDA, notebook, desktop, and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SMS1360
  • Type: Molding SMD Power Inductor
  • Compliance: RoHS, Halogen Free, REACH

Technical Specifications

Item Specification Details
General Features Design Thin profile, magnetic shielding, integral construction
Noise Level Ultra low buzz noise
Frequency Up to 3MHz
Electrical Characteristics Absolute Maximum Voltage 30VDC
Environmental Data Operating Temperature -55 to +125 (Including coils self-temperature rise)
Storage Conditions Temperature: 5~40C, Humidity: 35 to 65% RH or less (within 12 months)
Test Equipment Inductance (L) WK3260B LCR meter or equivalent
Saturation Current (Isat) & Heat Rating Current (Irms) WK3260B+WK3265B or equivalent
Product Identification Format SMS 1360 [Inductance Value] [Tolerance] [Packaging]
Dimensions External Dimensions (LWH) 13.812.67.0 mm (for SMS1360 series)
Recommended Land Pattern Refer to diagram (dimensions provided in mm)
Electrical Characteristics (at 25)
Part No. Inductance (H) @ 100KHz, 1.0V Tolerance DCR (m) Typical Saturation Current (A) Typical Heat Rating Current (A) Typical
SMS1360-R68M 0.68 20% 1.4 1.6 55.00
SMS1360-1R0M 1.0 20% 1.7 2.0 35.00
SMS1360-2R2M 2.2 20% 3.5 4.2 25.00
SMS1360-3R3M 3.3 20% 5.5 6.8 22.00
SMS1360-4R7M 4.7 20% 8.0 9.0 18.00
SMS1360-6R8M 6.8 20% 10.0 14.0 15.00
SMS1360-8R2M 8.2 20% 13.5 16.0 14.00
SMS1360-100M 10 20% 18.0 21.0 12.50
SMS1360-220M 22 20% 34.0 38.0 8.00
SMS1360-270M 27 20% 45.0 56.0 7.00
SMS1360-330M 33 20% 56.0 70.0 6.50
SMS1360-470M 47 20% 70.0 90.0 6.00
SMS1360-680M 68 20% 105.0 125.0 5.00
SMS1360-820M 82 20% 115.0 140.0 4.00
SMS1360-101M 100 20% 130.0 200.0 3.00
Inductance Tolerance Codes J, K, L, M, P, N 5%, 10%, 15%, 20%, 25%, 30%
Packaging Codes B, T Bulk Package, Tape & Reel
Current Definitions Saturation Current DC current at which inductance drops 30% from its value without current.
Heat Rating Current DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current The lesser value of Isat or Irms.

Packaging Information

Tape and Reel Specifications:

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) Reel Quantity (PCS) Inside Box (PCS) Outside Carton (PCS)
SMS1360 24.0 16.0 11.5 24.4 100 330 500 1000 4000

Tape Dimension: Refer to diagram (dimensions provided in mm).

Cover tape peel off condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Packing quantity: Refer to table above.

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength Meet specified requirements without any loose terminal. Pulling test (SMT/DIP), Solder paste thickness: 0.12mm (SMT). Force and duration vary based on terminal size.
Resistance to Flexure No visible mechanical damage. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping No case deformation or change in appearance. No short and no open. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. No visible mechanical damage. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration Inductance change: Within 10%. Q factor change: Within 20%. No visible mechanical damage. Simple harmonic motion, 10 to 55 Hz, total amplitude 1.5mm. Applied for 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. No visible mechanical damage. 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec.
Low temperature Storage Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. No visible mechanical damage. Temperature: -55~-402. Duration: 962 hours.
High temperature Storage Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. No visible mechanical damage. Temperature: 125~852. Duration: 962 hours.
Damp Heat (Steady States) Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. No visible mechanical damage. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. No significant defects in appearance. Reflow soldering twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip parts into IPA solvent for 50.5Min, drying for 5Min, brushing 10 times.
Overload test During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. Apply twice the rated current for 5 minutes.
Voltage resistance test During the test no breakdown. Characteristics are normal after test. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils)

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.

Reminders for Using These Products

  • Storage: Within 12 months, under 5~40C and 35~65% RH.
  • Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands. Handle products carefully to prevent damage.
  • Terminal Bending: Do not bend terminals with excessive stress.
  • Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Ensure preheating before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Perform within specified conditions; overheating may cause issues.
  • Thermal Design: Allow sufficient margin for self-heating when power is on.
  • Non-Magnetic Shield Type: Careful layout is required to prevent malfunction due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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