Molding SMD Power Inductors LanTu Micro SMS0630-2R2MT Series for DC DC Converters and Battery Devices

Molding SMD Power Inductors - SMS0630 Series

Product Overview
The SMS0630 Series ultra-high current SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation with a thin profile, low DC resistance, and ultra-high current capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability due to their integral construction, providing excellent vibration resistance. The composite structure ensures ultra-low buzz noise, while the low-loss alloy powder die-casting results in low impedance and small parasitic capacitance, contributing to high efficiency. Capable of operating at frequencies up to 3MHz and with an absolute maximum voltage of 30VDC, these inductors are RoHS, Halogen Free, and REACH compliant.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SMS0630
• Type: Molding SMD Power Inductor
• Certifications: RoHS, Halogen Free, REACH Compliance

Applications

• PDA, notebook, desktop, server applications
• High current POL converters
• Battery powered devices
• DC/DC converters in distributed power systems

Environmental Data

• Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Technical Specifications

Shape and Dimensions

Inductance Tolerance

• J: 5%
• K: 10%
• L: 15%
• M: 20%
• P: 25%
• N: 30%

Packaging

Tape and Reel Specifications:

Cover tape peel off condition:

• Cover tape peel force: 10 to 120g
• Noodle strip peeling angle: 165 to 180

Packing quantity: REEL13 PE Bag

Reliability Testing

Terminal Strength (SMT):

• Pulling test: Defined by terminal area (A). For A 8mm, force 5N, time: 30 sec. For 8mm 20mm, force 20N, time: 10 sec.
• Solder paste thickness: 0.12mm
• Requirements met without any loose terminal.

Terminal Strength (DIP):

• Terminal diameter (d) mm: 0.35d 0.50, Applied force: 5N, Duration: 10 sec.
• Terminal diameter (d) mm: 0.50d 0.80, Applied force: 10N, Duration: 10 sec.
• Terminal diameter (d) mm: 0.80d 1.25, Applied force: 20N, Duration: 10 sec.
• Terminal diameter (d) mm: D 1.25, Applied force: 40N, Duration: 10 sec.
• Requirements met without any loose terminal.

Resistance to Flexure:

• No visible mechanical damage.
• Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.

Dropping Test:

• No case deformation or change in appearance. No short and no open.
• Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.

Solderability:

• No visible mechanical damage.
• Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage.
• Solder temperature: 2402. Duration: 3 sec.

Vibration Test:

• No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.
• Subjected to simple harmonic motion, total amplitude 1.5mm, frequency 10-55 Hz, for 2 hours in each of 3 mutually perpendicular directions.

Thermal Shock:

• No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.
• 100 cycles of temperature transitions between (85~125) and (-55~40). Transforming interval: Max. 20 sec.

Low temperature Storage:

• No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.
• Temperature: -55~-402. Duration: 962 hours.

High temperature Storage:

• No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.
• Temperature: 125~852. Duration: 962 hours.

Damp Heat (Steady States):

• No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.
• Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.

Heat endurance of Reflow soldering:

• No significant defects in appearance. L/L 10%. Q/Q 30%. DCR/DCR 10%.
• Subjected to reflow twice. Peak temperature: 260+0/-5.

Resistance to solvent test:

• No case deformation or change in appearance or obliteration of marking.
• Dipped into IPA solvent for 50.5Min, dried for 5Min, then brushed 10 times.

Overload test:

• During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test.
• Apply twice rated current for 5 minutes.

Voltage resistance test:

• During the test no breakdown. Characteristics are normal after test.
• DC1000V, Current: 1mA, Time: 1Min.

Recommended reflow soldering curve

The recommended reflow conditions are set according to soldering equipment. Users should adjust and confirm according to their environment/equipment.

Reminders for Using These Products

• Storage: Within 12 months, under conditions (5~40C, 35~65% RH or less). Soldering of terminal electrodes may deteriorate if storage period elapses.
• Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage.
• Terminals: Do not bend terminals with excessive stress to avoid wire fracture.
• Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
• Magnetism: Do not expose products to magnets or magnetic fields.
• Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
• Soldering Corrections: Corrections after mounting should be within specification conditions. Overheating may cause short circuits, performance deterioration, or lifespan reduction.
• Thermal Design: Self-heating occurs when power is ON; ensure sufficient thermal design margin.
• Layout: For non-magnetic shield types, carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.