Low loss alloy powder die cast LanTu Micro SMS1350-680MT power inductors with frequency operation up to 3MHz

Molding SMD Power Inductors - SMS1350 Series

Product Overview
The SMS1350 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors featuring a thin design with low DC resistance and exceptional current handling capabilities. These magnetically shielded inductors provide strong anti-electromagnetic interference, making them suitable for high-density installations. Their integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Designed for high efficiency, these inductors utilize low-loss alloy powder for die-casting, resulting in low impedance, small parasitic capacitance, and reduced eddy-current loss. They operate at frequencies up to 3MHz and are compliant with RoHS, Halogen Free, and REACH standards.

Key Features:

• Low RDC and ultra-high current thin design
• Magnetic shielding for strong anti-electromagnetic interference, ideal for high-density mounting
• High reliability and vibration resistance due to integral construction
• Ultra-low buzz noise from composite structure
• Low impedance and small parasitic capacitance due to die-casting with low-loss alloy powder
• High efficiency with low DC resistance and reduced core eddy-current loss
• Frequency up to 3MHz
• Absolute maximum voltage 30VDC
• RoHS, Halogen Free, and REACH Compliance

Applications:

• PDA, notebook, desktop, and server applications
• High current POL converters
• Battery powered devices
• DC/DC converters in distributed power systems

Product Attributes:

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SMS1350
• Type: Molding SMD Power Inductor
• Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications:

Electrical Characteristics (at 25)

Inductance Tolerance Codes:

• J: 5%
• K: 10%
• L: 15%
• M: 20%
• P: 25%
• N: 30%

Shape and Dimensions (mm)

Product Identification Example:

SMS 1350 100 M T

• SMS: Type
• 1350: External Dimensions (LWH) (mm)
• 100: Inductance (e.g., 100 means 10 H)
• M: Inductance Tolerance (20%)
• T: Packing Type (Tape & Reel)

Environmental Data:

• Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Test Equipment:

• Inductance (L): WK3260B LCR meter or equivalent
• Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Packaging:

Packing Type:

• B: Bulk Package
• T: Tape & Reel

Tape and Reel Specifications:

Cover tape peel off condition:

• Cover tape peel force: 10 to 120g
• Noodle strip peeling angle: 165 to 180

Reliability Testing:

Terminal Strength (SMT):

• Pulling test based on terminal area (8mm, 8-20mm, >20mm) with specified forces and durations.
• Solder paste thickness: 0.12mm.
• Meet requirements without terminal looseness.

Terminal Strength (DIP):

• Pulling test based on terminal diameter (0.35-0.50mm, 0.50-0.80mm, 0.80-1.25mm, >1.25mm) with specified forces and durations.
• Meet requirements without terminal looseness.

Resistance to Flexure:

• No visible mechanical damage.
• Flexure: 2mm.
• Pressurizing Speed: 0.5mm/sec.
• Keep time: 30 sec.

Dropping Test:

• No case deformation or appearance change.
• No short and no open.
• Drop packaged products from 1m height in specified angles and surfaces, twice in each direction.

Solderability:

• No visible mechanical damage.
• Wetting shall exceed 75% coverage.
• Terminals must have 95% minimum solder coverage.
• Solder temperature: 2402, Duration: 3 sec.

Vibration Test:

• No visible mechanical damage.
• Inductance change: Within 10%.
• Q factor change: Within 20%.
• Subjected to simple harmonic motion (10-55 Hz) for 2 hours in 3 mutually perpendicular directions.

Thermal Shock Test:

• No visible mechanical damage.
• Inductance change: Within 10% (Mn-Zn: Within 30%).
• Q factor change: Within 20%.
• 100 cycles of temperature change between specified ranges.

Low Temperature Storage Test:

• No visible mechanical damage.
• Inductance change: Within 10% (Mn-Zn: Within 30%).
• Q factor change: Within 20%.
• Storage at -55~-402 for 962 hours.

High Temperature Storage Test:

• No visible mechanical damage.
• Inductance change: Within 10% (Mn-Zn: Within 30%).
• Q factor change: Within 20%.
• Storage at 125~852 for 962 hours.

Damp Heat (Steady States) Test:

• No visible mechanical damage.
• Inductance change: Within 10% (Mn-Zn: Within 30%).
• Q factor change: Within 20%.
• Test at 602 and 90% to 95% RH for 962 hours.

Heat endurance of Reflow soldering:

• No significant defects in appearance.
• L/L 10% (Mn-Zn: L/L 30%).
• Q/Q 30% (SMD series only).
• DCR/DCR 10%.
• Subjected to reflow soldering twice with peak temperature 260+0/-5.

Resistance to solvent test:

• No case deformation, appearance change, or obliteration of marking.
• Dipped in IPA solvent for 50.5 min, dried for 5 min, and brushed 10 times.

Overload Test:

• No smoke, peculiar smell, or fire during the test.
• Characteristics remain normal after the test.
• Apply twice the rated current for 5 minutes.

Voltage Resistance Test:

• No breakdown during the test.
• Characteristics remain normal after the test.
• DC 1000V, Current: 1mA, Time: 1Min.

Recommended Reflow Soldering Curve:

Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user environments and equipment.

Reminders for Using These Products:

• Storage: Within 12 months under conditions of 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
• Environment: Avoid use and storage in corrosive environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals by hand to prevent affecting solderability. Handle products carefully to prevent damage.
• Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
• Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Do not expose products to magnets or magnetic fields.
• Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering Corrections: Perform after mounting within specified conditions. Overheating can cause short circuits, performance degradation, or reduced lifespan.
• Thermal Design: Allow sufficient margin for self-heating when power is on.
• Non-Magnetic Shield Type: Careful coil layout is required on the PCB to prevent malfunctions due to magnetic interference.