Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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LanTu Micro SMS1770 2R2MT power inductor with low loss alloy powder and ultra high current capability

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Product Description

Product Overview

The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1770 Series are ultra-high current SMD power inductors designed for high-density installation. These magnetically shielded inductors offer low DC resistance, ultra-high current capability, and excellent vibration resistance due to their integral construction. They feature a composite structure for ultra-low buzz noise and are manufactured using low-loss alloy powder for low impedance and small parasitic capacitance. With high efficiency and frequencies up to 3MHz, these RoHS, Halogen Free, and REACH compliant inductors are ideal for PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Series: SMS1770 Series
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: Shenzhen, China

Technical Specifications

Part No Inductance (H) @0A Tol DCR (m) Typical Saturation Current (A) Typical (Isat) Heat Rating Current (A) Typical (Irms) Dimensions (LWH) (mm) Frequency Absolute Maximum Voltage Operating Temperature
SMS1770-R22M 0.22 20% 0.63 75.00 57.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-R47M 0.47 20% 0.90 72.00 55.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-1R0M 1.0 20% 1.60 55.00 32.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-1R5M 1.5 20% 1.78 48.00 31.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-2R2M 2.2 20% 2.40 34.00 29.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-3R3M 3.3 20% 3.68 30.00 24.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-4R7M 4.7 20% 4.84 24.00 21.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-5R6M 5.6 20% 6.68 23.00 20.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-6R8M 6.8 20% 8.40 22.00 17.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-8R2M 8.2 20% 10.10 20.00 13.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-100M 10 20% 11.60 19.00 12.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-150M 15 20% 18.80 14.50 11.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-220M 22 20% 25.10 11.50 8.50 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-330M 33 20% 38.00 10.00 8.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-470M 47 20% 48.00 7.50 6.00 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-560M 56 20% 54.00 7.00 5.50 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-680M 68 20% 68.00 6.50 5.20 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
SMS1770-101M 100 20% 110.00 5.00 3.70 17.5017.157.50 Up to 3MHz 30VDC -55 to +125
Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% Packing: B: Bulk Package, TF: Tape & Reel
Definitions: Saturation Current: DC current at which inductance drops 30% from its value without current. Heat Rating Current: the actual value of DC current when the temperature rise is T 40 (Ta=25). Rated DC Current: The less value which is Isat or Irms.

Shape and Dimensions

Part No A (mm) B (mm) C (mm) D (Typ) (mm) E (Typ) (mm) F (mm) G (mm) H (mm)
SMS1770 17.50.50 17.150.30 7.50 Max 12.0 2.50 12.4 19.5 12.5

Recommended Land Pattern

Refer to the Shape and Dimensions table for specific dimensions.

Packaging

Part No Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) Reel Quantity (PCS) Inside Box (PCS) Outside Carton (PCS)
SMS1770 32.0 24.0 14.2 32.4 100 13 330 300 600 2400

Tape and Reel Specifications: Dimensions are in mm. Cover tape peel force shall be 10 to 120g. Noodle strip peeling angle 165 to 180.

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test based on terminal area; Solder paste thickness: 0.12mm.
Terminal Strength (DIP) Meet requirements without any loose terminal. Applied force based on terminal diameter.
Resistance to Flexure No visible mechanical damage. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping No case deformation or change in appearance. No short and no open. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Simple harmonic motion, 10 to 55 Hz, 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. 100 cycles of temperature shock between specified ranges. Transforming interval: Max. 20 sec.
Low temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: -55~-402. Duration: 962 hours.
High temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 125~852. Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. Refer to reflow curve, twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip parts into IPA solvent for 50.5Min, then dry for 5Min, brushing 10 times.
Overload test During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. Apply twice as rated current for 5 minutes.
Voltage resistance test During the test no breakdown. The characteristic is normal after test. DC1000V, Current: 1mA, Time: 1Min.

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to soldering equipment. Users should adjust and confirm according to their specific environment/equipment.

Reminders for Using These Products

  • Storage: Within 12 months, under conditions of temperature 5~40C and humidity 35 to 65% RH or less.
  • Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle carefully to prevent damage from dropping.
  • Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
  • Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
  • Soldering Corrections: Perform corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Account for self-heating when power is ON; ensure sufficient thermal design margin.
  • Layout (Non-magnetic Shield Type): Carefully lay out coils to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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