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epoxy coated axial fixed inductors LanTu Micro AL0510-4R7M compliant with RoHS Halogen Free and REACH

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Product Description

Axial Fixed Inductors - AL0510 Series

Product Overview
The AL0510 Series Axial Fixed Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance RF chokes. These inductors feature an epoxy resin coating for enhanced humidity resistance and extended lifespan. Their compact, lightweight design offers a wide inductance range, high Q values, and excellent self-resonant frequencies. Available in tape packaging for automated insertion, these inductors comply with RoHS, Halogen Free, and REACH standards, making them suitable for a broad range of electronic applications.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: AL0510 Series
  • Product Type: Axial Fixed Inductors (Leaded RF Chokes)
  • Coating: Epoxy resin
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Packaging Options: Tape packaging for auto-insertion, Bulk Package

Applications

  • Televisions, personal computers
  • Radios, telephones
  • Chargers, fast charge
  • Other various electronic products

Environmental Data

  • Operating Temperature: -25 to +85 (Including coils self-temperature rise)

Technical Specifications

Product Identification: AL 0510 100 K T

  • Type: Axial Fixed Inductors
  • Inductance Range: Wide range
  • Dimensions (LWH): 0510 (5.011.0 mm)
  • Inductance Tolerance: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
  • Packing: B (Bulk Package), TF (Tape)

Electrical Characteristics (at 25)

Part No Inductance L(uH) Tolerance Q Min @ Test Freq. (MHz) SRF Min (MHz) DCR Max () Rated Current (mA) Max
AL0510-3R3M 3.3 20% 20 @ 7.96MHZ 50 0.18 1100
AL0510-4R7M 4.7 20% 20 @ 7.96MHZ 45 0.20 1000
AL0510-6R8M 6.8 20% 20 @ 7.96MHZ 45 0.25 790
AL0510-100K 10 10% 15 @ 7.96MHZ 30 0.45 750
AL0510-150K 15 10% 15 @ 7.96MHZ 30 0.50 650
AL0510-220K 22 10% 30 @ 2.52 MHZ 8.0 0.65 500
AL0510-330K 33 10% 30 @ 2.52 MHZ 6.0 0.75 400
AL0510-470K 47 10% 30 @ 2.52 MHZ 6.3 0.8 370
AL0510-680K 68 10% 30 @ 2.52 MHZ 5.0 0.8 350
AL0510-820K 82 10% 20 @ 2.52 MHZ 3.8 0.82 330
AL0510-101K 100 10% 20 @ 2.52 MHZ 3.5 0.90 300
AL0510-121K 120 10% 20 @ 0.796 MHZ 3.3 1.20 250
AL0510-151K 150 10% 20 @ 0.796 MHZ 3.2 1.80 225
AL0510-181K 180 10% 20 @ 0.796 MHZ 2.8 2.00 200
AL0510-221K 220 10% 30 @ 0.796 MHZ 2.6 2.10 180
AL0510-271K 270 10% 30 @ 0.796 MHZ 2.4 2.50 170
AL0510-331K 330 10% 30 @ 0.796 MHZ 2.2 3.00 160
AL0510-391K 390 10% 30 @ 0.796 MHZ 2.0 3.50 150
AL0510-471K 470 10% 30 @ 0.796 MHZ 1.9 4.00 140
AL0510-561K 560 10% 30 @ 0.796 MHZ 1.8 5.40 130
AL0510-681K 680 10% 40 @ 0.796 MHZ 1.5 6.00 120
AL0510-821K 820 10% 50 @ 0.796 MHZ 1.2 7.50 110
AL0510-102K 1000 10% 50 @ 0.252 MHZ 1.0 8.00 100
AL0510-122K 1200 10% 60 @ 0.252 MHZ 0.95 14.50 95
AL0510-152K 1500 10% 60 @ 0.252 MHZ 0.9 16.50 90
AL0510-182K 1800 10% 60 @ 0.252 MHZ 0.9 19.00 85
AL0510-222K 2200 10% 60 @ 0.252 MHZ 0.8 27.50 80
AL0510-272K 2700 10% 60 @ 0.252 MHZ 0.75 40.00 75
AL0510-332K 3300 10% 50 @ 0.252 MHZ 0.7 50.00 62
AL0510-392K 3900 10% 50 @ 0.252 MHZ 0.65 53.00 59
AL0510-472K 4700 10% 50 @ 0.252 MHZ 0.6 60.00 55
AL0510-562K 5600 10% 50 @ 0.252 MHZ 0.5 64.00 40
AL0510-682K 6800 10% 50 @ 0.252 MHZ 0.45 73.00 35
AL0510-822K 8200 10% 30 @ 0.252 MHZ 0.4 80.00 30
AL0510-103K 10000 10% 25 @ 79.6 KHZ 0.35 132.00 25
AL0510-123K 12000 10% 25 @ 79.6 KHZ 0.3 143.00 20
AL0510-153K 15000 10% 25 @ 79.6 KHZ 0.25 166.00 18
AL0510-183K 18000 10% 25 @ 79.6 KHZ 0.2 185.00 15
AL0510-223K 22000 10% 20 @ 79.6 KHZ 0.15 330.00 12
AL0510-273K 27000 10% 20 @ 79.6 KHZ 0.1 370.00 10
AL0510-333K 33000 10% 40 @ 79.6 KHZ 0.25 240.00 10

Current Ratings

  • Saturation Current (Isat): The current at which inductance becomes 10% lower than its initial value (Ta=25).
  • Temperature Rise Current (Irms): The actual DC current value when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value between Isat and Irms.

Note on Thermal Design: Circuit design, component placement, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging Specifications

Series Type Packaging Quantity (pcs) Carton Size (mm) LWH Parts/Box Parts/Reel Parts/Carton
T5A Tape and reel 1000 440275392 - - 24,000

Note: Outside carton. Insufficient quantity for a full carton will be filled with inner boxes or cushioning material.

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT/DIP) Meet specified requirements without any loose terminal. Reference documents: GB/T 2423.60-2008. Pulling test, Solder paste thickness, Terminal diameter variations, Pull Force application.
Resistance to Flexure No visible mechanical damage. JIS C 5321:1997. Solder inductor to test jig, apply force, Flexure: 2mm, Speed: 0.5mm/s, Keep time: 30s.
Dropping No case deformation or change in appearance. No short and no open. GB/T 2423.7-2018. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. GB/T 2423.28-2005. Solder temperature: 2402, Duration: 3s. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. GB/T 2423.10-2019. Solder inductor to jig, subjected to simple harmonic motion (10-55 Hz), 2 hours per direction (total 6 hours).
Thermal Shock No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. GB/T 2423.22-2012 Method Na. Cycle: (85~125) for T time, then (-55~40) for T time, 100 cycles. Transforming interval: Max. 20s.
Low temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours.
High temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. GJB 360B-2009. Refer to reflow curve, twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. IEC 68-2-45:1993. Dip parts into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times.
Overload test During the test no smoke, no peculiar smell, no fire. Characteristics normal after test. JIS C5311-6.13. Apply twice the rated current for 5 minutes.
Voltage resistance test During the test no breakdown. Characteristics normal after test. MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min.

Recommended Lead-free Wave Soldering Curve (DIP-Type)

Notes: The recommended wave soldering is a reference. Please adjust and confirm according to user's environment/equipment.

  • Soldering Iron (Rework): Use soldering iron by hand, times not exceeding 350 degrees 3 times. Avoid contacting the inductor itself. Not recommended.

Reminders for Using These Products

  • Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
  • Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage from dropping.
  • Terminals: Do not bend terminals with excessive stress to avoid wire fracture.
  • Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
  • Soldering Correction: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance deterioration, or reduced lifespan.
  • Self-Heating: Self-heating occurs when power is ON; ensure sufficient thermal design margin.
  • Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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