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Axial fixed inductors LanTu Micro AL0510-220K featuring compact design and epoxy resin coating for in RF choke circuits

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Product Description

Axial Fixed Inductors - AL0510 Series

Product Overview

The AL0510 Series Axial Fixed Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-frequency applications, offering a wide inductance range in a compact, lightweight package. These RF chokes feature epoxy resin coating for humidity resistance and extended lifespan, high Q values, and self-resonant frequencies. They are suitable for automatic insertion with tape packaging and are RoHS, Halogen Free, and REACH compliant. Ideal for use in televisions, personal computers, radios, telephones, chargers, and other electronic products.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: AL0510
  • Type: Axial Fixed Inductors / Leaded RF Chokes
  • Coating: Epoxy resin
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Packaging Options: Tape packaging for auto-insertion, Bulk Package

Technical Specifications

Environmental Data:

  • Operating Temperature: -25 to +85 (Including coils self-temperature rise)

Dimensions:

Part No A (mm) B (mm) C (mm) (mm)
AL0510 5.0 Max 11.0 Max 0.600.1 5.0 Max

Product Identification: AL 0510 100 K T

  • Series Type: AL (Axial Fixed Inductors)
  • Dimensions: 0510 (Refers to size, specific LWH in mm is 5.011.0)
  • Inductance: 100 (e.g., 100 uH)
  • Inductance Tolerance: K (10%) (Other options: J:5%, L: 15%, M: 20%, P: 25%, N: 30%)
  • Packaging: T (Tape) (Other option: B: Bulk Package)

Electrical Characteristics: (Electrical specifications at 25)

Part No Inductance L(uH) Tolerance Q Min @ Test Freq. (MHz) SRF Min (MHz) DCR Max () Rated Current (mA) Max
AL0510-3R3M 3.3 20% 20 @ 7.96MHz 50 0.18 1100
AL0510-4R7M 4.7 20% 20 @ 7.96MHz 45 0.20 1000
AL0510-6R8M 6.8 20% 20 @ 7.96MHz 45 0.25 790
AL0510-100K 10 10% 15 @ 7.96MHz 30 0.45 750
AL0510-150K 15 10% 15 @ 7.96MHz 30 0.50 650
AL0510-220K 22 10% 30 @ 2.52 MHz 8.0 0.65 500
AL0510-330K 33 10% 30 @ 2.52 MHz 6.0 0.75 400
AL0510-470K 47 10% 30 @ 2.52 MHz 6.3 0.8 370
AL0510-680K 68 10% 30 @ 2.52 MHz 5.0 0.8 350
AL0510-820K 82 10% 20 @ 2.52 MHz 3.8 0.82 330
AL0510-101K 100 10% 20 @ 2.52 MHz 3.5 0.90 300
AL0510-121K 120 10% 20 @ 0.796 MHz 3.3 1.20 250
AL0510-151K 150 10% 20 @ 0.796 MHz 3.2 1.80 225
AL0510-181K 180 10% 20 @ 0.796 MHz 2.8 2.00 200
AL0510-221K 220 10% 30 @ 0.796 MHz 2.6 2.10 180
AL0510-271K 270 10% 30 @ 0.796 MHz 2.4 2.50 170
AL0510-331K 330 10% 30 @ 0.796 MHz 2.2 3.00 160
AL0510-391K 390 10% 30 @ 0.796 MHz 2.0 3.50 150
AL0510-471K 470 10% 30 @ 0.796 MHz 1.9 4.00 140
AL0510-561K 560 10% 30 @ 0.796 MHz 1.8 5.40 130
AL0510-681K 680 10% 40 @ 0.796 MHz 1.5 6.00 120
AL0510-821K 820 10% 50 @ 0.796 MHz 1.2 7.50 110
AL0510-102K 1000 10% 50 @ 0.252 MHz 1.0 8.00 100
AL0510-122K 1200 10% 60 @ 0.252 MHz 0.95 14.50 95
AL0510-152K 1500 10% 60 @ 0.252 MHz 0.9 16.50 90
AL0510-182K 1800 10% 60 @ 0.252 MHz 0.9 19.00 85
AL0510-222K 2200 10% 60 @ 0.252 MHz 0.8 27.50 80
AL0510-272K 2700 10% 60 @ 0.252 MHz 0.75 40.00 75
AL0510-332K 3300 10% 50 @ 0.252 MHz 0.7 50.00 62
AL0510-392K 3900 10% 50 @ 0.252 MHz 0.65 53.00 59
AL0510-472K 4700 10% 50 @ 0.252 MHz 0.6 60.00 55
AL0510-562K 5600 10% 50 @ 0.252 MHz 0.5 64.00 40
AL0510-682K 6800 10% 50 @ 0.252 MHz 0.45 73.00 35
AL0510-822K 8200 10% 30 @ 0.252 MHz 0.4 80.00 30
AL0510-103K 10000 10% 25 @ 79.6 KHz 0.35 132.00 25
AL0510-123K 12000 10% 25 @ 79.6 KHz 0.3 143.00 20
AL0510-153K 15000 10% 25 @ 79.6 KHz 0.25 166.00 18
AL0510-183K 18000 10% 25 @ 79.6 KHz 0.2 185.00 15
AL0510-223K 22000 10% 20 @ 79.6 KHz 0.15 330.00 12
AL0510-273K 27000 10% 20 @ 79.6 KHz 0.1 370.00 10
AL0510-333K 33000 10% 40 @ 79.6 KHz 0.25 240.00 10

Current Definitions:

  • Saturation Current (Isat): The current at which inductance drops by 10% from its initial value (Ta=25).
  • Temperature Rise Current (Irms): The DC current that causes a temperature rise of T 40 (Ta=25).
  • Rated DC Current: The lower value between Isat and Irms.

Packaging:

Series Type Packaging Quantity (pcs) Carton Size (mm) LWH Parts/Box Parts/Reel Parts/Carton
T5A Tape and reel 1000 440 x 275 x 392 - - 24,000

Reliability Testing:

  • Terminal Strength: Meets requirements per GB/T 2423.60-2008 for SMT and DIP.
  • Resistance to Flexure: No visible mechanical damage per JIS C 5321:1997.
  • Dropping: No case deformation or change in appearance, no short/open circuits per GB/T 2423.7-2018.
  • Solderability: Wetting >75% coverage, terminals >95% solder coverage per GB/T 2423.28-2005.
  • Vibration: Inductance change within 10%, Q factor change within 20% per GB/T 2423.10-2019.
  • Thermal Shock: Inductance change within 10%, Q factor change within 20% per GB/T 2423.22-2012.
  • Low Temperature Storage: Inductance change within 10%, Q factor change within 20% per GB/T 2423.1-2008.
  • High Temperature Storage: Inductance change within 10%, Q factor change within 20% per GB/T 2423.2-2008.
  • Damp Heat (Steady States): Inductance change within 10%, Q factor change within 20% per GB/T 2423.3-2016.
  • Heat endurance of Reflow soldering: L/L10%, Q/Q30% (SMD series only), DCR/DCR10% per GJB 360B-2009.
  • Resistance to solvent test: No case deformation or change in appearance per IAL 68-2-45:1993.
  • Overload test: No smoke, peculiar smell, or fire during test per JIS C5311-6.13.
  • Voltage resistance test: No breakdown during test per MIL-STD-202G Method 301.

Recommended Lead-free Wave Soldering Curve (DIP-Type):

Refer to the provided curve for recommended soldering conditions. Adjust and confirm based on user's environment and equipment.

Soldering Iron (Rework):

  • Max soldering iron temperature: 350C.
  • Avoid contacting the inductor body or wire during soldering.
  • Hand soldering is not recommended.

Reminders for Using These Products:

  • Storage: Within 12 months, at 5~40C and 35~65% RH. Deterioration of solderability may occur beyond this period.
  • Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals due to hand oils; handle carefully to prevent damage from dropping.
  • Terminals: Do not bend terminals excessively to prevent wire fracture.
  • Cleaning: Do not clean coils; contact manufacturer if cleaning is necessary.
  • Magnetic Fields: Keep away from magnets or magnetic objects.
  • Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Correction: Perform after mounting within specified conditions; overheating can cause short circuits, performance degradation, or reduced lifespan.
  • Self-heating: Account for self-heating (temperature increase) during operation in thermal design.
  • Non-magnetic Shield Type: Careful layout is required on the PCB to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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