T Core Molding Structure Power Inductors LanTu Micro STC201612-1R0MT for DC DC Converters in Mobile Devices
Product Overview
The STC201612 series T-core molding structure power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation and feature a thin profile with low DC resistance and ultra-high current capabilities. These magnetically shielded inductors offer strong anti-electromagnetic interference performance, high reliability, and excellent vibration resistance due to their T-core molding structure. They are ideal for applications requiring extremely low DCR and ultra-low AC losses at high switching frequencies, including DC/DC converters for notebook CPUs, mobile phones, tablets, servers, base stations, and various DC-DC power modules.
Product Attributes
- Brand: LANTU
- Origin: SHENZHEN
- Product Type: T-core molding Structure Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) @ 1MHz, 1.0V | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Saturation Current (A) Max | Heat Rating Current (A) Typical | Heat Rating Current (A) Max | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|---|---|---|
| STC201612-R47M | 0.47 | 20% | 13 | 17 | 6.7 | 6.0 | 6.7 | 6.0 | 2.01.61.2 |
| STC201612-1R0M | 1.0 | 20% | 30 | 36 | 5.0 | 4.5 | 5.0 | 4.5 | 2.01.61.2 |
| STC201612-1R5M | 1.5 | 20% | 40 | 50 | 4.0 | 3.5 | 4.0 | 3.5 | 2.01.61.2 |
| STC201612-2R2M | 2.2 | 20% | 77 | 90 | 3.1 | 2.7 | 3.3 | 2.9 | 2.01.61.2 |
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Dimensions (mm)
| Part No. | A | B | C | D | E | F | H |
|---|---|---|---|---|---|---|---|
| STC201612 | 2.00.2 | 1.60.2 | 1.2Max | 0.70.2 | 2.1Typ | 0.5Typ | 1.7Typ |
Product Identification
STC 201612 1R0 M T
- Type: STC (T-CORE molding Structure Power Inductors)
- Inductance: 1.0 uH
- External Dimensions (LWH): 201612 (2.01.61.2 mm)
- Inductance Tolerance: M: 20% (Other tolerances: J:5%, K: 10%, L: 15%, P: 25%, N: 30%)
- Packing: T (Tape & Reel) (B: Bulk Package)
Reliability Testing Summary
- Terminal Strength: Meets specified force and duration requirements.
- Resistance to Flexure: No visible mechanical damage; meets flexure and speed criteria.
- Dropping Test: No case deformation or appearance change; no short/open circuits.
- Solderability: Meets wetting and solder coverage requirements.
- Vibration Test: No visible mechanical damage; inductance and Q factor changes within limits.
- Thermal Shock: No visible mechanical damage; inductance and Q factor changes within limits.
- Low Temperature Storage: No visible mechanical damage; inductance and Q factor changes within limits.
- High Temperature Storage: No visible mechanical damage; inductance and Q factor changes within limits.
- Damp Heat (Steady States): No visible mechanical damage; inductance and Q factor changes within limits.
- Heat endurance of Reflow soldering: No significant defects; inductance, Q factor, and DCR changes within limits.
- Resistance to solvent test: No case deformation or appearance change.
- Overload test: No smoke, smell, or fire; characteristics normal after test.
- Voltage resistance test: No breakdown; characteristics normal after test.
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided as a guideline. Users should adjust and confirm according to their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under 5~40C and 35~65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali).
- Handling: Avoid direct contact with terminals to prevent soldering issues; handle carefully to prevent damage.
- Terminal Bending: Do not bend terminals excessively.
- Cleaning: Do not rinse coils; contact supplier if cleaning is necessary.
- Magnetic Fields: Keep away from magnets or magnetic objects.
- Preheating: Preheat components before soldering; temperature difference should not exceed 150C.
- Soldering Corrections: Perform within specified conditions to avoid performance degradation.
- Thermal Design: Account for self-heating when power is applied.
- Non-Magnetic Shield Type: Careful layout is required to avoid malfunction due to magnetic interference.
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