LanTu Micro SMS0850 4R7MT ultra high current inductor for PDA notebook and server power applications
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0850 Series are ultra-high current SMD power inductors designed for high-density installation. These magnetically shielded inductors offer strong anti-electromagnetic interference capabilities, low DC resistance, and ultra-high current thin design. Featuring an integral construction for high reliability and vibration resistance, they also provide ultra-low buzz noise due to their composite structure. Manufactured using low-loss alloy powder die-casting, they exhibit low impedance and small parasitic capacitance, contributing to high efficiency by reducing eddy-current loss. These inductors operate at frequencies up to 1-2MHz and have an absolute maximum voltage of 30VDC. They are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS0850
- Certifications: RoHS, Halogen Free, REACH Compliance
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Technical Specifications
Environmental Data
| Parameter | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
Product Identification
Format: SMS 0850 [Inductance Code] [Tolerance Code] [Packing Code]
- Type: SMS (Molding SMD Power Inductor)
- External Dimensions: 0850 (8.5 x 8.0 x 5.0 mm)
- Inductance: e.g., 100 (10 uH)
- Tolerance Code: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing Code: B (Bulk Package), T (Tape & Reel)
Shape and Dimensions
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|
| SMS0850 | 8.50.50 | 8.00.30 | 5.00 Max | 3.0 0.30 | 1.8 0.30 | 4.5 | 9.5 | 3.5 |
Recommended Land Pattern Dimensions are in mm.
Specifications (Electrical Characteristics at 25)
| Part No. | Inductance (H) | L @ 100KHz, 1.0V Tol. | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|---|
| SMS0850-R56M | 0.56 | 20% | 3.0 | 4.5 | 30.00 | 24.00 |
| SMS0850-R68M | 0.68 | 20% | 3.6 | 6.0 | 25.00 | 23.00 |
| SMS0850-1R0M | 1.0 | 20% | 4.1 | 5.5 | 20.00 | 19.00 |
| SMS0850-1R5M | 1.5 | 20% | 5.0 | 7.0 | 19.00 | 17.00 |
| SMS0850-2R2M | 2.2 | 20% | 8.2 | 12.0 | 16.00 | 14.00 |
| SMS0850-3R3M | 3.3 | 20% | 11.0 | 15.0 | 13.00 | 12.00 |
| SMS0850-4R7M | 4.7 | 20% | 15.0 | 20.0 | 12.00 | 9.50 |
| SMS0850-5R6M | 5.6 | 20% | 25.0 | 28.5 | 11.00 | 9.00 |
| SMS0850-100M | 10 | 20% | 35.0 | 45.0 | 8.00 | 6.20 |
| SMS0850-150M | 15 | 20% | 55.0 | 65.0 | 7.00 | 5.40 |
| SMS0850-220M | 22 | 20% | 78.0 | 88.0 | 5.50 | 4.80 |
| SMS0850-330M | 33 | 20% | 120.0 | 140.0 | 6.00 | 3.50 |
| SMS0850-470M | 47 | 20% | 177.0 | 190.0 | 4.00 | 2.90 |
| SMS0850-560M | 56 | 20% | 188.0 | 226.0 | 3.00 | 2.50 |
| SMS0850-680M | 68 | 20% | 280.0 | 310.0 | 2.80 | 2.00 |
Notes:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser of Isat or Irms.
- Part temperature should be verified in the end application due to factors like circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions.
Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0850 | 24.0 | 12.0 | 11.5 | 24.4 | 100 | 13 | 330 | 1000 | 2000 | 8000 |
Tape and Reel Specifications and dimensions are in mm.
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on sectional area of terminal (e.g., 8mm, 8mm |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (d): 0.35d0.50 (5N), 0.50d0.80 (10N), 0.80d1.25 (20N), D1.25 (40N). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency varied between 10 and 55 Hz. Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | 100 cycles of temperature cycling between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then drying at room temp for 5Min, brushing 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Terminal solderability may deteriorate past storage time.
- Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals with bare hands due to oils affecting solderability. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering; ensure the temperature difference between solder and chip temperature does not exceed 150C.
- Soldering Corrections: Perform post-mounting soldering corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for thermal design due to self-heating when power is applied.
- Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina