Durable Unshielded SMD Power Inductors LanTu Micro SCD7850-101MT for Portable Communication Devices
Price:
Negotiable
MOQ:
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Delivery Time:
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Product Description
Unshielded SMD Power Inductors - SCD7850 Series
Product Overview
The SCD7850 Series Unshielded SMD Power Inductors are low-cost, silver-plated components designed for surface mounting. These inductors offer a compact size with high rated current capability and low DC resistance, making them suitable for various applications including power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. They are compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SCD7850
- Type: Unshielded SMD Power Inductors
- Design: Silver plated, Low cost
- Circuit Type: Unshielded magnetic circuit
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
General Specifications:
| Item | Description |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A LCR meter or equivalent |
| Test Equipment (Saturation & Temperature Rise Current) | HP4284+42841A or equivalent |
| Test Equipment (SRF) | Agilent E4991A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification Example: SCD 7850 101 K T
| Part | Description |
|---|---|
| Type: SCD (Unshielded SMD Power Inductors) | |
| External Dimensions (LWH) | |
| Inductance Value (e.g., 101 = 100 H) | |
| Inductance Tolerance (J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%) | |
| Packing (B: Bulk, T: Tape & Reel) |
Shape and Dimensions:
| Part No | A (mm) | B (mm) | C (mm) | D (mm) | H (mm) | I (mm) | J (mm) |
|---|---|---|---|---|---|---|---|
| SCD7850 | 7.80.3 | 7.00.3 | 5.00.5 | 2.1 | 7.5 | 3.0 | 2.0 |
Electrical Characteristics (Sample Data):
| Part No | Inductance L(H) @ 0A | Tole | Test Freq | SRF Min (MHz) | DCR Typ () | Isat Max (A) | Irms Max (A) |
|---|---|---|---|---|---|---|---|
| SCD7850-1R0M | 1.0 | M (20%) | 100KHz | 20 | 0.013 | 7.00 | 5.20 |
| SCD7850-100M | 10 | M (20%) | 100KHz | 20 | 0.042 | 2.85 | 2.31 |
| SCD7850-470M | 47 | M (20%) | 100KHz | 20 | 0.176 | 1.28 | 1.10 |
| SCD7850-101M | 100 | M (20%) | 100KHz | 30 | 0.325 | 0.92 | 0.73 |
| SCD7850-102M | 1000 | M (20%) | 100KHz | 35 | 3.640 | 0.25 | 0.19 |
Definitions:
- Saturation Current: DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat or Irms.
Packaging Specifications:
| Item | Dimensions (mm) |
|---|---|
| Reel Dimensions | A: 16.4, B: 100, C: 13, D: 330 |
| Tape Dimension W | 16 |
| Tape Dimension P | 12 |
| Tape Dimension W1 | 7.5 |
| Packing Quantity (Reel) | 1000 PCS |
| Packing Quantity (Inside Box) | 3000 PCS |
| Packing Quantity (Outside Carton) | 12,000 PCS |
Reliability Testing (Examples):
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified force requirements without loose terminal. | Pulling test based on sectional area of terminal. Solder paste thickness: 0.12mm. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. |
| Vibration | Inductance change: Within 10%. Q factor change: Within 20%. | Simple harmonic motion, 10 to 55 Hz, 2 hours in 3 directions. |
| Thermal Shock | Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature extremes (-55~40 to 85~125). |
| Damp Heat (Steady States) | Inductance change: Within 10%. Q factor change: Within 20%. | 602, 90% to 95% RH, 962 hours. |
| Heat endurance of Reflow soldering | L/L10%. Q/Q30%. DCR/DCR10%. | Peak temperature: 260+0/-5. Tested twice. |
Recommended Reflow Soldering Curve:
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user equipment and process conditions.
Reminders for Using These Products:
- Storage: Within 12 months, under 5~40C and 35~65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse. Contact manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is on.
- Layout: For non-magnetic shield types, careful coil placement on the PCB is required to prevent malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina