Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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LanTu Micro SDRH104R-390MT Power Inductor Shielded SMD Type with High Saturation Current and Low DCR

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Product Description

Product Overview

The SDRH104R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DCR. Featuring a closed magnetic circuit design to minimize leakage, these inductors offer high-precision dimensions suitable for automatic mounting. They are available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards. Ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SDRH104R Series
  • Type: Shielded SMD Power Inductors
  • Design: Closed magnetic circuit
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: Shenzhen, China (implied by company name and location)

Technical Specifications

Part No. Inductance (H) Tolerance Test Freq. DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max Dimensions (LWH) (mm)
SDRH104R-1R5N 1.5 30% 100KHz 0.008 12.50 8.50 10.310.34.0
SDRH104R-2R5N 2.5 30% 100KHz 0.011 9.90 7.70 10.310.34.0
SDRH104R-3R3N 3.3 30% 100KHz 0.014 8.80 7.40 10.310.34.0
SDRH104R-3R8N 3.8 30% 100KHz 0.018 8.80 7.40 10.310.34.0
SDRH104R-4R7N 4.7 30% 100KHz 0.022 7.00 6.00 10.310.34.0
SDRH104R-5R2N 5.2 30% 100KHz 0.022 7.00 6.00 10.310.34.0
SDRH104R-7R0N 7.0 30% 100KHz 0.027 6.60 5.30 10.310.34.0
SDRH104R-8R2N 8.2 30% 100KHz 0.030 6.00 4.80 10.310.34.0
SDRH104R-100N 10 30% 100KHz 0.035 5.60 4.50 10.310.34.0
SDRH104R-150N 15 30% 100KHz 0.050 4.40 3.70 10.310.34.0
SDRH104R-220M 22 20% 100KHz 0.073 3.60 2.80 10.310.34.0
SDRH104R-330M 33 20% 100KHz 0.093 2.90 2.60 10.310.34.0
SDRH104R-390M 39 20% 100KHz 0.115 2.70 2.40 10.310.34.0
SDRH104R-470M 47 20% 100KHz 0.128 2.44 2.30 10.310.34.0
SDRH104R-560M 56 20% 100KHz 0.185 2.18 1.75 10.310.34.0
SDRH104R-680M 68 20% 100KHz 0.213 2.08 1.68 10.310.34.0
SDRH104R-820M 82 20% 100KHz 0.275 1.88 1.48 10.310.34.0
SDRH104R-101M 100 20% 100KHz 0.304 1.66 1.42 10.310.34.0
SDRH104R-151M 150 20% 100KHz 0.506 1.40 1.15 10.310.34.0
SDRH104R-221M 220 20% 100KHz 0.756 1.19 0.88 10.310.34.0
SDRH104R-331M 330 20% 100KHz 1.090 0.92 0.66 10.310.34.0
SDRH104R-471M 470 20% 100KHz 1.476 0.65 0.59 10.310.34.0
SDRH104R-681M 680 20% 100KHz 2.100 0.54 0.50 10.310.34.0

Environmental Data

  • Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance (L): HP4284A, HP4285A LCR meter or equivalent
  • Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

SDRH 104R 100 N T

  • Type: SDRH (Shielded SMD Power Inductors)
  • External Dimensions (LWH) (mm): 104R (10.310.34.0)
  • Inductance: 100 (10 H)
  • Inductance Tolerance: N (30%)
  • Packing: T (Tape & Reel)

Packaging

  • Tape and Reel Specifications: W=24mm, P=16mm, W1=11.5mm
  • Reel Dimensions: A=24.4mm, B=60mm, C=13mm
  • Packing Quantity: Reel (1000 PCS), Inside Box (2000 PCS), Outside Carton (8000 PCS)

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet specified force and duration requirements without loose terminals. Pulling test based on terminal cross-sectional area; Solder paste thickness: 0.12mm.
Terminal Strength (DIP) Meet specified force and duration requirements without loose terminals. Pulling test based on terminal diameter.
Resistance to Flexure No visible mechanical damage. Flexure: 2mm; Speed: 0.5mm/sec; Duration: 30 sec.
Dropping No case deformation or change in appearance; No short and no open. Drop from 1m height in specified angles and surfaces, twice in each direction.
Solderability Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Simple harmonic motion, 10-55 Hz, 2 hours in 3 mutually perpendicular directions.
Thermal Shock No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. 100 cycles of temperature change between (85~125) and (-55~40). Transforming interval: Max. 20 sec.
Low temperature Storage No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Temperature: -402; Duration: 962 hours.
High temperature Storage No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Temperature: 852; Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10%. Reflow soldering twice, peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times.
Overload test During the test no smoke, no peculiar smell, no fire; The characteristic is normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test During the test no breakdown; The characteristic is normal after test. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils)

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their specific environment and equipment.

Reminders for Using These Products

  • Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH.
  • Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals to prevent solderability issues. Handle carefully to prevent damage.
  • Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
  • Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Keep away from magnets or magnetic objects.
  • Preheating: Ensure preheating before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Perform within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Account for self-heating when power is on.
  • Layout (Non-magnetic shield type): Careful coil placement is needed to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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