High Precision LanTu Micro SDRI125-331MT Shielded SMD Power Inductors for Portable Communication Equipment
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Product Description
Product Overview
The SDRI125 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DCR. Featuring a closed magnetic circuit to minimize leakage, these inductors offer high-precision dimensions suitable for automatic mounting. They are available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards. Ideal for DC/DC converters and power supplies in VTRs, LCD televisions, notebook PCs, and portable communication equipment.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Origin: SHENZHEN, CHINA
- Product Series: SDRI125
- Type: Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Magnetic Circuit Design: Closed magnetic circuit
- Mounting Type: SMD (Surface Mount Device)
- Environmental Compliance: RoHS, Halogen Free, REACH
Technical Specifications
General Specifications
| Attribute | Value | Notes |
|---|---|---|
| Operating Temperature | -40 to +125 | Includes coil self-temperature rise |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent | |
| Test Equipment (Current) | HP4284+42841A or equivalent | |
| Test Equipment (Q Factor) | HP4285A or equivalent | |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification Example: SDRI 125 470 M T
| Component | Description |
|---|---|
| SDRI 125 | Type (Shielded SMD Power Inductors) and Series (125) |
| 470 | Inductance Value (e.g., 47 H) |
| M | Inductance Tolerance (e.g., 20%) |
| T | Packing Type (Tape & Reel) |
Available Inductance Tolerances: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Available Packing Types: B (Bulk Package), T (Tape & Reel)
External Dimensions (LWH): 12.3 12.3 6.0 mm (for 125 series)
Electrical Characteristics (SDRI125 Series at 25)
| Part No. | Inductance (H) @ 0A | Tolerance | Test Freq (L) | Q Factor Min | Test Freq (Q) | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|---|
| SDRI125-1R0N | 1.0 | 30% | 100KHz | 20 | 1MHz | 0.010 | 15.80 | 8.00 |
| SDRI125-2R2N | 2.2 | 30% | 100KHz | 20 | 1MHz | 0.014 | 13.50 | 7.80 |
| SDRI125-2R4N | 2.4 | 30% | 100KHz | 20 | 1MHz | 0.014 | 12.00 | 7.50 |
| SDRI125-3R3N | 3.3 | 30% | 100KHz | 20 | 1MHz | 0.017 | 10.50 | 6.80 |
| SDRI125-4R7N | 4.7 | 30% | 100KHz | 30 | 1MHz | 0.020 | 9.50 | 5.60 |
| SDRI125-5R8N | 5.8 | 30% | 100KHz | 30 | 1MHz | 0.021 | 8.60 | 5.20 |
| SDRI125-8R2N | 8.2 | 30% | 100KHz | 30 | 1MHz | 0.023 | 7.00 | 4.40 |
| SDRI125-100N | 10 | 30% | 100KHz | 35 | 1MHz | 0.025 | 6.50 | 4.00 |
| SDRI125-120M | 12 | 20% | 100KHz | 35 | 1MHz | 0.027 | 6.00 | 3.50 |
| SDRI125-150M | 15 | 20% | 100KHz | 35 | 1MHz | 0.030 | 5.40 | 3.30 |
| SDRI125-180M | 18 | 20% | 100KHz | 35 | 1MHz | 0.034 | 4.90 | 3.00 |
| SDRI125-220M | 22 | 20% | 100KHz | 35 | 1MHz | 0.036 | 4.70 | 2.80 |
| SDRI125-270M | 27 | 20% | 100KHz | 35 | 1MHz | 0.051 | 4.00 | 2.30 |
| SDRI125-330M | 33 | 20% | 100KHz | 35 | 1MHz | 0.057 | 3.58 | 2.10 |
| SDRI125-390M | 39 | 20% | 100KHz | 35 | 1MHz | 0.068 | 3.30 | 2.00 |
| SDRI125-470M | 47 | 20% | 100KHz | 35 | 1MHz | 0.075 | 3.20 | 1.80 |
| SDRI125-560M | 56 | 20% | 100KHz | 35 | 1MHz | 0.110 | 2.80 | 1.70 |
| SDRI125-680M | 68 | 20% | 100KHz | 35 | 1MHz | 0.120 | 2.50 | 1.50 |
| SDRI125-820M | 82 | 20% | 100KHz | 35 | 1MHz | 0.140 | 2.30 | 1.40 |
| SDRI125-101M | 100 | 20% | 100KHz | 40 | 0.796MHz | 0.160 | 1.90 | 1.30 |
| SDRI125-121M | 120 | 20% | 100KHz | 40 | 0.796MHz | 0.170 | 1.80 | 1.10 |
| SDRI125-151M | 150 | 20% | 100KHz | 40 | 0.796MHz | 0.230 | 1.70 | 1.00 |
| SDRI125-181M | 180 | 20% | 100KHz | 40 | 0.796MHz | 0.290 | 1.60 | 0.90 |
| SDRI125-221M | 220 | 20% | 100KHz | 40 | 0.796MHz | 0.400 | 1.45 | 0.80 |
| SDRI125-271M | 270 | 20% | 100KHz | 40 | 0.796MHz | 0.460 | 1.20 | 0.75 |
| SDRI125-331M | 330 | 20% | 100KHz | 40 | 0.796MHz | 0.510 | 1.15 | 0.68 |
| SDRI125-391M | 390 | 20% | 100KHz | 40 | 0.796MHz | 0.690 | 1.10 | 0.65 |
| SDRI125-471M | 470 | 20% | 100KHz | 40 | 0.796MHz | 0.770 | 0.94 | 0.58 |
| SDRI125-561M | 560 | 20% | 100KHz | 40 | 0.796MHz | 0.860 | 0.90 | 0.54 |
| SDRI125-681M | 680 | 20% | 100KHz | 40 | 0.796MHz | 1.200 | 0.70 | 0.48 |
| SDRI125-821M | 820 | 20% | 100KHz | 40 | 0.796MHz | 1.340 | 0.55 | 0.40 |
| SDRI125-102M | 1000 | 20% | 100KHz | 40 | 0.796MHz | 1.530 | 0.44 | 0.35 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Recommended Land Pattern Dimensions (mm)
| Part No. | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SDRI125 | 12.5 Max | 12.5 Max | 6.0 Max | 5.0 | 7.6 | 2.9 | 7.0 | 5.4 |
Packaging Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension H (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRI125 | 24 | 16 | 11.5 | 24.4 | 100 | 13 | 330 | 500 | 1000 | 4000 |
Cover Tape Peel Off Condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. Force applied gradually and maintained for 101s at 1.0mm/s speed. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pulling test based on GB/T 2423.60-2008. Applied force varies with terminal diameter (5N to 40N) for 10 sec. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop packaged products from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Simple harmonic motion, 10 to 55 Hz, 1.5mm amplitude for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402 for 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852 for 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602, Humidity: 90% to 95% RH for 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | GJB 360B-2009. Reflow soldering twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment and process. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, at 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Allow sufficient thermal design margin as components self-heat when powered on.
- Layout (Non-Shielded): For non-magnetic shielded types, careful coil layout is required to prevent malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina