Shielded SMD Power Inductor LanTu Micro SDRI127-6R8NT with Wide Inductance Range and RoHS Compliance
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Product Description
Product Overview
The SDRI127 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. These inductors feature a high saturation current, low DC resistance, and a closed magnetic circuit design to minimize leakage. Their highly accurate dimensions ensure suitability for automatic mounting. Available in various package sizes and a wide inductance range, they comply with RoHS, Halogen Free, and REACH standards. Ideal for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO
- Origin: SHENZHEN
- Product Series: SDRI127 Series
- Certifications: RoHS, Halogen Free, REACH Compliance
- Core Design: Closed magnetic circuit
Technical Specifications
General Specifications:
| Item | Specification |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| External Dimensions (LWH) | 12.5 12.5 8.0 mm |
Product Identification:
SDRI 127 470 M T
- Type: SDRI (Shielded SMD Power Inductors)
- Outer Dimensions: 127 (12.512.58.0 mm)
- Inductance: e.g., 470 (47 H)
- Inductance Tolerance: M (20%)
- Packing: T (Tape & Reel)
Electrical Characteristics:
| Part No. | Inductance (H) @ 0A | Tolerance | Test Freq. Min | Test Freq. (MHz) | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SDRI127-1R0N | 1.0 | 30% | 100KHz | 1 | 0.009 | 26.00 | 10.00 |
| SDRI127-2R2N | 2.2 | 30% | 100KHz | 1 | 0.012 | 21.00 | 8.00 |
| SDRI127-2R7N | 2.7 | 30% | 100KHz | 1 | 0.013 | 19.00 | 8.00 |
| SDRI127-3R3N | 3.3 | 30% | 100KHz | 1 | 0.013 | 16.00 | 8.00 |
| SDRI127-3R9N | 3.9 | 30% | 100KHz | 1 | 0.013 | 14.00 | 7.50 |
| SDRI1274R7N | 4.7 | 30% | 100KHz | 1 | 0.016 | 12.00 | 6.80 |
| SDRI127-6R1N | 6.1 | 30% | 100KHz | 1 | 0.018 | 11.50 | 6.60 |
| SDRI127-6R8N | 6.8 | 30% | 100KHz | 1 | 0.019 | 10.50 | 6.60 |
| SDRI127-7R6N | 7.6 | 30% | 100KHz | 1 | 0.020 | 10.00 | 5.90 |
| SDRI127-8R2N | 8.2 | 30% | 100KHz | 1 | 0.020 | 9.50 | 5.60 |
| SDRI127-100N | 10 | 30% | 100KHz | 1 | 0.021 | 9.00 | 5.40 |
| SDRI127-120M | 12 | 20% | 100KHz | 1 | 0.240 | 8.50 | 4.90 |
| SDRI127-150M | 15 | 20% | 100KHz | 1 | 0.027 | 8.00 | 4.50 |
| SDRI127-180M | 18 | 20% | 100KHz | 1 | 0.039 | 7.50 | 3.90 |
| SDRI127-220M | 22 | 20% | 100KHz | 1 | 0.043 | 7.00 | 3.60 |
| SDRI127-270M | 27 | 20% | 100KHz | 1 | 0.046 | 6.50 | 3.40 |
| SDRI127-330M | 33 | 20% | 100KHz | 1 | 0.065 | 5.50 | 3.00 |
| SDRI127-390M | 39 | 20% | 100KHz | 1 | 0.072 | 5.00 | 2.75 |
| SDRI127-470M | 47 | 20% | 100KHz | 1 | 0.100 | 4.60 | 2.50 |
| SDRI127-560M | 56 | 20% | 100KHz | 1 | 0.110 | 4.40 | 2.35 |
| SDRI127-680M | 68 | 20% | 100KHz | 1 | 0.140 | 4.00 | 2.10 |
| SDRI127-820M | 82 | 20% | 100KHz | 1 | 0.160 | 3.80 | 1.95 |
| SDRI127-101M | 100 | 20% | 100KHz | 0.796 | 0.220 | 3.50 | 1.70 |
| SDRI127-121M | 120 | 20% | 100KHz | 0.796 | 0.250 | 3.00 | 1.60 |
| SDRI127-151M | 150 | 20% | 100KHz | 0.796 | 0.280 | 2.70 | 1.42 |
| SDRI127-181M | 180 | 20% | 100KHz | 0.796 | 0.350 | 2.50 | 1.30 |
| SDRI127-221M | 220 | 20% | 100KHz | 0.796 | 0.390 | 2.00 | 1.16 |
| SDRI127-271M | 270 | 20% | 100KHz | 0.796 | 0.560 | 1.95 | 1.06 |
| SDRI127-331M | 330 | 20% | 100KHz | 0.796 | 0.640 | 1.90 | 0.95 |
| SDRI127-391M | 390 | 20% | 100KHz | 0.796 | 0.700 | 1.65 | 0.88 |
| SDRI127-471M | 470 | 20% | 100KHz | 0.796 | 0.980 | 1.50 | 0.79 |
| SDRI127-561M | 560 | 20% | 100KHz | 0.796 | 1.070 | 1.40 | 0.73 |
| SDRI127-681M | 680 | 20% | 100KHz | 0.796 | 1.460 | 1.30 | 0.67 |
| SDRI127-821M | 820 | 20% | 100KHz | 0.796 | 1.640 | 1.10 | 0.60 |
| SDRI127-102M | 1000 | 20% | 100KHz | 0.796 | 1.820 | 1.00 | 0.55 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Dimensions (mm):
| Part No. | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SDRI127 | 12.5 Max | 12.5 Max | 8.0 Max | 5.0 | 7.6 | 2.9 | 7.0 | 5.4 |
Recommended Land Pattern:
[Image Placeholder for Land Pattern]
Packaging:
| Part No. | Tape Dimension W | Tape Dimension P | Tape Dimension H | Reel Dimensions A | Reel Dimensions B | Reel Dimensions C | Reel Dimensions D | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRI127 | 24 | 16 | 11.5 | 24.4 | 100 | 13 | 330 | 500 | 1000 | 4000 |
Cover Tape Peel Off Condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. Force applied gradually and maintained for 101s at 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pull force application based on terminal diameter (GB/T 2423.60-2008). Force maintained for 10 sec. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Packaged products dropped from 1m high. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Simple harmonic motion, 10 to 55 Hz, 1.5mm amplitude. Applied for 2 hours in 3 perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature change between 85~125 and -55~40. Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: 30%). Q/Q30%. DCR/DCR10%. | GJB 360B-2009. Peak temperature: 260+0/-5. Performed twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristic is normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristic is normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve:
[Image Placeholder for Reflow Soldering Curve]
Reminders for Using These Products:
- Storage period is within 12 months under conditions: temperature 5~40C, humidity 35~65% RH or less.
- Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions affecting soldering.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to prevent short circuits, performance degradation, or lifespan reduction.
- Allow sufficient margin for thermal design due to self-heating when power is on.
- For non-magnetic shield types, carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina