LanTu Micro SDRH104R-6R8NT Power Inductor with Closed Magnetic Circuit and Halogen Free Certification
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Product Description
Product Overview
The SDRH104R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DCR, featuring a closed magnetic circuit to minimize leakage. These inductors offer high-accuracy dimensions suitable for automatic mounting, with a wide range of package sizes and inductance values. They are RoHS, Halogen Free, and REACH compliant, making them ideal for DC/DC converters, power supplies for VTRs, LCD televisions, notebook PCs, and portable communication equipment.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Series: SDRH104R Series
- Type: Shielded SMD Power Inductors
- Design: Closed magnetic circuit
- Certifications: RoHS, Halogen Free, REACH Compliance
- Mounting Type: SMD (Surface Mount Device)
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Frequency | DCR () Max @ 0A | Saturation Current (A) Max | Temperature Rise Current (A) Max | External Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|
| SDRH104R-1R5N | 1.5 | 30% | 100KHz | 0.008 | 12.50 | 8.50 | 10.310.34.0 |
| SDRH104R-2R2N | 2.2 | 30% | 100KHz | 0.011 | 9.90 | 7.70 | 10.310.34.0 |
| SDRH104R-3R3N | 3.3 | 30% | 100KHz | 0.014 | 8.80 | 7.40 | 10.310.34.0 |
| SDRH104R-3R8N | 3.8 | 30% | 100KHz | 0.018 | 8.80 | 7.40 | 10.310.34.0 |
| SDRH104R-4R7N | 4.7 | 30% | 100KHz | 0.022 | 7.00 | 6.00 | 10.310.34.0 |
| SDRH104R-5R2N | 5.2 | 30% | 100KHz | 0.022 | 7.00 | 6.00 | 10.310.34.0 |
| SDRH104R-6R8N | 6.8 | 30% | 100KHz | 0.027 | 6.60 | 5.30 | 10.310.34.0 |
| SDRH104R-8R2N | 8.2 | 30% | 100KHz | 0.030 | 6.00 | 4.80 | 10.310.34.0 |
| SDRH104R-100N | 10 | 30% | 100KHz | 0.035 | 5.60 | 4.50 | 10.310.34.0 |
| SDRH104R-150N | 15 | 30% | 100KHz | 0.050 | 4.40 | 3.70 | 10.310.34.0 |
| SDRH104R-220M | 22 | 20% | 100KHz | 0.073 | 3.60 | 2.80 | 10.310.34.0 |
| SDRH104R-330M | 33 | 20% | 100KHz | 0.093 | 2.90 | 2.60 | 10.310.34.0 |
| SDRH104R-470M | 47 | 20% | 100KHz | 0.128 | 2.44 | 2.30 | 10.310.34.0 |
| SDRH104R-560M | 56 | 20% | 100KHz | 0.185 | 2.18 | 1.75 | 10.310.34.0 |
| SDRH104R-680M | 68 | 20% | 100KHz | 0.213 | 2.08 | 1.68 | 10.310.34.0 |
| SDRH104R-820M | 82 | 20% | 100KHz | 0.275 | 1.88 | 1.48 | 10.310.34.0 |
| SDRH104R-101M | 100 | 20% | 100KHz | 0.304 | 1.66 | 1.42 | 10.310.34.0 |
| SDRH104R-151M | 150 | 20% | 100KHz | 0.506 | 1.40 | 1.15 | 10.310.34.0 |
| SDRH104R-221M | 220 | 20% | 100KHz | 0.756 | 1.19 | 0.88 | 10.310.34.0 |
| SDRH104R-331M | 330 | 20% | 100KHz | 1.090 | 0.92 | 0.66 | 10.310.34.0 |
| SDRH104R-471M | 470 | 20% | 100KHz | 1.476 | 0.65 | 0.59 | 10.310.34.0 |
| SDRH104R-681M | 680 | 20% | 100KHz | 2.100 | 0.54 | 0.50 | 10.310.34.0 |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | A: sectional area of terminal A8mm2 force5N time:30sec; 8mm2| Reference documents: GB/T 2423.60-2008; Solder the inductor to the testing jig using leadfree solder. Then apply a force in the Keep time: 101s Speed: 1.0mm/s. | |
| Terminal Strength (DIP) | Terminal diameter(d) mm 0.35d 0.50 Applied force:5N Duration: 10sec; Terminal diameter(d) mm 0.50d 0.80 Applied force:10N Duration: 10sec; Terminal diameter(d) mm 0.80d 1.25 Applied force:20N Duration: 10sec; Terminal diameter(d) mm D 1.25 Applied force:40N Duration: 10sec; Meet the above requirements without any loose terminal. | Reference documents: GB/T 2423.60-2008; Pull Force:the force shall be applied gradually to the terminal and then maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage; Shown in diagram; Flexure: 2mm; Pressurizing Speed: 0.5mm/sec; Keep time: 30 sec. | JIS C 5321:1997; Solder the inductor to the test jig (glass epoxy board) using a leadfree solder. Then apply a force in the direction shown. |
