SMD Power Inductor LanTu Micro SMS1360-470MT Featuring Magnetic Shielding and High Frequency Support
Molding SMD Power Inductors - SMS1360 Series
Product Overview
The SMS1360 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors designed for demanding applications. These inductors feature a thin profile with low DC resistance and ultra-high current capabilities. Their magnetic shielding provides strong anti-electromagnetic interference, making them ideal for high-density installations. Constructed with an integral molding structure, they offer high reliability and excellent vibration resistance, coupled with ultra-low buzz noise due to their composite construction. Utilizing low-loss alloy powder die-casting, they achieve low impedance and small parasitic capacitance, contributing to high efficiency by reducing winding DC resistance and core eddy-current loss. These inductors support frequencies up to 3MHz and have an absolute maximum voltage of 30VDC, while being RoHS, Halogen Free, and REACH compliant.
Applications
Suitable for PDA, notebook, desktop, and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS1360
- Type: Molding SMD Power Inductor
- Compliance: RoHS, Halogen Free, REACH
Technical Specifications
| Item | Specification | Details | |||
|---|---|---|---|---|---|
| General Features | Design | Thin profile, magnetic shielding, integral construction | |||
| Noise Level | Ultra low buzz noise | ||||
| Frequency | Up to 3MHz | ||||
| Electrical Characteristics | Absolute Maximum Voltage | 30VDC | |||
| Environmental Data | Operating Temperature | -55 to +125 (Including coils self-temperature rise) | |||
| Storage Conditions | Temperature: 5~40C, Humidity: 35 to 65% RH or less (within 12 months) | ||||
| Test Equipment | Inductance (L) | WK3260B LCR meter or equivalent | |||
| Saturation Current (Isat) & Heat Rating Current (Irms) | WK3260B+WK3265B or equivalent | ||||
| Product Identification | Format | SMS 1360 [Inductance Value] [Tolerance] [Packaging] | |||
| Dimensions | External Dimensions (LWH) | 13.812.67.0 mm (for SMS1360 series) | |||
| Recommended Land Pattern | Refer to diagram (dimensions provided in mm) | ||||
| Electrical Characteristics (at 25) | |||||
| Part No. | Inductance (H) @ 100KHz, 1.0V | Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
| SMS1360-R68M | 0.68 | 20% | 1.4 | 1.6 | 55.00 |
| SMS1360-1R0M | 1.0 | 20% | 1.7 | 2.0 | 35.00 |
| SMS1360-2R2M | 2.2 | 20% | 3.5 | 4.2 | 25.00 |
| SMS1360-3R3M | 3.3 | 20% | 5.5 | 6.8 | 22.00 |
| SMS1360-4R7M | 4.7 | 20% | 8.0 | 9.0 | 18.00 |
| SMS1360-6R8M | 6.8 | 20% | 10.0 | 14.0 | 15.00 |
| SMS1360-8R2M | 8.2 | 20% | 13.5 | 16.0 | 14.00 |
| SMS1360-100M | 10 | 20% | 18.0 | 21.0 | 12.50 |
| SMS1360-220M | 22 | 20% | 34.0 | 38.0 | 8.00 |
| SMS1360-270M | 27 | 20% | 45.0 | 56.0 | 7.00 |
| SMS1360-330M | 33 | 20% | 56.0 | 70.0 | 6.50 |
| SMS1360-470M | 47 | 20% | 70.0 | 90.0 | 6.00 |
| SMS1360-680M | 68 | 20% | 105.0 | 125.0 | 5.00 |
| SMS1360-820M | 82 | 20% | 115.0 | 140.0 | 4.00 |
| SMS1360-101M | 100 | 20% | 130.0 | 200.0 | 3.00 |
| Inductance Tolerance Codes | J, K, L, M, P, N | 5%, 10%, 15%, 20%, 25%, 30% | |||
| Packaging Codes | B, T | Bulk Package, Tape & Reel | |||
| Current Definitions | Saturation Current | DC current at which inductance drops 30% from its value without current. | |||
| Heat Rating Current | DC current when the temperature rise is T 40 (Ta=25). | ||||
| Rated DC Current | The lesser value of Isat or Irms. | ||||
Packaging Information
Tape and Reel Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel Quantity (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS1360 | 24.0 | 16.0 | 11.5 | 24.4 | 100 | 330 | 500 | 1000 | 4000 |
Tape Dimension: Refer to diagram (dimensions provided in mm).
Cover tape peel off condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Packing quantity: Refer to table above.
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength | Meet specified requirements without any loose terminal. | Pulling test (SMT/DIP), Solder paste thickness: 0.12mm (SMT). Force and duration vary based on terminal size. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. No visible mechanical damage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | Inductance change: Within 10%. Q factor change: Within 20%. No visible mechanical damage. | Simple harmonic motion, 10 to 55 Hz, total amplitude 1.5mm. Applied for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. No visible mechanical damage. | 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. No visible mechanical damage. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. No visible mechanical damage. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. No visible mechanical damage. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. No significant defects in appearance. | Reflow soldering twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, drying for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristics are normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under 5~40C and 35~65% RH.
- Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands. Handle products carefully to prevent damage.
- Terminal Bending: Do not bend terminals with excessive stress.
- Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions; overheating may cause issues.
- Thermal Design: Allow sufficient margin for self-heating when power is on.
- Non-Magnetic Shield Type: Careful layout is required to prevent malfunction due to magnetic interference.
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