| Dropping | No case deformation or change in appearance; No short and no open. | Reference documents: GB/T 2423.7-2018; Drop the packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | No visible mechanical damage; Wetting shall exceed 75% coverage for 3; Terminals must have 95% minimum solder coverage | Reference documents: GB/T 2423.28-2005; Solder temperature:2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol in weight |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Reference documents: GB/T 2423.10-2019; Solder the inductor to the testing jig (glass epoxy board) using leadfree solder; The inductor shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz; The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10%.(Mn-Zn: Within 30% ); Q factor change: Within 20%. | Reference documents: GB/T 2423.22-2012 Method Na; Start at ( 85~125) for T time, rush to (-55~40) for T time as one cycle, go through 100 cycles; Transforming interval: Max. 20 sec; Tested cycle: 100 cycles; The chip shall be stabilized at normal condition for 1~2 hours |
| Low temperature Storage | No visible mechanical damage; Inductance change: Within 10%.(Mn-Zn: Within 30% ); Q factor change: Within 20%. | Reference documents: GB/T 2423.1-2008 Method Ab; Temperature:M(-55~-402); Duration: 962 hours; The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| High temperature Storage | No visible mechanical damage; Inductance change: Within 10%.(Mn-Zn: Within 30% ); Q factor change: Within 20%. | Reference documents: GB/T 2423.2-2008 Method Bb; Temperature:N(125~852); Duration: 962 hours; The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10%.(Mn-Zn: Within 30% ); Q factor change: Within 20%. | Reference documents: GB/T 2423.3-2016; Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours; The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10% (Mn-Zn: L/L30% ); Q/Q30% SMD series only; DCR/DCR10% | Reference documents: GJB 360B-2009; Refer to the reflow curve and go through the reflow for twice; The peak temperature : 260+0/-5 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Reference documents: IEC 68-2-45:1993; To dip parts into IPA solvent for 50.5Min, then drying them at room temp for 5Min, at last, to brushing making 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire; The characteristic is normal after test | Reference documents: JIS C5311-6.13; Apply twice as rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown; The characteristic is normal after test | Reference documents: MIL-STD-202G Method 301; For parts with two coils; DC1000V, Current: 1mA, Time: 1Min; Refer to catalogue of specific products |
Recommended reflow soldering curve
The recommended reflow conditions are set according to our soldering equipment. Due to various manufacturers having different reflow soldering equipment, products, process conditions, set methods, etc., please adjust and confirm according to user's environment/equipment when setting the reflow conditions.
Reminders for Using These Products
- Storage: Store within 12 months under conditions of 5~40C and 35~65% RH. Exceeding this period may degrade terminal solderability.
- Environment: Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that can inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals excessively to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Always preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating (temperature rise) when power is applied, ensuring sufficient thermal design margins.
- Non-Magnetic Shield Type: For non-magnetic shield types, careful coil placement on the PCB is required to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina